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Journal Details
Electronic Materials Letters
IF
2.6
Papers
162
Citations
1876
Related Insights
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Journal Papers
167
Related Insights
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Journal Papers
167
Publication Date
Publication Date
IF
Citations
Nitrogen Plasma-induced Surface Engineering of MnFe Prussian Blue Analogues for Aqueous Zinc-ion Batteries
Electronic Materials Letters
IF
2.6
2026-09-01
0
PRE
AI
Kim, Seunghwan; Kim, Dae-wook; Ahn, In-Kyoung
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Interfacial Engineering of WS2 Thin-Film Transistors via O2 Plasma-Induced WO3-x Buffer Layers
Electronic Materials Letters
IF
2.6
2026-09-01
1
PRE
AI
Lee, Jeonghoon; Seo, Dong Hyun; Seo, Gyeong Deok; Kim, TaeWan
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Metastable Phase in Molybdate XMoO4 (X = Ni, Co, Cu) for Oxygen Evolution Reaction: Structural Phase Dependence
Electronic Materials Letters
IF
2.6
2026-03-01
1
PRE
AI
Jeong, Si Hoon; Lee, Seung Yong; Myung, Nosang Vincent; Lee, Kyu Hyoung
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High-Sensitivity Enzyme-Free Glucose Sensing and Enhanced Photocurrent Response by a Nanoporous CuO and CuO-ZnO Composite
Electronic Materials Letters
IF
2.6
2026-03-01
0
PRE
AI
Yoo, Dayoung; Kim, Minseok; Wang, Jingya; Kim, Shinyoung; Joo, Siyeon; Lee, Dongyun
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Tuning sp3/sp2 Carbon Hybridization to Realize Highly Durable Gas Diffusion Layers (GDLs) for Fuel Cells
Electronic Materials Letters
IF
2.6
2026-03-01
0
PRE
AI
Yu, Tang; Jing, Ge; Yu, Jun-kai; Su, Zhi-peng; Yang, Si-cheng; Liu, Shu-hong; Li, Zhu-xin; Hong, Zhao; Yong, Zhang
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Z-Scheme Charge Transfer in BiOCl/CoWO4 Heterostructures for Enhanced Photocatalytic Removal of Ciprofloxacin and Microplastics
Electronic Materials Letters
IF
2.6
2026-03-01
0
PRE
AI
Huo, Xuanyi; Dong, Yi; Xu, Jingjing; Chen, Mindong
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Composition-Engineered Shape Memory Polymer Stamps for Robust Micro-Transfer Printing of μLEDs
Electronic Materials Letters
IF
2.6
2026-02-01
0
PRE
AI
Chai, Mingi; Tak, Hyun; Kim, Youngmin
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High-Performance High-Entropy Oxide (FeMnAlCrTi)3O4 as a Cathode Material for Aqueous Zinc-Ion Batteries
Electronic Materials Letters
IF
2.6
2026-02-01
1
PRE
AI
Jiang, Renzhi; Cai, Yuncheng; Yan, Dingce
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Radiation-Tolerant Amorphous Indium-Zinc-Tin-Oxide Thin-Film Transistors
Electronic Materials Letters
IF
2.6
2026-02-01
0
PRE
AI
Kang, Dongwon; Jeon, Subin; Ju, Eun Chong; Shin, Jaewon; Nam, Dayul; Kim, Jaehyun; Park, Sung Kyu
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Cobalt Binary Compounds for Advanced Interconnect Materials
Electronic Materials Letters
IF
2.6
2026-02-01
1
PRE
AI
Maeng, Gyungho; Lee, Yeonghun
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Mechanism and Evaluation of Two-Terminal Ferroelectric-Based Memristive/Memcapacitive Devices
Electronic Materials Letters
IF
2.6
2026-02-01
0
PRE
AI
Ahn, Hyeon Jin; Shin, Hyung Jin; Yu, Na Kyung; Yoon, Jung Ho
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Unveiling the Substrate Effect: A Combined Experimental and Simulation Study of Field Emission from Carbon Nanotubes on Stainless Steel and Silicon
Electronic Materials Letters
IF
2.6
2026-02-01
0
PRE
AI
Chen, Jianwei; Zhao, Yike; Guo, Yajie; Feng, Wuwei; Fan, Jiajie; Zhao, Yangyang; Jiang, Jun
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Enhanced Photodetection in Slanted Silicon Nanowire Array via Spin-On-Glass-Based Surface Passivation
Electronic Materials Letters
IF
2.6
2026-02-01
0
PRE
AI
Jang, Hayoung; Kim, Youngmin
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Simple Fabrication and Electrical and Mechanical Characterization of Dumbbell-Like Pillar Structures for Vertical Device Applications
Electronic Materials Letters
IF
2.6
2026-01-01
0
PRE
AI
Hwang, Hae-In; Park, Minji; Park, Ahyun; Lee, Seung-Hun; Ha, Jihun; Yoo, Yeong-Eun; Jeon, Eun-Chae; Kim, Jeong Hwan
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Rational Design of Transition Metal-Based Electrocatalyst Materials for Efficient Urea Oxidation Toward Hydrogen Production and Wastewater Treatment
Electronic Materials Letters
IF
2.6
2026-01-01
1
PRE
AI
Lei, Qian; Cui, Peng; Oh, Seju; Lee, Dong Ki; Kim, Jung Kyu; Choi, Suk Soon
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Integration of Ferroelectric and 2D Materials for Next-Generation High-performance Electronics
Electronic Materials Letters
IF
2.6
2026-01-01
0
PRE
AI
Heo, Jun Hoe; Park, Ji Min; Jang, Ho Won
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Effects of the Dielectric Curing Temperature on the Interfacial Adhesion Characteristics of Photosensitive Polyimide/Cu RDL Structures for Fan-Out Packages
Electronic Materials Letters
IF
2.6
2026-01-01
1
PRE
AI
Kim, Doheon; Kim, Gahui; Jeong, Daeyoon; Park, Young-Bae
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Synergistic Interfacial Engineering with a C60-SB/PFN-Br Hybrid Layer for Suppressing Photocatalytic Degradation in Organic Solar Cells
Electronic Materials Letters
IF
2.6
2026-01-01
0
PRE
AI
Lee, Ah-Yeong; Lee, Seongyu; Sung, Min Jae; Kwon, Soon-Ki; Kim, Yun-Hi; Hong, Soonil; Lee, Jong-Hoon; Lee, Kwanghee
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Morphology Engineering Enables Structural Stability and Kinetics of O3-Na0.87Fe0.5Mn0.5O2 Cathode Material for Sodium-Ion Batteries
Electronic Materials Letters
IF
2.6
2026-01-01
2
PRE
AI
Tan, HaoFeng; Jin, Shan; Meng, JunXia; Chen, ChaoHui; Fu, DeHao; Zhong, YingXiang; Zhang, Qian; Ma, QuanXin
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Research on In-Situ Grown Graphene-Like Coated Copper Powder and Its Conductive Paste
Electronic Materials Letters
IF
2.6
2026-01-01
0
PRE
AI
Zhao, Keliang; Ye, Chengcai; Wang, Qing; Liu, Ze; Rao, Longlai; Wang, Dalin; Liu, Zhenguo
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