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K

K. N. Tu

City University of Hong Kong

81H-index
651Paper Count
2.3WCitation Count
Published Papers 117
Publication Date
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The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers
errApplied Surface Science
IF6.9
err2025-12-03
err0
errOAAI
errShichen Xie; Zishan Xiong; Ziting Ye; Yuanxing Duan; Fuxin Du; K.N. Tu; Yingxia Liu
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Effects of whey protein isolate heating temperature on formation and stabilization of arabinoxylan-whey protein isolate based Pickering emulsions
errLWT
IF0
err2025-11-04
err0
errOAAI
errRuihong Ge; Jinyang Li; Keyu Tu; Hui Wang
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Influence of temperature on the bonding behavior of GaN on diamond with Ta-Au interlayer: Insights from molecular dynamics simulations
errDiamond and Related Materials
IF5.1
err2025-10-27
err0
PREAI
errShilin Li; Xingyu Chen; Fuchu Liu; Hongyong Jiang; Jianing Li; King-Ning Tu; Qinglei Sun
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Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test
errJournal of Materials Science: Materials in Electronics
IF0
err2025-10-24
err0
errOAAI
errZesheng Shen; Yuxuan An; Yifan Yao; Qinglei Sun; King-Ning Tu; Yingxia Liu
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Piezocatalysis-Enabled High-Efficiency Hydrogen Evolution with Single-Atom Platinum on MoS2 Nanoflowers
errSmall
IF12.1
err2025-10-06
err0
PREAI
errYu-Ming Chen; Yu-Ching Chen; Kuang-Yuan Tu; Yi-Dong Lin; Yan-Gu Lin; Hsun-Yen Lin; Samiksha Bajaj; Jyh Ming Wu
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Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections
errMaterials Characterization
IF5.5
err2025-09-24
err0
PREAI
errShih-Chi Yang; Chi-Hau Wu; Kai-Cheng Shie; King-Ning Tu; Chih Chen
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errSave
PEDOT:PSS-Loaded Gelatin Cryogels for Electrically Controlled Drug Release
errACS Omega
IF4.3
err2025-07-17
err0
errOAAI
errHuai-An Chen; Ching-Yu Lee; Bo-Jun Huang; Kai-Yun Tu; Pei-Hsuan Sung; Le Ngoc Hoang; Ching-Li Tseng
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Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-05-01
err0
errOAAI
errHung, Yu-Wen; La, Mai-Phuong; Lin, Yi-Quan; Tu, K. N.
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Softening-resistant ultra-strong nanotwinned CoCrFeNi medium entropy alloy thin films
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-04-01
err0
PREAI
errWang, Jian-Jie; Tsai, Cheng-Yuan; Chang, Shou-Yi; Tu, King-Ning; Ouyang, Fan-Yi
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Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/ SnAg/Ni/Cu microbumps
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errYang, Shih-Chi; Su, Hung-Chieh; Tu, King-Ning
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Mechanical characterizations of η ′-Cu 6 (Sn, In) 5 intermetallic compound solder joint: Getting prepared for future nanobumps
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-05-01
err3
errOAAI
errMao, Xingchao; An, Yuxuan; Chen, Yang; Zheng, Gong; Hou, Rui; Zhang, Xinyu; Guo, Yuzheng; Liu, Sheng; Tu, King-Ning; Liu, Yingxia
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Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-01-01
err5
errOAAI
errYao, Yifan; An, Yuxuan; Tu, K. N.; Liu, Yingxia
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Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
errNANOMATERIALS
IF4.3
err2023-08-29
err7
errOAAI
errHsu, Wei-You; Yang, Shih-Chi; Lin, You-Yi; Hsieh, Wan-Zhen; Tu, King-Ning; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chiang, Ching-Yu; Chen, Chih
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Electromigration in three-dimensional integrated circuits
errAPPLIED PHYSICS REVIEWS
IF11.6
err2023-05-16
err18
PREAI
errShen, Zesheng; Jing, Siyi; Heng, Yiyuan; Yao, Yifan; Tu, K. N.; Liu, Yingxia
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To suppress thermomigration of Cu-Sn intermetallic compounds in flip-chip solder joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err6
errOAAI
errHuang, Yan-Rong; Tran, Dinh-Phuc; Hsu, Po-Ning; Yang, Shih-Chi; Gusak, A. M.; Tu, K. N.; Chen, Chih
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errSave
Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err3
errOAAI
errYang, Mingkun; Zhao, Xiuchen; Huo, Yongjun; Tu, King-Ning; Liu, Yingxia
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errSave
Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars
errMATERIALS & DESIGN
IF7.9
err2022-12-01
err2
errOAAI
errChen, Yang; Dai, Wenjie; Liu, Yingxia; Chen, Chih; Tu, K. N.; Chen, Guang
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errSave
Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires
errNANO LETTERS
IF9.1
err2022-11-07
err5
PREAI
errWeng, Wei-Lun; Chen, Hsin-Yu; Ting, Yi-Hsin; Chen, Hsin-Yi Tiffany; Wu, Wen-Wei; Tu, King-Ning; Liao, Chien-Neng
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Low temperature interfacial reaction in 3D IC nanoscale materials
errMATERIALS SCIENCE & ENGINEERING R-REPORTS
IF26.8
err2022-10-01
err10
PREAI
errLiu, Yingxia; Lu, Yang; Tu, K. N.
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Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2022-09-01
err3
errOAAI
errHsu, Wei-You; Tseng, I-Hsin; Chiang, Ching-Yu; Tu, K. N.; Chen, Chih
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errSave

Research Directions

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Co-authors
Cooperation Journals
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Dierk Raabe
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杨旸 (Yang Yang)
H-index: 161 · Papers: 715
李菊英 cover
李菊英 (Ju Li)
H-index: 147 · Papers: 1.3K
C
Chun‐Sing Lee
H-index: 140 · Papers: 1.4K
Y
Yu Huang
H-index: 138 · Papers: 518
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