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C

China Electronic Product Reliability And Environmental Testing Research Institute

学者数136
论文数82
被引数0
关联论文 (77)
发表时间
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Trace Phosphorus-Modified Hot-Dip Sn Coatings on Cu Substrates: Surface Film Formation and Corrosion Resistance in NaCl Solution铜基体上痕量磷改性热浸镀锡涂层：表面膜形成及在NaCl溶液中的耐腐蚀性能
errCoatings
IF2.8
err2026-09-20
err0
errOAAI
errYupeng Wang; Zhuangchao Zhan; Yuheng Han; Hongbo Qin; Jiaqiang Huang; Wangyun Li; Caihang Liang; Lili Wang; Chengxu Lin; Mingzhen Hu; Tianhan Liu
err分享
err收藏
Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review多孔铜基互联材料在电子封装中的应用：简要综述
errMaterials
IF3.2
err2026-09-17
err0
errOAAI
errJiahao Liu; Lijin Qiu; Peizhong Wang; Feiyang Wang; Jixi Huang; Hongtao Chen; Hao Zhao; Fangzhou Chen
err分享
err收藏
Dynamic Reliability Assessment for Multi-Mode Switch Matrices Incorporating Current Stress and Wear Accumulation多模式开关矩阵的动态可靠性评估：整合电流应力和磨损累积
errRELIABILITY ENGINEERING & SYSTEM SAFETY
IF11
err2026-09-17
err0
PREAI
errYan Mai; Ying Zeng; Yuan Chen; Jing Li; Hong-Zhong Huang
err分享
err收藏
A stockbridge-damper-shaped triboelectric nanogenerator for transmission line vibration energy harvesting and self-powered frequency monitoring沙袋型摩擦纳米发电机用于输电线路振动能量收集和自供电频率监测
errSensors and Actuators A-Physical
IF4.9
err2026-08-20
err0
PREAI
errLin Fang; Pinshu Rui; Jin Wu; Jing Wang; Weiliang Zhang; Lei Wang; Yuanjie Fang; Dan Li
err分享
err收藏
Multi-view multi-dimensional collaborative completion for node classification with missing attributes多视图多维协同补全用于缺失属性的节点分类
errComplex & Intelligent Systems
IF4.6
err2026-08-01
err0
errOAAI
errXiaomeng Song; Bin Zhou; Yanjiang Wang; Cheng Yuan; Shichang Shang; Lubin Yu
err分享
err收藏
Reconciling rheology, stretchability and thermal conductivity in thermal interface materials through dynamic polymer interactions and multimodal filler networks通过动态聚合物相互作用和多模式填料网络协调热界面材料的流变学、可拉伸性和导热性
errJournal of Materials Science & Technology
IF14.3
err2026-07-20
err0
PREAI
errYuanyuan Xiao; Junchao Shangguan; Chunyu Zhang; Zhan Song; Jiahao Liu; Xiaoliang Zeng; Rong Sun
err分享
err收藏
Monolithic All-GaN Overtemperature Protection IC Based on GaN-on-Si Technology基于GaN-on-Si技术的单片全GaN过温保护集成电路
errIEEE Sensors Journal
IF4.5
err2026-07-13
err0
PREAI
errZhaoheng Yan; Junbo Wang; Xi Jiang; Xiangdong Li; Liang He; Hao Niu; Song Yuan; Jincheng Zhang; Xiaowu Gong
err分享
err收藏
Single and Repetitive Surge Reliability of 1200 V Asymmetric Trench SiC MOSFETs Under Various Gate Biases1200 V不对称沟槽碳化硅MOSFET在不同栅极偏置下的单次和重复浪涌可靠性
errMicromachines
IF3
err2026-07-11
err0
errOAAI
errMenglin Yan; Zhizhe Wang; Dazheng Chen; Yuncong Li; Yongle Zhong; Yuansheng Li; Jun Luo; Hao Xia
err分享
err收藏
Research on calibrated and cost-sensitive vulnerability alert governance for open-source software auditing针对开源软件审计的校准且成本敏感的漏洞警报治理研究
errArray
IF4.5
err2026-07-06
err0
errOAAI
errXiaorong Feng; Ying Gao; Xin Gu; Zhibin Jian
err分享
err收藏
Experiment and simulation of soft error characteristics in 14 nm FinFET and 28 nm SRAMs at 2400m deep underground14 nm FinFET和28 nm SRAM在2400m深地下软错误特性的实验与仿真研究
errNuclear Engineering and Technology
IF2.6
err2026-06-12
err0
errOAAI
