logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
arrow
返回期刊详情
J

Journal of Electronic Packaging

IF2.3
论文数50
被引数1955
期刊论文 50
发表时间
delete
Influence of Boundary Conditions and Component Placement on Lifetime of Printed Circuit Board Assemblies Under Vibration Loading: XGBoost and Stochastic Gradient Boosting Analysis With SHAP Interpretation振动载荷下边界条件和元件布局对印刷电路板组件寿命的影响：基于XGBoost和随机梯度提升的SHAP解释分析
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
deleteOAAI
deleteBarman, Akashjyoti; Mantri, Jai; Ganesh, S. P.; Kantamneni, Yash; Sabareesh, G. R.; Radhika, Sudha
delete分享
delete收藏
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry电子封装用环氧模塑料：无机填料类型与几何形状的影响
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete1
PREAI
deleteLee, Eyann; Mukhtar, Muhamed Abdul Fatah Muhamed; Saad, Abdullah Aziz; Jaafar, Mariatti
delete分享
delete收藏
Thermal Design and Performance Modeling of a High Compute Density Liquid Cooled Chiller Less Modular Edge Data Center高计算密度液体冷却无冷水机组模块化边缘数据中心的热设计及性能建模
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
PREAI
deleteTano, Ines-Noelly; Rasouli, Erfan; Narayanan, Vinod
delete分享
delete收藏
Propensity for Pad Cratering Evaluation in Board Resin and Board-Resin/Glass Interface Under Assembly and Rework在组装和返工过程中对基板树脂和基板-树脂/玻璃界面焊盘凹坑倾向的评估
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
PREAI
deleteLall, Pradeep; Choudhury, Padmanava; Pandurangan, Aathi RajaRam
delete分享
delete收藏
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon小型闭式循环热管中喷泉式不稳定性的实验表征
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
PREAI
deleteIsaac Aragones, Debraliz; Warsinger, David M.; Weibel, Justin A.
delete分享
delete收藏
Thermomechanical Finite Element Analysis of Cu-SiCN Hybrid Bonding With Protruding and Recessed Cu Pad in Three-Dimensional Integrated CircuitsHe, T.; Wang, C.; Xie, B.; Xu, Z.; Yin, Z.; Wu, H. 三维IC中具有凸起和凹陷Cu焊盘的Cu-SiCN混合键合的热机械有限元分析. J. Electron. Packag. 2026, 148, 021004. [Google Scholar] [CrossRef]
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete2
PREAI
deleteHe, Tao; Wang, Chang; Xie, Bin; Xu, ZhouLong; Yin, ZhouPing; Wu, Hao
delete分享
delete收藏
Study On the Reliability of Lead-Free Solder Joint Assemblies Under Combined Effects of Vibrations and Extended High-Temperature Exposure无铅焊点组件在振动与高温长期暴露联合作用下的可靠性研究
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
PREAI
deleteLall, Pradeep; Mehta, Vishal; Suhling, Jeff; Blecker, Ken
delete分享
delete收藏
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics高功率密度电力电子器件中混合单相与两相冷却器的实施可行性研究
deleteJournal of Electronic Packaging
IF2.3
delete2026-05-01
delete0
PREAI
deleteLin, Yujui; Kwon, Heungdong; He, Yini; Xiao, Kewei; Gupta, Man Prakash; Degner, Michael; Asheghi, Mehdi; Mantooth, H. Alan; Goodson, Kenneth E.
delete分享
delete收藏
Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems针对2.5D硅基集成系统的面内热隔离策略的实验研究
deleteJournal of Electronic Packaging
IF2.3
delete2026-04-01
delete0
PREAI
deleteChen, Zhengwei; Song, Yingru; Yang, Ye; Quan, Ian Xin; Marconnet, Amy M.; Wei, Tiwei
delete分享
delete收藏
Two-Phase Jet Impingement Cooling With Copper Inverse Opal Coated Microfins Using Novec 649铜反蛋白石涂层微鳍两相射流冲击冷却使用Novec 649
deleteJournal of Electronic Packaging
IF2.3
delete2026-04-01
delete0
PREAI
deleteShi, Shangyang; Ning, Shangjin; Wang, Wei; Zhang, Chi
delete分享
delete收藏
Impact of Dielectrophoretic Vapor Extraction Force on Electronics Performance介电泳蒸汽提取力对电子性能的影响
deleteJournal of Electronic Packaging
IF2.3
delete2026-04-01
delete0
PREAI
deletePodlaski, Lindsey H.; Yagoobi, Jamal S.
delete分享
delete收藏
Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation受限、直接在硅片上的两相射流冲击冷却与增材制造多孔 Wick 辅助相分离的实验表征及服务器级演示
deleteJournal of Electronic Packaging
IF2.3
delete2026-04-01
delete0
PREAI
deleteYogi, Ketan; Sahu, Gopinath; Rajeev, Sidharth; Lattupalli, Harish Kumar; Wang, Keyu; Chen, Zhengwei; Yang, Yunchun; Schiffres, Scott N.; Rangarajan, Srikanth; Sammakia, Bahgat; Weibel, Justin A.; Wei, Tiwei
delete分享
delete收藏
Improved Productivity With High-Speed Imaging for Printed Circuit Board Applications in Electronics Assembly通过高速成像提高电子组装中印刷电路板应用的生产率
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete1
PREAI
deleteAgarwal, Sunny
delete分享
delete收藏
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components多孔层对电子元件冷却影响的数值与实验研究
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteKocak, Eyup; Turkoglu, Hasmet
delete分享
delete收藏
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape超低热阻铜纳米线-聚二甲基硅氧烷复合材料热界面材料胶带的精密热特性表征
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteJiang, Kaiying; Kwon, Heungdong; Qiao, Hansen; He, Yini; Asheghi, Mehdi; Goodson, Kenneth E.
delete分享
delete收藏
Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment泵送两相液体冷却技术的成熟化及其商业化规模化部署
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteTipton, Russ; Wise, Ashley; Mutabdzija, Srdan; Shores, Craig; Kulkarni, Devdatta
delete分享
delete收藏
Impact of Thermal Cycling on Phase Change Material Based Thermal Management Systems热循环对基于相变材料的传热管理系统的影响
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete1
PREAI
deleteTripathi, Piyush Mani; Marconnet, Amy
delete分享
delete收藏
Inhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu通过在Cu上电化学沉积多壁碳纳米管抑制Cu/Sn界面金属间化合物生长
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteKim, Kanghun; Kim, Yonghwan; An, Won Young; Chang, Yujin; Hwang, Seon Jae; Park, Jonghyock; Kang, Minkyu; Cho, Sungho; Kim, Dasom; Piao, Yuanzhe
delete分享
delete收藏
Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators高真空Au/Si共晶晶圆键合工艺在MEMS谐振器中的应用研究
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteZha, Kaixiang; Wang, Shuo; Zhao, Junyuan; Niu, Bo; Hong, Yiyi; Zhu, Yinfang; Yang, Jinling
delete分享
delete收藏
A Physics-Informed Adaptive Segmentation Fitting Method for Transient Thermal Test Analysis基于物理信息的自适应分割拟合方法用于瞬态热测试分析
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
delete0
PREAI
deleteZhu, Haorui; Jian, Maoliang; Yang, Lianqiao
delete分享
delete收藏