logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
delete
arrow
返回期刊详情
M

Microelectronics International

IF0.8
论文数34
被引数301
期刊论文 34
发表时间
delete
A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms基于机器学习算法的Sn基无铅焊料表面张力预测研究
deleteMicroelectronics International
IF0.8
delete2026-05-01
delete0
PREAI
deleteWu, Min
delete分享
delete收藏
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1客座编辑：可再生能源应用中电力电子组件和系统安全性增强的先进传感与控制技术-第一部分
deleteMicroelectronics International
IF0.8
delete2026-04-10
delete0
PREAI
deleteZhao, Zhaoyang; Zhang, Jun; Wei, Xinwei; Sui, Xin
delete分享
delete收藏
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability级联H桥变换器型BESS的双模虚拟惯量与阻尼控制方案及其增强频率支持能力
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteYu, Haolin; Liu, Huiqiao; Cao, Huanxi; Jin, Yu; Lu, Wenbiao; Xiao, Qian; Mu, Yunfei; Jia, Hongjie
delete分享
delete收藏
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice氮化铝缓冲层在高电子迁移率晶体管应用中的研究综述：生长技术与衬底选择
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteSalsabiila, Natasya; Nayan, Nafarizal; Azman, Zulkifli; Bakri, Anis Suhaili; Abu Bakar, Ahmad Shuhaimi; Adriyanto, Feri
delete分享
delete收藏
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide可重构液晶全息天线的慢波矩形波导馈电设计
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteZhang, Tao; Zou, Danqing; Meng, Fan-Yi; Wang, Yuxin; Sun, Hongpeng; Fu, Jia-Hui; Ding, Chang
delete分享
delete收藏
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions - a critical review硅光子封装技术应用于人工智能数据中心：技术挑战、可靠性要求及未来发展方向——一项综述
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteGan, Chong Leong; Chung, Min-Hua; Huang, Chen-Yu
delete分享
delete收藏
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling基于多物理场耦合的压接式IGBT器件门极引脚应力弛豫分析
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteWang, Yuqi; Yao, Ran; Li, Hui; Lai, Wei; Yuan, Wenqian; Ji, Yirun; Huai, Qing; Yuan, Xi; Jie, Ziyao
delete分享
delete收藏
Stress-strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loadingCSP焊点在耦合拉伸和剪切载荷下的应力-应变分析与形貌参数优化
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Xiaobin; Huang, Chunyue; Yang, Jinmei
delete分享
delete收藏
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm基于NSGA-II算法的叠层BGA焊点功率循环应力和回波损耗的双目标优化
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Xianjia; Huang, Long; Huang, Chunyue; Chen, Yonglin; Liang, Ying; Gao, Chao; Wu, Liye; Cao, Zhiqin
delete分享
delete收藏
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder jointsSn58Bi改性Sn1.0Ag0.5Cu/Cu焊点的微观结构和力学性能
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Yun-Xin; Zhang, Liang; Chen, Yu-Hao; Zhang, Jia-Min; Chen, Mo; Liu, Tao; Shi, Lei
delete分享
delete收藏
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power远海海上风电轻型输电系统的比较可靠性评估
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteWang, Yanfeng; Peng, Sui; Fu, Yan; He, Lingfeng; Huang, Jun; Yang, Lingyun; Huang, Zhicong
delete分享
delete收藏
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters基于界面转换器实时运行数据的锂离子电池在线电化学阻抗谱测量
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteYang, Juefei; Wang, Yunfei; Mo, Ze; Ouyang, Liangxuan; Zhang, Qingyu; Fang, Yan; Zhao, Zhaoyang
delete分享
delete收藏
Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads互金属化合物对热循环载荷下无铅焊点可靠性的影响研究
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteYang, Xuexia; Zhu, Miao; Sun, Yanxi; Lin, Jinbao; Hao, Xin; Shu, Xuefeng; Xiao, Gesheng
delete分享
delete收藏
Heat dissipation performance of solid-state drives under convective cooling: analyzing the impact of heat sink fin spacing固态硬盘在对流冷却下的散热性能：分析散热片翅片间距的影响
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteApalowo, Rilwan Kayode; Abas, Aizat; Bin Salim, Muhammad Razin; Famuyiwa, Samuel Olusina; Kok, Chia Siang
delete分享
delete收藏
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback基于自适应q轴电压反馈的构网型逆变器暂态稳定性提升策略
deleteMicroelectronics International
IF0.8
delete2026-01-01
delete0
PREAI
deleteJiang, Kezheng; Ao, Yuqi; Zhao, Yifan; Xiong, Ping; Ding, Hao; Zhou, Yi
delete分享
delete收藏
Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics金涂层银和传统金丝在半导体键合中的应用比较分析：微电子中的材料性能及腐蚀敏感性
deleteMicroelectronics International
IF0.8
delete2026-01-01
delete0
PREAI
deleteSundararajan, Muralidharan; Devarajan, Mutharasu; Azahar, Ahmad Zarif; Mong, Derek
delete分享
delete收藏
Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems (DEC, 10.1108/MI-07-2025-0122, 2025)可再生能源系统中多个逆变器之间的超谐波耦合分析与建模 (DEC, 10.1108/MI-07-2025-0122, 2025)
deleteMicroelectronics International
IF0.8
delete2025-12-01
delete1
PREAI
deleteLi, S.; Xu, Y.; Wang, S.; Wang, H.; Li, B.
delete分享
delete收藏
Novel bipolar output high step-up sepic DC/DC converter with parasitical parameters self-balance新型双极性输出高升压SEPIC DC/DC变换器，具有寄生参数自平衡特性
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-12-01
delete0
PREAI
deleteAi, Jian; Wu, Zhichao; Bi, Kaitao; Fan, Qigao; Yan, Wenxu; Qiu, Yue; Dai, Sichu; Qian, Lei; Ai, Jingcheng; Wang, Canmin; Han, Yuelong
delete分享
delete收藏
Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration晶圆级封装集成LPDDR5X信号完整性设计与仿真探索
deleteMicroelectronics International
IF0.8
delete2025-12-01
delete0
PREAI
deleteTang, Wenxue; Ji, Yong; Zhou, Liyan; Bai, Yufei; Zhu, Yuan; Yang, Cheng; Wang, Gang; Wang, Chengqian
delete分享
delete收藏
Fluorine implantation for nanostructured silicon Zener diodes: a study on electrical characterization and reliability氟离子注入纳米结构硅齐纳二极管：电学特性与可靠性研究
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-11-01
delete0
PREAI
deleteLee, Sai Link; Packeer Mohamed, Mohamed Fauzi; Tan, Chan Lik
delete分享
delete收藏