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China Electronic Product Reliability And Environmental Testing Research Institute

Scholars136
Papers82
Citations0
Related Papers (73)
Publication Date
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Trace Phosphorus-Modified Hot-Dip Sn Coatings on Cu Substrates: Surface Film Formation and Corrosion Resistance in NaCl Solution
errCoatings
IF2.8
err2026-09-20
err0
errOAAI
errYupeng Wang; Zhuangchao Zhan; Yuheng Han; Hongbo Qin; Jiaqiang Huang; Wangyun Li; Caihang Liang; Lili Wang; Chengxu Lin; Mingzhen Hu; Tianhan Liu
errShare
errSave
Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review
errMaterials
IF3.2
err2026-09-17
err0
errOAAI
errJiahao Liu; Lijin Qiu; Peizhong Wang; Feiyang Wang; Jixi Huang; Hongtao Chen; Hao Zhao; Fangzhou Chen
errShare
errSave
Dynamic Reliability Assessment for Multi-Mode Switch Matrices Incorporating Current Stress and Wear Accumulation
errRELIABILITY ENGINEERING & SYSTEM SAFETY
IF11
err2026-09-17
err0
PREAI
errYan Mai; Ying Zeng; Yuan Chen; Jing Li; Hong-Zhong Huang
errShare
errSave
A stockbridge-damper-shaped triboelectric nanogenerator for transmission line vibration energy harvesting and self-powered frequency monitoring
errSensors and Actuators A-Physical
IF4.9
err2026-08-20
err0
PREAI
errLin Fang; Pinshu Rui; Jin Wu; Jing Wang; Weiliang Zhang; Lei Wang; Yuanjie Fang; Dan Li
errShare
errSave
Multi-view multi-dimensional collaborative completion for node classification with missing attributes
errComplex & Intelligent Systems
IF4.6
err2026-08-01
err0
errOAAI
errXiaomeng Song; Bin Zhou; Yanjiang Wang; Cheng Yuan; Shichang Shang; Lubin Yu
errShare
errSave
Reconciling rheology, stretchability and thermal conductivity in thermal interface materials through dynamic polymer interactions and multimodal filler networks
errJournal of Materials Science & Technology
IF14.3
err2026-07-20
err0
PREAI
errYuanyuan Xiao; Junchao Shangguan; Chunyu Zhang; Zhan Song; Jiahao Liu; Xiaoliang Zeng; Rong Sun
errShare
errSave
Monolithic All-GaN Overtemperature Protection IC Based on GaN-on-Si Technology
errIEEE Sensors Journal
IF4.5
err2026-07-13
err0
PREAI
errZhaoheng Yan; Junbo Wang; Xi Jiang; Xiangdong Li; Liang He; Hao Niu; Song Yuan; Jincheng Zhang; Xiaowu Gong
errShare
errSave
Single and Repetitive Surge Reliability of 1200 V Asymmetric Trench SiC MOSFETs Under Various Gate Biases
errMicromachines
IF3
err2026-07-11
err0
errOAAI
errMenglin Yan; Zhizhe Wang; Dazheng Chen; Yuncong Li; Yongle Zhong; Yuansheng Li; Jun Luo; Hao Xia
errShare
errSave
Research on calibrated and cost-sensitive vulnerability alert governance for open-source software auditing
errArray
IF4.5
err2026-07-06
err0
errOAAI
errXiaorong Feng; Ying Gao; Xin Gu; Zhibin Jian
errShare
errSave
Experiment and simulation of soft error characteristics in 14 nm FinFET and 28 nm SRAMs at 2400m deep underground
errNuclear Engineering and Technology
IF2.6
err2026-06-12
err0
errOAAI
errYufeng Dong; Guoguang Lu; Zhifeng Lei; Chao Peng; Yujuan He; Liping Zou; Wei Ma; Liang Lu; Zhangang Zhang
errShare
errSave
Reagent-free, non-contact quantification of heavy-metal ions in electroplating wastewater via angle-resolved scatterometry
errsensors and actuators b: chemical
IF0
err2026-05-26
err0
PREAI
errYilei Xu; Yichi Pan; Wenze Zhang; Wei Liang; Yunfei Song; Hongxin Ye; Fei Han; Qimeng Sun; Lijie Li; Kang Liang; Chong Shen; Dekun Yang
errShare
errSave
Selective Electrodeposition of Micro-Nano Cu Arrays for Ambient Air Compatible Low Temperature Cu-Cu Bonding with Gradient Nanocrystalline Structure
errJournal of Materials Research and Technology
IF6.6
err2026-05-26
err0
errOAAI
errFengyi Wang; Jinghui Zhang; Jiahao Liu; Yihao Zhang; Xing Fu; Hongtao Chen; Mingyu Li
errShare
errSave
UERR: A unified effective retrieval model for open-source repositories
errJournal of Systems and Software
IF4.1
err2026-05-21
err0
PREAI
errNeng Zhang; Xin Gu; Jianga Shang; Haishen Lei; Chao Liu; Yiwang Huang; Zheng Lin; Bingnan Li
errShare
errSave
Optical Parametric Amplifier-Enabled Wavelength-Tunable Information Management Across IQ Complex Plane
errJournal of Lightwave Technology
IF4.8
err2026-05-21
err0
PREAI
errJiabin Cui; Xuanming Cao; Yanxia Tan; Guo-Wei Lu; Yuefeng Ji; Kunpeng Zhai; Sha Zhu; Jing Xu; Heng Zhou; Zhe Sun; Huashun Wen; Ninghua Zhu
errShare
errSave
Research of growth kinetics of cu/Sn intermetallic compounds in planar and curved cu/Sn diffusion couples
errMaterials Letters
IF2.7
err2026-05-12
err0
PREAI
errJiahao Liu; Jixi Huang; Lijin Qiu; Fangzhou Chen; Hongtao Chen; Yufeng Liu
errShare
errSave
Study on the Characteristics of Trap States Introduced by Pulsed Laser Irradiation in GaN RF HEMT Under Off-State Stress
errMicro and Nanostructures
IF3
err2026-05-07
err0
PREAI
errZhihua Cai; Hao Zhang; Bin Wang; Minjie Zhang; Danmei Lin; Jian Xiang; Xiaoqiang Wang; Xuefeng Zheng; Yue Hao
errShare
errSave
Causal prototype variational information bottleneck framework for cross-domain fault diagnosis
errEngineering Applications of Artificial Intelligence
IF8
err2026-04-25
err0
PREAI
errYu Wang; Chenyu Jiang; Qiang Chen; Shujie Liu; Weiwei Liu
errShare
errSave
Optimal maintenance strategies for deteriorating products with heavy-tailed degradation pattern
errRELIABILITY ENGINEERING & SYSTEM SAFETY
IF11
err2026-04-18
err0
PREAI
errQingqing Zhai; Ziyan Zhao; Guangze Pan
errShare
errSave
Study on the Single-Event Burnout Mechanism of Ka-Band GaN MMIC Power Amplifiers Under Heavy Ion Irradiation
errIEEE Transactions on Electron Devices
IF3.2
err2026-04-14
err0
PREAI
errLi Zhang; Xuefeng Zheng; Danmei Lin; Hao Zhang; Xiaohu Wang; Kang Li; Shunyu Wang; Fang Zhang; Yingzhe Wang; Peipei Hu; Jie Liu; Xiaohua Ma; Yue Hao
errShare
errSave
Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging
errMaterials Letters
IF2.7
err2026-04-02
err0
PREAI
errJiahao Liu; Lijin Qiu; Jixi Huang; Fangzhou Chen; Hongtao Chen; Wenjie Zhou
errShare
errSave