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International Conference on Electronics Packaging

IF0
论文数2
被引数0
期刊论文 2
发表时间
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Battery less soil moisture sensors for strawberry seedlings
delete2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021)
IF0
delete2021-05-12
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PREAI
deleteKanaya, Haruichi; Takiguchi, Osamu; Uto, Shunsuke; Shimomura, Katsumi
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GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging
delete2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
IF0
delete2019-04-01
delete0
PREAI
deleteBlank, Thomas; Dudek, Volker; Luh, Matthias; Bao Ngoc An; Wurst, Helge; Leyrer, Benjamin; Ishikawa, Dai; Weber, Marc
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