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SOLDERING & SURFACE MOUNT TECHNOLOGY

IF1.8
论文数28
被引数
期刊论文 28
发表时间
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects对晶圆级电镀铜颗粒缺陷的工艺优化及抑制方法的研究
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteJu, Fan; Pu, Jie; Wang, Yuebing; Yang, Cheng; Dai, Feihu; Ji, Yong; Wang, Chengqian
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AI-Driven cross-scale modeling for SiP thermo-mechanical simulationAI驱动的多尺度建模用于SiP热-机械仿真
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteZeng, Ce; Zhang, Yanming; Gao, Mingqi; Sheng, Can; Lei, Dongyang; Li, Yang; Li, Yangyang; Cui, Zhenduo; Zhu, Shengli
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Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model基于混合有限元分析-机器学习模型的异构毫米波RF前端封装可靠性分析
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteHuang, Lichang; Zhang, Yingjun; Tong, Yuting; Xu, Xiaobin; Chen, Jinxing; Xu, Sha; Zhang, Yu
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L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuitsL型环氧树脂加固优化以提高航空航天大规模集成电路中微弹簧阵列引脚的振动可靠性
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteXiang, Yuyan; Jingming, Fei; Hongmei, Zhang; Qi, An
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Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder通过新型Ni@Cu10Ni合金网增强的SAC305复合焊料实现铜板低温可靠焊接
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteYao, Anqi; Yu, Huan; Ji, Wenhao; Liu, Ruxia; Xiao, Yong
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Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design机器学习在焊点工程中的应用：微结构信息学、可靠性预测和加速设计的综述
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IF1.8
delete2026-05-01
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PREAI
deleteZulkifli, Muhammad Nubli
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Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads具有准同轴结构TR模块在高冲击载荷下关键结构力学性能的模拟与结构优化
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IF1.8
delete2026-05-01
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PREAI
deleteChen, Zhuo; Luo, Zhiheng; Zhang, Junqin; Li, Jie; Gao, Mingyu; Che, Qin; Zhang, Jiayi
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A comparative study of the mechanical properties of sintered submicron and micron Cu烧结亚微米和微米Cu的力学性能比较研究
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteHuang, Jian; Wang, Bi; He, Siliang; Cai, Miao; Qin, Hongbo; Yan, Haidong
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Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver烧结银在烧结压力影响下高温拉伸行为实验表征
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteGharaibeh, Mohammad A.; Ganzenmueller, Georg C.; Hiermaier, Stefan
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Reliability study of hybrid bonded structures based on flux divergence method基于通量发散法的混合键合结构可靠性研究
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteWang, Yukang; Gan, Wumiao; Tang, Daokuan; Wang, Yaoting; Zhu, Yiying; Zhou, Zhukun
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Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging可返工环氧底部填充材料，具有优化的固化与流动行为，适用于先进电子封装
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteMuhamed Mukhtar, Muhamed Abdul Fatah; Phang, Jia Xin; Abd Khalid, Nor Rashikin; Abdullah, Muhammad Khalil; Ramli, Mohamad Riduwan
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Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT电子辐照和热循环对GaN HEMT电学性能的影响
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteHan, Dan; Chen, Xiao; Shen, Zicai; Chen, Rui; Cao, Rongxing; Liu, Yang; Liu, Hanxun; Xue, Yuxiong
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Comparative analysis of the fatigue life of the FLASH under joint error conditions在联合误差条件下的FLASH疲劳寿命比较分析
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-02-01
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PREAI
deleteLei, Le; Lei, Bing; Li, Lingbo
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Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints对纳米铜烧结接头力学性能及微观结构中键合影响的探究
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IF1.8
delete2026-02-01
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PREAI
deleteLiu, Quanyi; Ding, Zhicheng; Sun, Hongsheng; Liu, Biao; Liu, Yang
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Effect of thermal aging on microstructure and mechanical properties of indium-doped Sn-Ag-Cu lead free solder alloys热老化对掺杂铟的Sn-Ag-Cu无铅焊料合金微观结构和力学性能的影响
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IF1.8
delete2026-02-01
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PREAI
deleteHameed, Muhammad Sohail; Wakeel, Aneela; Ullah, Barkat; Channar, Hassan Raza; Zubair, Muhammad
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Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substratesEHD打印银纳米粒子墨水在氧化铝陶瓷基板上的多参数协同优化与烧结致密化
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IF1.8
delete2026-02-01
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PREAI
deleteLi, Yulong; Tian, Jinke; Hao, Ruijie; Ding, Feng; Wu, Haoyue; Lin, Wei; Hong, Jinhua; Lei, Min; Li, Xuewen
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Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies超细电容器组装中加强型SAC305焊点圆角高度的数值模拟与多目标优化
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-02
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PREAI
deleteAbas, Aizat; Mukhtar, Muhamed Abdul Fatah Muhamed; Apalowo, Rilwan Kayode; Ani, Fakhrozi Che
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Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallizationIn-Ag合金与化学镀镍-浸金金属化之间的界面反应研究
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteSim, Yunsub; Maeng, Jongsun; Oh, Minho; Choi, Won; Kim, Taek-Soo; Hur, Eunkwang; Sohn, Yoonchul
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Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing微尺度球栅阵列结构Cu/Sn-3.0Ag-0.5Cu/Cu焊点在电流应力下的尺寸效应对剪切性能的影响
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteWang, Bo; Ke, Zhanglong; Chen, Zimeng; Li, Wangyun; Huang, Wei; He, Siliang; Pan, Kailin; Nishikawa, Hiroshi
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Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents通过还原性溶剂协同促进200°C下纳米孪晶铜的直接键合
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteZhao, Zehao; Wu, Wei; Gao, Li-Yin; Liu, Zhi-Quan
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