未登录返回期刊详情
Fault modeling, testing, and repair for chiplet interconnects芯片互连的故障建模、测试与修复
Liu, Xiaoting; Zhou, Xiaojun; Fu, Chengcheng; Yang, Dazhi; Ji, Suning; Zhang, Nan; Yan, Dapeng; Wang, Zixuan; Guo, Yufeng; Liu, Lu; Cai, Zhikuang
分享
收藏 A hybrid algorithm-driven approach for efficient design of terahertz molecule-specific metasensors基于混合算法驱动的太赫兹分子特异性超材料传感器的高效设计方法
Wang, Mian; Bao, Ying; Wang, Weiping; Li, Nan; Hu, Xiaoyan; Chu, Tao; Ying, Yibin; Xu, Wendao; Xiong, Bo; Ma, Wei
分享
收藏 Laser direct lithography of large-area three-dimensional integrated photonics: Technological challenges and advancesZhong, L.; Wang, Y.; Han, X.; Hu, J.; Qiu, J. 大面积3D集成光子学的激光直写光刻:技术挑战与进展. Chip 2025, 100157. [Google Scholar] [CrossRef]
Zhong, Lijing; Wang, Yuying; Han, Xuhu; Hu, Jiacheng; Qiu, Jianrong
分享
收藏