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Pradeep Lall

auburn university system

47H-index
1.1KPaper Count
9.9KCitation Count
Published Papers 23
Publication Date
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errJOURNAL OF ELECTRONIC PACKAGING
IF2.3
err2025-12-01
err0
PREAI
errLall, Pradeep; Kulkarni, Shriram; Miller, Scott
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err2024 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS 2024
IF0
err2024-04-14
err0
PREAI
errLall, Pradeep; Soni, Ved
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err2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
IF0
err2023-05-01
err0
PREAI
errLall, Pradeep; Soni, Ved
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err2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS
IF0
err2023-03-01
err0
PREAI
errLall, Pradeep; Soni, Ved; Sethi, Guneet; Yiang, Kok
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errSave
errJOURNAL OF ELECTRONIC PACKAGING
IF2.3
err2022-12-23
err0
PREAI
errLall, Pradeep; Jang, Hyesoo
errShare
errSave
errieee
IF0
err2022-05-01
err0
PREAI
errLall, Pradeep; Soni, Ved
errShare
errSave
errJOURNAL OF ELECTRONIC PACKAGING
IF2.3
err2022-01-04
err0
PREAI
errLall, Pradeep; Soni, Ved; Miller, Scott
errShare
errSave
errproceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm
IF0
err2021-06-01
err0
PREAI
errLall, Pradeep; Soni, Ved; Miller, Scott
errShare
errSave
errproceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm
IF0
err2021-06-01
err0
PREAI
errLall, Pradeep; Soni, Ved; Narangaparambil, Jinesh; Miller, Scott
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errSave
errproceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm
IF0
err2021-06-01
err0
PREAI
errLall, Pradeep; Soni, Ved; Sethi, Guneet; Yiang, Kok
errShare
errSave
errieee
IF0
err2021-06-01
err1
PREAI
errLall, Pradeep; Soni, Ved; Narangaparambil, Jinesh; Jang, Hyesoo; Miller, Scott
errShare
errSave
errproceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm
IF0
err2021-06-01
err0
PREAI
errLall, Pradeep; Jang, Hyesoo; Soni, Ved; Miller, Scott
errShare
errSave
errproceedings of the sixteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems itherm
IF0
err2021-06-01
err0
PREAI
errLall, Pradeep; Jang, Hyesoo; Soni, Ved; Miller, Scott
errShare
errSave
err2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)
IF0
err2020-06-01
err0
PREAI
errLall, Pradeep; Soni, Ved; Miller, Scott
errShare
errSave
err2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
IF0
err2019-05-01
err2
PREAI
errLall, Pradeep; Abrol, Amrit; Leever, Ben; Miller, Scott
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errSave
err2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)
IF0
err2018-05-01
err13
PREAI
errLall, Pradeep; Abrol, Amrit; Leever, Ben; Marsh, Jason
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errSave
err2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
IF0
err2017-05-01
err21
PREAI
errLall, Pradeep; Zhang, Hao
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errSave
errIEEE ACCESS
IF3.6
err2015-01-01
err26
errOAAI
errLall, Pradeep; Sakalaukus, Peter; Davis, Lynn
errShare
errSave
errIEEE TRANSACTIONS ON RELIABILITY
IF5.7
err2012-12-01
err42
PREAI
errLall, Pradeep; Lowe, Ryan; Goebel, Kai
errShare
errSave
errIEEE TRANSACTIONS ON RELIABILITY
IF5.7
err2012-12-01
err8
PREAI
errLall, Pradeep; Gupta, Prashant; Goebel, Kai
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errSave

Research Directions

No research directions
Co-authors
Cooperation Journals
K
Kai Goebel
H-index: 58 · Papers: 453
R
Robert N. Dean
H-index: 20 · Papers: 192
P
P. K. Gupta
H-index: 20 · Papers: 186
S
Scott Miller
H-index: 15 · Papers: 220
L
Lynn Davis
H-index: 13 · Papers: 110
View more