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Semiconductor Wafer Bonding: Science, Technology and Applications

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论文数43

被引数0

期刊论文 43

发表时间

Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Knechtel, Roy; Dempwolf, Sophia; Klingner, Holger

Heterogeneous Photonic Integration by Direct Wafer Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Davenport, Michael L.; Chang, Lin; Huang, Duanni; Volet, Nicolas; Bowers, John E.

Cu-Cu Die to Die Surface Activated Bonding in Atmospheric Environment using Ar and Ar/N2 Plasma

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Chua, S. L.; Tan, C. S.

Adhesion energy and bonding wave velocity measurements

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Larrey, V.; Mauguen, G.; Fournel, F.; Radisson, D.; Rieutord, F.; Morales, C.; Bridoux, C.; Moriceau, H.

Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Floetgen, C.; Razek, N.; Dragoi, V.; Wimplinger, M.

Analysis of Defect Levels at GaAs/GaAs Surface-Activated Bonding Interface for Multi-Junction Solar Cells

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Sugiyama, M.; Yamashita, D.; Watanabe, K.; Fujino, M.; Suga, T.; Nakano, Y.

Determination of Band Structure at GaAs/4H-SiC Heterojunctions

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Liang, J. B.; Shimizu, S.; Arai, M.; Shigekawa, N.

Invited: High Output Power Deep Ultraviolet Light-Emitting Diodes with Hemispherical Lenses Fabricated Using Room-Temperature Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Ichikawa, M.; Endo, S.; Sagawa, H.; Fujioka, A.; Kosugi, T.; Mukai, T.; Uomoto, M.; Shimatsu, T.

High Efficiency Cleaning Processes for Direct Wafer Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Dussault, D.; Rothballer, J.; Kurz, F.; Reichardt, M.; Dragoi, V.

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Kurz, F.; Plach, T.; Suess, J.; Wagenleitner, T.; Zinner, D.; Rebhan, B.; Dragoi, V.

Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

OAAI

Poppe, E.; Jensen, G. U.; Moe, S. T.; Wang, D.

Edge Water Penetration in Direct Bonding Interface

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Rieutord, F.; Tardif, S.; Landru, D.; Kononchuk, O.; Larrey, V.; Moriceau, H.; Tedjini, M.; Fournel, F.

Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration 用于3D/异质集成的基于自组装的多芯片到晶圆键合技术

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Fukushima, T.; Lee, K. W.; Tanaka, T.; Koyanagi, M.

Locally Measuring the Adhesion of InP Membranes Directly Bonded on Silicon

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Patriarche, G.; Pantzas, K.; Le Bourhis, E.; Beaudoin, G.; Talneau, A.

Wafer-level Vacuum Packaging by Thermocompression Bonding using Silver after Fly-cut Planarization

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Liu, C.; Hirano, H.; Froemel, J.; Tanaka, S.

Suppressed Self-Heating in Multi-Finger InP-Based DHBTs with Au Subcollector Fabricated on SiC Substrate by Surface-Activated Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Shiratori, Y.; Hoshi, T.; Kashio, N.; Kurishima, K.; Higurashi, E.; Matsuzaki, H.

The roles of band bending, surface misorientation, and passivation on electrical transport across III-V bonded structures

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Yee, M.; Liao, M.; Seal, M.; Goorsky, M. S.

Room Temperature Bonding with Lift-Off Resist Using the Surface Activated Bonding Method for a Layer Transfer Platform

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Matsumae, Takashi; Suga, Tadatomo

Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

He, Ran; Fujino, Masahisa; Yamauchi, Akira; Suga, Tadatomo