errYufeng Dong; Guoguang Lu; Zhifeng Lei; Chao Peng; Yujuan He; Liping Zou; Wei Ma; Liang Lu; Zhangang Zhang
err分享
err收藏
Reagent-free, non-contact quantification of heavy-metal ions in electroplating wastewater via angle-resolved scatterometry无试剂、非接触式电镀废水中重金属离子的角分辨散射定量测量
errsensors and actuators b: chemical
IF0
err2026-05-26
err0
PREAI
errYilei Xu; Yichi Pan; Wenze Zhang; Wei Liang; Yunfei Song; Hongxin Ye; Fei Han; Qimeng Sun; Lijie Li; Kang Liang; Chong Shen; Dekun Yang
err分享
err收藏
Selective Electrodeposition of Micro-Nano Cu Arrays for Ambient Air Compatible Low Temperature Cu-Cu Bonding with Gradient Nanocrystalline Structure选择性电沉积微纳铜阵列用于与梯度纳米晶结构兼容的低温铜-铜键合
errJournal of Materials Research and Technology
IF6.6
err2026-05-26
err0
errOAAI
errFengyi Wang; Jinghui Zhang; Jiahao Liu; Yihao Zhang; Xing Fu; Hongtao Chen; Mingyu Li
err分享
err收藏
UERR: A unified effective retrieval model for open-source repositories开源仓库的统一有效检索模型
errJournal of Systems and Software
IF4.1
err2026-05-21
err0
PREAI
errNeng Zhang; Xin Gu; Jianga Shang; Haishen Lei; Chao Liu; Yiwang Huang; Zheng Lin; Bingnan Li
err分享
err收藏
Optical Parametric Amplifier-Enabled Wavelength-Tunable Information Management Across IQ Complex Plane光学参量放大器赋能的IQ复平面上波长可调的信息管理
errJournal of Lightwave Technology
IF4.8
err2026-05-21
err0
PREAI
errJiabin Cui; Xuanming Cao; Yanxia Tan; Guo-Wei Lu; Yuefeng Ji; Kunpeng Zhai; Sha Zhu; Jing Xu; Heng Zhou; Zhe Sun; Huashun Wen; Ninghua Zhu
err分享
err收藏
Research of growth kinetics of cu/Sn intermetallic compounds in planar and curved cu/Sn diffusion couples平面和弯曲Cu/Sn扩散偶中Cu/Sn金属间化合物生长动力学研究
errMaterials Letters
IF2.7
err2026-05-12
err0
PREAI
errJiahao Liu; Jixi Huang; Lijin Qiu; Fangzhou Chen; Hongtao Chen; Yufeng Liu
err分享
err收藏
Study on the Characteristics of Trap States Introduced by Pulsed Laser Irradiation in GaN RF HEMT Under Off-State Stress脉冲激光辐照在GaN RF HEMT关态应力下引入的陷阱态特性研究
errMicro and Nanostructures
IF3
err2026-05-07
err0
PREAI
errZhihua Cai; Hao Zhang; Bin Wang; Minjie Zhang; Danmei Lin; Jian Xiang; Xiaoqiang Wang; Xuefeng Zheng; Yue Hao
err分享
err收藏
Causal prototype variational information bottleneck framework for cross-domain fault diagnosis跨域故障诊断的因果原型变分信息瓶颈框架
errEngineering Applications of Artificial Intelligence
IF8
err2026-04-25
err0
PREAI
errYu Wang; Chenyu Jiang; Qiang Chen; Shujie Liu; Weiwei Liu
err分享
err收藏
Optimal maintenance strategies for deteriorating products with heavy-tailed degradation pattern退化模式为重尾的劣化产品最优维护策略
errRELIABILITY ENGINEERING & SYSTEM SAFETY
IF11
err2026-04-18
err0
PREAI
errQingqing Zhai; Ziyan Zhao; Guangze Pan
err分享
err收藏
Study on the Single-Event Burnout Mechanism of Ka-Band GaN MMIC Power Amplifiers Under Heavy Ion Irradiation重离子辐照下Ka波段GaN MMIC功率放大器的单粒子烧毁机理研究
errIEEE Transactions on Electron Devices
IF3.2
err2026-04-14
err0
PREAI
errLi Zhang; Xuefeng Zheng; Danmei Lin; Hao Zhang; Xiaohu Wang; Kang Li; Shunyu Wang; Fang Zhang; Yingzhe Wang; Peipei Hu; Jie Liu; Xiaohua Ma; Yue Hao
err分享
err收藏
Thermal shock resistance characterization of a novel porous Cu filled Sn-3Ag-0.5Cu interconnect material for power device packaging一种新型多孔Cu填充Sn-3Ag-0.5Cu互连材料在功率器件封装中的热震抗性表征
errMaterials Letters
IF2.7
err2026-04-02
err0
PREAI
errJiahao Liu; Lijin Qiu; Jixi Huang; Fangzhou Chen; Hongtao Chen; Wenjie Zhou
err分享
err收藏