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IEEE Transactions on Advanced Packaging

IF0
论文数2
被引数0
期刊论文 2
发表时间
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Thermoelectric-powered convective cooling of microprocessors
deleteIEEE TRANSACTIONS ON ADVANCED PACKAGING
IF0
delete2005-05-01
delete43
PREAI
deleteYazawa, K; Solbrekken, GL; Bar-Cohen, A
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Single-package integration of RF blocks for a 5 GHz WLAN application用于5 ghz WLAN应用的RF块的单封装集成
deleteIEEE TRANSACTIONS ON ADVANCED PACKAGING
IF0
delete2001-01-01
delete51
PREAI
deleteDiels, W; Vaesen, K; Wambacq, P; Donnay, S; De Raedt, W; Engels, M; Bolsens, I
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