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C

Chih Chen

national yang ming chiao tung university

50H-index
401Paper Count
8.2KCitation Count
Published Papers 148
Publication Date
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High-Strength Nanotwinned Copper Combined with Silicon/Silicon Nitride/Graphite Anode for High-Performance Lithium-Ion Battery
errMaterials
IF3.2
err2026-06-10
err0
errOAAI
errFu-Chian Chen; Rahmandhika Firdauzha Hary Hernandha; Dinh-Phuc Tran; Jeng-Kuei Chang; Chih Chen
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Ultra-high mechanical strength and high electrical conductivity nanotwinned CuPd foils
errJournal of Materials Research and Technology
IF6.6
err2026-05-26
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
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errmaterials science and engineering: a
IF0
err2026-05-22
err0
PREAI
errPo-Jui Su; Kang-Ping Lee; Mai-Phuong La; Chen-Ning Li; Chih Chen
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Recent Advances in Nanostructured Copper: From Fabrication to Applications
errCrystal Growth & Design
IF0
err2026-05-18
err0
errOAAI
errDinh-Phuc Tran; Kang-Ping Lee; Huai-En Lin; Yu-Wen Hung; Mai-Phuong La; Chih Chen
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Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
errApplied Surface Science
IF6.9
err2026-04-02
err0
PREAI
errPin-Syuan He; Hung-Ying Chen; Yun-Wei Chiang; Cheng-Chieh Kao; Bo-Cheng Huang; Guanyu Song; Pengyi Zhang; Wei-Lan Chiu; Mu-Ping Hsu; Kuan-Neng Chen; Chang-Chun Lee; Yu-Lan Liu; Kuang-Yu Chen; Chih Chen
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Effects of plasma surface treatment and surface roughness on Cu–Cu bonding strength
errJournal of Materials Research and Technology
IF6.6
err2026-02-18
err0
errOAAI
errPin-Syuan He; Chih-Hsin Tu; Mai-Phuong La; Chih Chen
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Equ-Axed Fine-Grained and Nanotwinned Cu with Ultrahigh Tensile Strength
errCrystal Growth and Design
IF3.4
err2026-01-26
err0
errOAAI
errChun-Ting Ke; Kang-Ping Lee; Dinh-Phuc Tran; Wen-Jun Chen; Da-Jeng Yao; Chih Chen
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Optimizing Cu-Cu bonding quality in nanotwinned Cu films through plasma-induced surface roughening
errResults in Engineering
IF7.9
err2026-01-26
err0
errOAAI
errMing-Chieh Chen; Jian-Yuan Huang; Chi-Chih Tsai; Shih-Chi Yang; Chih Chen
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Mechanistic insights into direction-modulated electromigration failures and intermetallic formation in symmetric/asymmetric SnAg solder microbumps
errIntermetallics
IF4.8
err2026-01-10
err0
PREAI
errDinh-Phuc Tran; Tzu-Chieh Pan; Shi-Chi Yang; Mai-Phuong La; Chih Chen
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Nanocrystalline copper for thermally efficient Cu-Cu bonding
errJournal of the Taiwan Institute of Chemical Engineers
IF6.3
err2025-12-27
err0
PREAI
errAnkush Kumar; Chih Chen; Nilesh Badwe
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Enhanced strength and thermal stability of nanotwinned Cu-Ni-Fe foils via grain boundary and twin boundary engineering
errJournal of Alloys and Compounds
IF6.3
err2025-12-23
err0
PREAI
errKang-Ping Lee; Pin-Chia Chen; Evan Hsieh; Ming-Han Lu; Mai-Phuong La; Chun-Ting Ke; Po-Jui Su; Chih Chen
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Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures
errMaterials 2026, Vol. 19, Page 36
IF3.2
err2025-12-22
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
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Optimizing mechanical and electrical properties of nanotwinned copper-carbon nanotube composite foils
errJournal of Alloys and Compounds
IF6.3
err2025-12-15
err0
PREAI
errCiao-Yun Luo; Kang-Ping Lee; Mai-Phuong La; Chih-Chi Tsai; Wen-Wei Wu; Chih Chen
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Fabrication and characterization of (111)-oriented nanocrystalline copper for low-temperature Cu-to-Cu bonding
errMaterials Characterization
IF5.5
err2025-11-26
err0
PREAI
errChen-Ning Li; Dinh-Phuc Tran; Kang-Ping Lee; Yu-Tao Yang; Chih Chen
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Impact of microstructure engineering on electromigration resistance of copper redistribution lines
errJournal of Materials Research and Technology
IF6.6
err2025-10-06
err0
errOAAI
errYi-Quan Lin; Yu-Wen Hung; Dinh-Phuc Tran; Chih Chen
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Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections
errMaterials Characterization
IF5.5
err2025-09-24
err0
PREAI
errShih-Chi Yang; Chi-Hau Wu; Kai-Cheng Shie; King-Ning Tu; Chih Chen
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Design strategy and thermal stability characterization of high-strength nanotwinned Cu-Ni foils
errResults in Engineering
IF7.9
err2025-08-16
err0
errOAAI
errKang-Ping Lee; Ming-Han Lu; Dinh-Phuc Tran; Chun-Ting Ke; Pin-Chia Chen; Po-Jui Su; Chih Chen
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Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size
errJournal of Advanced Joining Processes
IF4
err2025-06-01
err0
errOAAI
errDinh-Phuc Tran; Ya-Ting Xiao; Mai-Phuong La; Shi-Chi Yang; Chih Chen
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Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errLu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih
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Revealing challenges of downscaling effects on Cu thermal expansion in advanced hybrid bonding using in-situ AFM
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-04-01
err0
PREAI
errLin, Huai-En; Chiu, Wei-Lan; Chang, Hsiang-Hung; Yang, Yu-Tao; Chen, Chih
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Research Directions

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Co-authors
Cooperation Journals
Y
Yu Huang
H-index: 138 · Papers: 518
E
Emily A. Carter
H-index: 102 · Papers: 718
Q
Qing Zhao
H-index: 84 · Papers: 396
K
K. N. Tu
H-index: 81 · Papers: 651
M
Ming Dao
H-index: 75 · Papers: 269
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