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SaveSolid-state recycling of aluminum chips into high-performance crossover alloys via electroless Cu plating: Oxide elimination and doubled tensile strength
Yu, Yuanping; Zhou, Dengshan; Zhang, Xiuzhen; Yang, Chao; Pan, Hucheng; He, Zhufeng; Hu, Jiaqi; Peng, Zihao; Mohammed, Waleed; Raabe, Dierk; Zhang, Deliang; Qin, Gaowu
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