arrow
返回期刊详情
IEEE Transactions on Components Packaging and Manufacturing Technology 封面图

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3
论文数230
被引数8042
期刊论文 230
发表时间
In Memoriam Dr. William ChenA Visionary Architect of the Microelectronics Community纪念陈威廉博士——微电子社区远见卓识的缔造者
delete2026-05-01
delete0
PREAI
deleteMahajan, Ravi; Iyer, Subramanian; Wu, Tien; Bottoms, Bill; Manning, Denise; Suhling, Jeff; Thompson, Patrick; Macleod, Patricia; Sammakia, Bahgat; Xue, Jie; Ramakrishna, Koneru; Helmy, Amr; Grupen-Shemansky, Melissa; da Silva, Mark; Chan, Benson; Swaminathan, Madhavan; Pearsall, Kitty; Hsu, Rockwell; Bakir, Muhannad; Joshi, Yogendra; Beyene, Wendem; Cheng, H. C.; Shalf, John; Bailey, Christopher; Schutt-Aine, Jose; Subbarayan, Ganesh; Lee, Timothy; Refai-Ahmed, Gamal; Poliks, Mark; McCluskey, Patrick; Chen, Jun; Li, Ou; Han, Bongtae
delete分享
delete收藏
Thin Metal Layer Boundary Conditions for Arrayed Structures and Passive Devices阵列结构和无源器件的薄膜金属层边界条件
delete2026-05-01
delete3
PREAI
deleteWang, Yi-Yao; Zhan, Qiwei; Zhang, Haoxuan; Wang, Yin-Da; Li, Erji; Feng, Haoqiang; Sun, Bozhao; Yin, Wen-Yan
delete分享
delete收藏
RF Characterization and Performance Analysis of Aerosol Jet-Printed Coplanar Waveguides on HPFS Glass Substrates for High-Frequency Applications射频特性表征和高频应用中气溶胶喷印共面波导在HPFS玻璃基底上的性能分析
delete2026-05-01
delete0
PREAI
deleteAlshaibani, W. T.; Alzanina, Mousa; Umar, Ashraf; Obeidat, Abdullah S.; Al-Haidari, Riadh; Shamsian, Olya Noruz; Alhendi, Mohammed; Schadt, Mark; Cadwell, Ryan; Kim, Cheolbok; Ng'oma, Anthony; Poliks, Mark
delete分享
delete收藏
A Novel 60-92.5 GHz Ultra-Broadband Bonding Wire Interconnect Technology With DGS一种新型60-92.5 GHz超宽带DGS键合丝互连技术
delete2026-05-01
delete0
PREAI
deleteLiu, Weihong; Guo, Yiyong; Qu, Zhiyuan; Ju, Tianxi; Tian, Fengyan; Du, Jialun; Li, Chen; Zhang, Jiajie; Wei, Jiacheng
delete分享
delete收藏