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SaveHigh-density, nonvolatile SRAM using monolithic 3D integration of InGaZnO thin-film transistors and Hf0.5Zr0.5O2-based ferroelectric capacitors
Liu, Qihan; Li, Yu; Liu, Liwei; Jiang, Hao; Zhu, Haozhe; Chen, Zexing; Yang, Yang; Si, Mengwei; Li, Can; Lin, Peng; Wei, Yingfen; Liu, Qi
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SaveFPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer
Jiao, Bo; Xu, Lei; Yu, Xinyu; Yang, Haitao; Zhu, Haozhe; Wang, Yu; Zhu, Jundong; Wen, Dexin; Wang, Lingli; Tao, Jun; Chen, Chixiao; Han, Yinhe; Liu, Qi; Sun, Ninghui; Liu, Ming
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SaveA 28 nm 81 Kb 5995.3 TOPS/W 4T2R ReRAM Computing-in-Memory Accelerator With Voltage-to-Time-to-Digital Based Output
Zhou, Keji; Jia, Xinru; Zhao, Chenyang; Zhang, Xumeng; Wu, Guangjian; Mu, Chen; Zhu, Haozhe; Ding, Yanting; Chen, Chixiao; Xue, Xiaoyong; Zeng, Xiaoyang; Liu, Qi
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