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Electronic Materials Letters 封面图

Electronic Materials Letters

IF2.6
论文数167
被引数1876
期刊论文 167
发表时间
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Nitrogen Plasma-induced Surface Engineering of MnFe Prussian Blue Analogues for Aqueous Zinc-ion Batteries氮等离子体诱导的MnFe普鲁士蓝类似物表面工程用于水系锌离子电池
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deleteKim, Seunghwan; Kim, Dae-wook; Ahn, In-Kyoung
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Interfacial Engineering of WS2 Thin-Film Transistors via O2 Plasma-Induced WO3-x Buffer Layers通过O2等离子体诱导的WO3-x缓冲层对WS2薄膜晶体管的界面工程
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deleteLee, Jeonghoon; Seo, Dong Hyun; Seo, Gyeong Deok; Kim, TaeWan
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Metastable Phase in Molybdate XMoO4 (X = Ni, Co, Cu) for Oxygen Evolution Reaction: Structural Phase Dependence钼酸盐XMoO4（X = Ni，Co，Cu）中的亚稳相用于析氧反应：结构相依赖性
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deleteJeong, Si Hoon; Lee, Seung Yong; Myung, Nosang Vincent; Lee, Kyu Hyoung
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High-Sensitivity Enzyme-Free Glucose Sensing and Enhanced Photocurrent Response by a Nanoporous CuO and CuO-ZnO Composite高灵敏度酶-free葡萄糖传感及纳米多孔CuO和CuO-ZnO复合材料的增强光电流响应
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deleteYoo, Dayoung; Kim, Minseok; Wang, Jingya; Kim, Shinyoung; Joo, Siyeon; Lee, Dongyun
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Tuning sp3/sp2 Carbon Hybridization to Realize Highly Durable Gas Diffusion Layers (GDLs) for Fuel Cells通过调控sp3/sp2碳杂化实现高耐久性燃料电池气体扩散层（GDLs）
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deleteYu, Tang; Jing, Ge; Yu, Jun-kai; Su, Zhi-peng; Yang, Si-cheng; Liu, Shu-hong; Li, Zhu-xin; Hong, Zhao; Yong, Zhang
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Z-Scheme Charge Transfer in BiOCl/CoWO4 Heterostructures for Enhanced Photocatalytic Removal of Ciprofloxacin and MicroplasticsBiOCl/CoWO4异质结构中Z型电荷转移对环丙沙星和微塑料光催化去除的增强作用
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deleteHuo, Xuanyi; Dong, Yi; Xu, Jingjing; Chen, Mindong
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Composition-Engineered Shape Memory Polymer Stamps for Robust Micro-Transfer Printing of μLEDs成分工程化形状记忆聚合物印章用于稳定微转移印刷μLEDs
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deleteChai, Mingi; Tak, Hyun; Kim, Youngmin
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High-Performance High-Entropy Oxide (FeMnAlCrTi)3O4 as a Cathode Material for Aqueous Zinc-Ion Batteries江仁智; 蔡毅超; 严德才. 高性能高熵氧化物(FeMnAlCrTi)3O4作为水系锌离子电池的正极材料. 电子材料快报, 2026. [谷歌学术] [ CrossRef ]
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deleteJiang, Renzhi; Cai, Yuncheng; Yan, Dingce
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Radiation-Tolerant Amorphous Indium-Zinc-Tin-Oxide Thin-Film Transistors耐辐射的非晶铟锌锡氧化物薄膜晶体管
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deleteKang, Dongwon; Jeon, Subin; Ju, Eun Chong; Shin, Jaewon; Nam, Dayul; Kim, Jaehyun; Park, Sung Kyu
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Cobalt Binary Compounds for Advanced Interconnect Materials
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deleteMaeng, Gyungho; Lee, Yeonghun
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Mechanism and Evaluation of Two-Terminal Ferroelectric-Based Memristive/Memcapacitive Devices基于铁电的两端忆阻器/忆容器件的机理与评估
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deleteAhn, Hyeon Jin; Shin, Hyung Jin; Yu, Na Kyung; Yoon, Jung Ho
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Unveiling the Substrate Effect: A Combined Experimental and Simulation Study of Field Emission from Carbon Nanotubes on Stainless Steel and Silicon揭示衬底效应：碳纳米管在不锈钢和硅衬底上场发射的实验与模拟综合研究
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deleteChen, Jianwei; Zhao, Yike; Guo, Yajie; Feng, Wuwei; Fan, Jiajie; Zhao, Yangyang; Jiang, Jun
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Enhanced Photodetection in Slanted Silicon Nanowire Array via Spin-On-Glass-Based Surface Passivation通过基于旋涂玻璃的表面钝化增强倾斜硅纳米线阵列的光探测
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deleteJang, Hayoung; Kim, Youngmin
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Simple Fabrication and Electrical and Mechanical Characterization of Dumbbell-Like Pillar Structures for Vertical Device Applications哑铃状柱状结构的简单制备及其电学和力学性能表征，用于垂直器件应用
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deleteHwang, Hae-In; Park, Minji; Park, Ahyun; Lee, Seung-Hun; Ha, Jihun; Yoo, Yeong-Eun; Jeon, Eun-Chae; Kim, Jeong Hwan
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Rational Design of Transition Metal-Based Electrocatalyst Materials for Efficient Urea Oxidation Toward Hydrogen Production and Wastewater Treatment过渡金属基电催化剂材料的理性设计：用于高效尿素氧化以实现氢气生产和废水处理
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deleteLei, Qian; Cui, Peng; Oh, Seju; Lee, Dong Ki; Kim, Jung Kyu; Choi, Suk Soon
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Integration of Ferroelectric and 2D Materials for Next-Generation High-performance Electronics铁电材料与二维材料的集成用于下一代高性能电子学
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deleteHeo, Jun Hoe; Park, Ji Min; Jang, Ho Won
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Morphology Engineering Enables Structural Stability and Kinetics of O3-Na0.87Fe0.5Mn0.5O2 Cathode Material for Sodium-Ion Batteries形貌工程实现O3-Na0.87Fe0.5Mn0.5O2正极材料在钠离子电池中的结构稳定性和动力学性能
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deleteTan, HaoFeng; Jin, Shan; Meng, JunXia; Chen, ChaoHui; Fu, DeHao; Zhong, YingXiang; Zhang, Qian; Ma, QuanXin
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Synergistic Interfacial Engineering with a C60-SB/PFN-Br Hybrid Layer for Suppressing Photocatalytic Degradation in Organic Solar Cells通过C60-SB/PFN-Br复合层协同界面工程抑制有机太阳能电池的光催化降解
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deleteLee, Ah-Yeong; Lee, Seongyu; Sung, Min Jae; Kwon, Soon-Ki; Kim, Yun-Hi; Hong, Soonil; Lee, Jong-Hoon; Lee, Kwanghee
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Effects of the Dielectric Curing Temperature on the Interfacial Adhesion Characteristics of Photosensitive Polyimide/Cu RDL Structures for Fan-Out Packages介电固化温度对扇出型封装中光敏聚酰亚胺/Cu RDL结构界面粘附特性的影响
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deleteKim, Doheon; Kim, Gahui; Jeong, Daeyoon; Park, Young-Bae
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Research on In-Situ Grown Graphene-Like Coated Copper Powder and Its Conductive Paste原位生长类石墨烯涂层铜粉及其导电浆料的研究
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deleteZhao, Keliang; Ye, Chengcai; Wang, Qing; Liu, Ze; Rao, Longlai; Wang, Dalin; Liu, Zhenguo
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