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Y

Y. C. Chan

City University of Hong Kong

19H-index
75Paper Count
1.3KCitation Count
Published Papers 18
Publication Date
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Monitoring Escherichia coli in Water through Real-Time Loop-Mediated Isothermal Amplification on Biochips
errMICROMACHINES
IF3
err2024-08-31
err2
errOAAI
errWang, Yuxin; Chan, Yun-Sheng; Lee, Eugene; Shi, Donglu; Lee, Chen-Yi; Diao, Jiajie
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Programmable Digital-Microfluidic Biochips for SARS-CoV-2 Detection
errBIOENGINEERING-BASEL
IF3.7
err2023-08-03
err1
errOAAI
errWang, Yuxin; Chan, Yun-Sheng; Chae, Matthew; Shi, Donglu; Lee, Chen-Yi; Diao, Jiajie
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errSave
A Programmable Bio-Chip With Adaptive Pattern-Control Micro-Electrode-Dot-Array
errIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
IF4.9
err2022-11-01
err6
PREAI
errChan, Yun-Sheng; Lee, Chen-Yi
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errSave
A Traveling-Wave Dielectrophoresis Bio-Chip for Cell Manipulation in Standard CMOS Process
errIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
IF4.9
err2022-03-01
err11
PREAI
errChan, Yun-Sheng; Hsu, Ting-Ting; Chen, Yi-Po; Wu, Hsu-Min; Wang, Yun-Ming; Lee, Chen-Yi
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errSave
Rapid Portable Electrical Biosensing Design With Dielectrophoresis and Its Application for Cardiac Biomarker Detection
errIEEE SENSORS JOURNAL
IF4.5
err2020-01-01
err5
PREAI
errChen, Chun-Chi; Chan, Yun-Sheng; Fang, Yu-Hao; Wang, Yun-Ming; Lee, Chen-Yi
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Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
errJOURNAL OF MATERIALS SCIENCE
IF3.9
err2016-08-04
err26
errOAAI
errChen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y. C.; Liu, Changqing; Wu, Fengshun
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The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2010-09-01
err83
PREAI
errGain, Asit Kumar; Fouzder, Tama; Chan, Y. C.; Sharif, A.; Wong, N. B.; Yung, Winco K. C.
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Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction
errACTA MATERIALIA
IF9.3
err2009-10-01
err117
PREAI
errShen, J.; Chan, Y. C.; Liu, S. Y.
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The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2009-01-01
err10
PREAI
errGu, X.; Chan, Y. C.; Yang, D.; Wu, B. Y.
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The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
errAPPLIED PHYSICS LETTERS
IF3.6
err2008-07-30
err22
PREAI
errYang, D.; Chan, Y. C.; Tu, K. N.
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Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application
errOPTICS AND LASERS IN ENGINEERING
IF3.7
err2008-01-01
err18
PREAI
errTan, C. W.; Chan, Y. C.; Leung, Bernard; Liu, H. D.
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Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder Part II. Growth of intermetallic layer with Cu during wetting and aging
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2007-07-01
err65
PREAI
errRizvi, M. J.; Bailey, C.; Chan, Y. C.; Islam, M. N.; Lu, H.
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Study of the thermal stress in a Pb-free half-bump solder joint under current stressing
errAPPLIED PHYSICS LETTERS
IF3.6
err2007-06-07
err11
errOAAI
errWu, B. Y.; Chan, Y. C.; Zhong, H. W.; Alam, M. O.; Lai, J. K. L.
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Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn-In-Ag-Cu solder
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2005-05-01
err23
PREAI
errSharif, A; Chan, YC
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The characterization of the optical functions of BCP and CBP thin films by spectroscopic ellipsometry
errSYNTHETIC METALS
IF4.6
err2005-04-01
err40
PREAI
errLiu, ZT; Kwong, CY; Cheung, CH; Djurisic, AB; Chan, Y; Chui, PC
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errSave
Interfacial reaction phenomena of Sn-Pb solder with Au/Ni/Cu metallization
errCHEMISTRY OF MATERIALS
IF7
err2005-02-10
err12
PREAI
errAlam, MO; Chan, YC
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Depth profiling of vacancy-type defects in homogenous and multilayered a-Si films by positron beam Doppler broadening
errJOURNAL OF NON-CRYSTALLINE SOLIDS
IF3.5
err1998-05-01
err2
PREAI
errZou, X; Webb, DP; Chan, YC; Lam, YW; Hu, YF; Gong, M; Beling, CD; Fung, S
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Sign reversal in transient photoconductivity in the presence of optical bias in undoped homogeneous a-Si:H
errJOURNAL OF NON-CRYSTALLINE SOLIDS
IF3.5
err1998-05-01
err4
PREAI
errWebb, DP; Main, C; Reynolds, S; Bruggemann, R; Chan, YC; Lam, YW
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Research Directions

No research directions
Co-authors
Cooperation Journals
Y
Yongfeng Hu
H-index: 97 · Papers: 765
K
K. N. Tu
H-index: 81 · Papers: 651
A
Aleksandra B. Djurišić
H-index: 76 · Papers: 549
D
Donglu Shi
H-index: 68 · Papers: 587
V
Vadim V. Silberschmidt
H-index: 59 · Papers: 791
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