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E

European Microelectronics and Packaging Conference and Exhibition

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论文数3
被引数0
期刊论文 5
发表时间
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Laser Frit Sealing Approach for Ultrathin Glass
delete2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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delete2019-09-01
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PREAI
deleteBedjaoui, M.; Brun, J.; Amiran, J.
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Investigating the Overdischarge Failure on Copper Dendritic Phenomenon of Lithium ion Batteries in Portable Electronics
delete2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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delete2019-09-01
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deleteChen, Chengcheng; He, Guanghui; Cai, Jinbao; Zhao, Zhenbo; Luo, Daojun
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Innovative Authentication Method for IoT Devices
delete2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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delete2019-09-01
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deleteVasile, Daniel C.; Svasta, Paul M.
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Thermosonic wedge -wedge bonding using dosed tool heating
delete2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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Printed Functional Applications: Batteries, Communication E e ents, Antennas and Conductive Paths on Technical Textiles
delete2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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