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IEEE Transactions on Components Packaging and Manufacturing Technology cover

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3
Papers230
Citations8042
Journal Papers 230
Publication Date
A Compact D-Band Cavity-Backed Slot Antenna in Package (AiP) Implemented on Low-Cost Organic Substrate
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deleteLin, Yi-Ting; Kuo, Hung-Chun; Wu, Po-, I; Jhong, Ming-Fong; Wang, Chen-Chao; Hung, Chih-Pin; Wu, Tzong-Lin
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In Memoriam Dr. William ChenA Visionary Architect of the Microelectronics Community
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deleteMahajan, Ravi; Iyer, Subramanian; Wu, Tien; Bottoms, Bill; Manning, Denise; Suhling, Jeff; Thompson, Patrick; Macleod, Patricia; Sammakia, Bahgat; Xue, Jie; Ramakrishna, Koneru; Helmy, Amr; Grupen-Shemansky, Melissa; da Silva, Mark; Chan, Benson; Swaminathan, Madhavan; Pearsall, Kitty; Hsu, Rockwell; Bakir, Muhannad; Joshi, Yogendra; Beyene, Wendem; Cheng, H. C.; Shalf, John; Bailey, Christopher; Schutt-Aine, Jose; Subbarayan, Ganesh; Lee, Timothy; Refai-Ahmed, Gamal; Poliks, Mark; McCluskey, Patrick; Chen, Jun; Li, Ou; Han, Bongtae
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Thin-Film IPD Compact High-Performance Bandpass Filter for 5G Communication
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PREAI
deleteLiu, Gan; Xing, Mengjiang; Yang, Xiaodong; Yang, Zhiqing; Li, Xiaozhen; He, Fa
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Thin Metal Layer Boundary Conditions for Arrayed Structures and Passive Devices
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PREAI
deleteWang, Yi-Yao; Zhan, Qiwei; Zhang, Haoxuan; Wang, Yin-Da; Li, Erji; Feng, Haoqiang; Sun, Bozhao; Yin, Wen-Yan
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Arc Cooling by an External Magnetic Field in Low-Voltage DC Switching
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PREAI
deleteYan, Mingli; Nan, Jing; Golosnoy, Igor O.; Chen, George; Sharkh, Suleiman M.; Mcbride, John W.
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RF Characterization and Performance Analysis of Aerosol Jet-Printed Coplanar Waveguides on HPFS Glass Substrates for High-Frequency Applications
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PREAI
deleteAlshaibani, W. T.; Alzanina, Mousa; Umar, Ashraf; Obeidat, Abdullah S.; Al-Haidari, Riadh; Shamsian, Olya Noruz; Alhendi, Mohammed; Schadt, Mark; Cadwell, Ryan; Kim, Cheolbok; Ng'oma, Anthony; Poliks, Mark
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High Reliability and Low Thermal Resistance Spacer Based on Via-DPC for Double-Side Cooling Module
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PREAI
deleteZhang, Chi; Chen, Cai; Liu, BaiHan; Yan, Yiyang; Lv, Jianwei; Liu, Jiaxin; Kang, Yong
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A Novel 60-92.5 GHz Ultra-Broadband Bonding Wire Interconnect Technology With DGS
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PREAI
deleteLiu, Weihong; Guo, Yiyong; Qu, Zhiyuan; Ju, Tianxi; Tian, Fengyan; Du, Jialun; Li, Chen; Zhang, Jiajie; Wei, Jiacheng
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Hot-Press Sintering of Copper Particles: An Effective Approach for Low-Resistivity Repair of Open Defects in Precision Circuits
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PREAI
deleteYe, Changlong; Ma, Dongchang; Lu, Junyi; Wang, Wenzhe; Liu, Huitao; Wan, Kang; Yang, Guannan; Zhang, Yu; Huang, Guanghan; Cui, Chengqiang
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Abrupt-Change Behaviors of Passive Intermodulation of Coaxial Connections Considering the Memory Effect of Electrical Contact
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PREAI
deleteZhang, Yuxin; Zhang, Songchang; Dang, Zuohong; Lei, Jie; Li, Yan; Ye, Zhen; Feng, Zhiguo; Zhao, Xiaolong; Chen, Xiong; He, Yongning
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