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Materials Science in Semiconductor Processing cover

Materials Science in Semiconductor Processing

IF4.6
Papers10161
Citations21639
Journal Papers 10047
Publication Date
Terahertz nondestructive evaluation of heterogeneous packaging stackup: Multi-layer interposer
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deleteHaolian Shi; Christopher Blancher; Meghna Narayanan; Pragna Bhaskar; Erwan Emile; Mohanalingam Kathaperumal; Alexandre Locquet; D.S. Citrin
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Removal of CeO2 particles for SiO2/Si3N4 post-CMP with composite cleaning solution: Performance and synergistic mechanism
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deleteWenyue Qi; Xinyu Han; Baimei Tan; Jiaji Geng; Fangyuan Wang; Xinyu Zhao; Jiadong Zhao
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Integrated experimental-numerical characterization of thickness and loading condition effects on mechanical properties in copper thin films
delete2026-10-04
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deleteDao Kun Lim; Derik Rudd; Kian Guan Khoo; Daijun Hu; Fa Xing Che; Venkata Rama Satya Pradeep Vempaty; Wen How Sim; Harjashan Veer Singh; Wentao Yan; Yeow Kheng Lim
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Fabrication of Ag2S/g-C3N4 composite and its enhanced acousto-photocatalytic performance for methyl orange degradation
delete2026-10-03
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PREAI
deleteQingwang Liu; Zihan Wang; Wanmeng Gao; Yujie Fan; Guozhi Liang; Xiangjun Ren; Mai Xu
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Coupled mechanical and chemical effects of slurry temperature in DETA-assisted silicon chemical mechanical planarization
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deleteDaehoon Kang; Jongyeong Jeon; Hyeonjeong Lee; Jeewoon Choi; Hyunkyu Kim; Yechan Kim; Wookyung Jeon; Taesung Kim
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SiCl4-based reactive ion etching for controlled low-damage mesa and gate recess formation in β-Ga2O3 MOSFETs
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PREAI
deleteSai GuruKrishna Vadlamudi; Dagmar Gregušová; Kristína Hušeková; Shima Sousani; Alica Rosová; Tibor Izsák; Hemendra Chouhan; Zuzana Pospechová; Ondrej Pohorelec; Milan Ťapajna; Filip Gucmann
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Assessing the electrical properties of cubic silicon carbide by mercury probe measurements
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deleteKushani H. Perera; Gerard Colston; Andrew Graham; Arne Renz; Peter M. Gammon; Marina Antoniou; Vishal A. Shah
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Hardware-intrinsic secure optical communication via bias-gated bipolarity in a MoS2/α-Ga2O3 heterostructure
delete2026-10-02
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PREAI
deleteYunxiang Weng; Gang Wu; Jiangmei Fang; Shuo Jin; Yiming Zhao; Kai Chen; Daoyou Guo
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The impact of dielectric layers deposited at different temperatures on performance and reliability of hydrogen-terminated single-crystal diamond MOSFETs
delete2026-10-02
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deleteChunlei Li; Lingxue Meng; Xu Ma; Hangyu Yue; Xiang Chen; Jiali Zhou; Linhai Guo; Yimin Wan; Li Tian; Xiaoying Zheng
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