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Microelectronics Reliability

IF1.9
论文数301
被引数9222
期刊论文 301
发表时间
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GaN Super-Lattice Castellated Field Effect Transistors (SLCFETs): Stacked channel structure creates three parallel devicesGaN超晶格城堡式场效应晶体管（SLCFETs）：堆叠沟道结构形成三个并联器件
deleteMicroelectronics Reliability
IF1.9
delete2026-07-01
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deleteParvez, Bazila; Smith, Matthew D.; Pomeroy, James W.; Parke, Justin; Howell, Robert S.; Kuball, Martin
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Dynamic electro-thermal circuit modeling for vertical NiO/β-Ga2O3 p-n diodes垂直NiO/β-Ga2O3 p-n二极管的动态电-热电路建模
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IF1.9
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PREAI
deleteChoi, Yunyeong; Cho, Youngkwan; Kim, Dongbin; Cho, Byung Jin; Shin, Myunghun
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Real-time junction temperature estimation of power MOSFETs in full-bridge converters using a package-calibrated lookup table全桥变换器中功率MOSFET的实时结温估计方法：基于封装校准的查找表
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IF1.9
delete2026-07-01
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PREAI
deleteMetha, Pritesh Anil; Mikkili, Suresh
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Random-vibration fatigue life of plated through-hole components on circulator pump PCBs: Experiments, model fidelity and spectral damage methods循环泵PCB板上电镀通孔元件的随机振动疲劳寿命：实验、模型保真度与谱损伤方法
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IF1.9
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deletePatel, Hiren; Sorokin, Sergey; Nielsen, Kim Martin
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CMOS gate driver with fully integrated fast and robust gate monitoring solution for a full short-circuit protection of SiC power module具有完全集成的快速和鲁棒门极监控解决方案的CMOS门极驱动器，用于SiC功率模块的全短路保护
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IF1.9
delete2026-07-01
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PREAI
deleteEl Boubkari, Anas; Rouger, Nicolas; Calmes, Pierre; Bacchi, Matthew; Cousineau, Marc
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Optimizing the capacitor insulator to enhance the bias-stress characteristics of LTPS-TFTs for improving the reliability of low-temperature polycrystalline-silicon active matrix organic light-emitting diodes优化电容器绝缘体以增强LTPS-TFTs的偏压应力特性，从而提高低温多晶硅有源矩阵有机发光二极管的可靠性
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IF1.9
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PREAI
deleteJin, Yu; Wang, Chen; Xu, Wen-Jie; Zhou, Zhi-Yi; Gao, Xiao-Yu; Liu, Yu-Cheng; Shen, Ying; Wu, Yong; Li, Wei-Long; Zhang, Pan-Long; Qi, Dong-Yu; Liu, Jin-Tao; Chen, Zhao-Li; Hsiao, Chueh-Sheng; Zhang, Feng-Xue; Liu, Xin-Yu; Han, Dong
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Self-recovery RRD-12T SRAM cell-based array for fault-tolerant energy-efficient memory systems基于自恢复RRD-12T SRAM单元阵列的容错节能存储系统
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IF1.9
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PREAI
deleteSrividyabarathi, A.; Deepa, P.
