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G

Guoping Zhang

chinese academy of sciences

49H-index
438Paper Count
7.8KCitation Count
Published Papers 109
Publication Date
Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging
err2026-05-08
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PREAI
errJialin Zhang; Chuanyu Wu; Jie Liu; Shuye Zhang; Tao Wang; Xialei Lv; Jinhui Li; Guoping Zhang; Rong Sun
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Laser-induced gas-assisted debonding in advanced packaging applications
err2026-02-26
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PREAI
errWenbo Zhao; Yalin Zeng; Fangcheng Wang; Qiang Liu; Wenxue Dai; Mingqi Huang; Guoping Zhang; Rong Sun
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Direct preparation of laser-induced doped graphite films on glass surfaces under domain-limiting effect for photonic debonding
err2026-01-17
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PREAI
errWenxue Dai; Fangcheng Wang; Ping He; Huijuan Liu; Chenghao Ma; Qiang Liu; Mingqi Huang; Guoping Zhang; Bingpu Zhou; Rong Sun
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Balancing mechanical and thermal properties in epoxy-based solder resists through polyurethane-polyimide hybrids
err2025-12-04
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PREAI
errJialin Zhang; Wentao Hu; Tao Wang; Xialei Lv; Jinhui Li; Shuye Zhang; Guoping Zhang; Rong Sun
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Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging
err2025-11-23
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PREAI
errChenghao Ma; Fangcheng Wang; Huijuan Liu; Qiang Liu; Wenxue Dai; Mingqi Huang; Guoping Zhang; Rong Sun
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Conformal electromagnetic interference shielding composite film with adaptive liquid metal conductive network for electronic packaging
err2025-10-11
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PREAI
errDingkun Tian; Haorui Zhang; Yong Wang; Siyuan Liao; Yadong Xu; Guoping Zhang; Rong Sun; Yougen Hu
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Silica-assisted cold sintering of diopside for sustainable cementitious composites
err2025-09-23
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PREAI
errWei Huang; Jingjing Yang; Boya Li; Mingjiang Tao; Guoping Zhang; Jian Luo
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Functionalized polyimide reactive macromer enhanced alkali-soluble photosensitive polymer for solder resist material
errPolymer
IF4.5
err2025-06-26
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PREAI
errJialin Zhang; Hangqian Wang; Tao Wang; Xialei Lv; Jinhui Li; Shuye Zhang; Guoping Zhang; Rong Sun
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Domain-limiting effect modulation of laser debonding threshold based on wafer stacking structure for advanced packaging
err2025-04-01
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PREAI
errDai, Wenxue; Zhang, Jieyuan; Wang, Fangcheng; Liu, Qiang; Huang, Mingqi; Wang, Tao; Zhang, Guoping; Zhou, Bingpu; Sun, Rong
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High-reliable polyurethane modified epoxy photosensitive composites for solder resist applications
err2025-01-01
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PREAI
errZhang, Jialin; Tian, Jialin; Wang, Tao; Lv, Xialei; Zhang, Shuye; Li, Jinhui; Zhang, Guoping; Sun, Rong
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Synthesis, evaluation and mechanism study of novel pyrazole enamides to alleviate lung injury
err2025-01-01
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PREAI
errZhang, Guoping; Li, Mengjie; Ou, Yanghui; Ma, Liya; Li, Jiayu; Sun, Kexin; Xia, Tingting; Wang, Jingbo; Song, Liyan; Liu, Yang; Lin, Ran; Yao, Hongliang
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Sufficient manganese supply is necessary for OsNramp5 knockout rice plants to ensure normal growth and less Cd uptake
err2024-12-01
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errOAAI
errShahzad, Muhammad; Peng, Di; Khan, Ameer; Ayyaz, Ahsan; Askri, Syed Muhammad Hassan; Naz, Shama; Huang, Binbin; Zhang, Guoping
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Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips
err2024-11-13
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errOAAI
errZhang, Jieyuan; Hu, Yanlei; Wang, Fangcheng; Liu, Qiang; Niu, Fangfang; Li, Jinhui; Huang, Mingqi; Zhang, Guoping; Sun, Rong
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Self-Adhesive Electronic Skin with Bio-Inspired 3D Architecture for Mechanical Stimuli Monitoring and Human-Machine Interactions
errSMALL
IF12.1
err2024-10-02
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PREAI
errDai, Wenxue; Lei, Ming; Dai, Ziyi; Ding, Sen; Wang, Fangcheng; Fang, Dan; Wang, Rongmei; Qi, Biao; Zhang, Guoping; Zhou, Bingpu
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A strategy for the preparation of low dielectric FGQD/PSPI composite films in wafer-level packaging
err2024-08-01
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PREAI
errWang, Hangqian; Zhang, Jialin; Li, Jinhui; Lv, Xialei; Zhang, Shuye; Zhang, Guoping; Sun, Rong
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Surface Plasmon Transmission Line Based on Folded Stepped Grooves and Spiral-Shaped Structures
err2024-06-04
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PREAI
errCui, Yu-Xin; Zhang, Jing-Yi; Li, Lin; Kong, Yan-Yan; Zhang, Guo-Ping
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