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Mechanical reliability in sintered Ag die-attach assemblies reinforced with Cu microparticles烧结银芯片键合组件中用铜微颗粒增强的机械可靠性
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IF1.9
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PREAI
deleteSanchez, Alessandra Gallegos; Chantawong, Chessadakorn; Nishida, Mitsuhiro; Banerjee, Amit; Namazu, Takahiro
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Synergistic effects of In and Sb additions on the microstructure, thermal behavior and mechanical properties of SAC305 solder alloysIn和Sb添加对SAC305焊料合金微观结构、热行为和力学性能的协同效应
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IF1.9
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deleteSungkhaphaitoon, Phairote; Homkhiew, Chatree; Chantaramanee, Suchart
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paper Reliability-critical gate identification based on sensitivity and stochastic computing基于灵敏度和随机计算的可靠性关键门电路识别
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deleteDing, Caishuo; Wang, Zhen
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Effect of addition carbon nanotubes (MWCNTs) on the microstructure, mechanical properties and wetting of nanocomposites Sn-Bi/MWCNTs solder alloys添加碳纳米管（MWCNTs）对Sn-Bi/MWCNTs纳米复合材料焊料合金微观结构、力学性能及润湿性的影响
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deleteda Silva, Woddley Taffarel Amancio; Silva, Juda Izel; do Nascimento, Nayra Reis; Padua, Gabriel Fabricio Rocha de Carvalho; de Oliveira, Joaquim Souza; Martins Jr, Julio Simonetti; Sahdo, Luciano de Souza; Barboza, Ricardo da Silva; Kieling, Antonio Claudio; da Silva, Alessandro Stone; de Macedo Neto, Jose Costa
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In-situ monitoring of package strain during HTRB test based on fiber-optic sensors☆基于光纤传感器的HTRB测试过程中封装应力的原位监测
deleteMicroelectronics Reliability
IF1.9
delete2026-06-01
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deleteBorghese, Alessandro; Marrazzo, Vincenzo Romano; Fienga, Francesco; Riccio, Michele; Maresca, Luca; Irace, Andrea; Breglio, Giovanni
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Enhancing SiC MOSFET short-circuit withstand capability via the modulation of VZTC通过调节VZTC提升SiC MOSFET的短路耐受能力
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IF1.9
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deleteLu, Wenyu; Zhang, Cheng; Zhou, Xuetong; Su, Hang; Hu, Yunheng; Long, Liujun; Zheng, Li; Cheng, Xinhong
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Multi-board parallel irradiation testing of neutron-induced soft errors in 16 nm FinFET and 22 nm planar FPGAs (vol 180, 116083, 2026)多板并行照射测试中16 nm FinFET和22 nm平面FPGA中中子诱导软错误（vol 180, 116083, 2026）
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deleteLuo, Enming; Yu, Qirui; Wu, Zhaohui; Li, Bin; Zhu, Dayong; Dong, Yu-Feng
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Interface engineering of multilayer HfOx memristors for enhanced performance and reliability多层HfOx忆阻器的界面工程以提升性能和可靠性
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deleteShvetsov, Boris S.; Matsukatova, Anna N.; Kuchumov, Ivan D.; Ilin, Alexander S.; Tsiniaikin, Ilia I.; Novoseltsev, Aleksandr I.; Savchuk, Timofey P.; Martyshov, Mikhail N.; Forsh, Pavel A.; Kashkarov, Pavel K.
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RCR-Net: An efficient deep learning model for reliable detection of PCB surface defectsRCR-Net：一种用于可靠检测PCB表面缺陷的高效深度学习模型
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IF1.9
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deleteZhang, Luying; Zhang, Linbeizi; Pan, Shangtao; Fu, Bing; Ding, Jiang
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Advanced semiconductor packaging design via artificial intelligence and machine learning: A review基于人工智能和机器学习的先进半导体封装设计：综述
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deleteRafiee, M.; Saini, P.
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Copula based SFP plus transceiver MTTF estimation method by using optical power and sensitivity基于Copula的SFP plus收发器MTTF估计方法（使用光功率和灵敏度）
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IF1.9
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deleteLi, Wei; Gao, Cheng; Huang, Jiaoying; Du, Weiyang
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A new online monitoring method to detect thermal resistance via turbo sampling of plateau voltage通过平顶电压的涡轮采样检测热阻的新在线监测方法
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deleteWatabe, Kiyoto; Nakamura, Koji; Mori, Tokihiko; Kusunoki, Shigeru; Nakano, Satoshi; Sakurai, Takayasu; Takamiya, Makoto; Nishizawa, Shin-ichi; Saito, Wataru
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Investigation on the interfacial electrical breakdown failure behavior in through silicon vias硅通孔中界面电击穿失效行为的研究
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deleteChen, Xiaoting; Chen, Xianyi; Jia, Jie; Hua, Nan; Chen, Si; Yang, Xiaofeng; Liu, Jiaru; Lu, Xiangjun; Lu, Shengguo; Lu, Guoguang; Wang, Changhong; Zhou, Bin; Jian, Xiaodong
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