Jeffrey C. Suhling - Publications, H-index & Citations

Jeffrey C. Suhling

auburn university system

43H指数

476论文数

7.2K被引数

收录论文 8

发表时间

First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide (vol 19, pg 6037, 2019)

IEEE SENSORS JOURNAL

IF4.5

2020-07-15

PREAI

Jaeger, Richard C.; Chen, Jun; Suhling, Jeffrey C.; Fursin, Leonid

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

MATERIALS

IF3.2

2017-04-26

OAAI

Shen, Chaobo; Hai, Zhou; Zhao, Cong; Zhang, Jiawei; Evans, John L.; Bozack, Michael J.; Suhling, Jeffrey C.

CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits

IEEE SENSORS JOURNAL

IF4.5

2013-06-01

PREAI

Chen, Yonggang; Jaeger, Richard C.; Suhling, Jeffrey C.

A review of mechanical properties of lead-free solders for electronic packaging

JOURNAL OF MATERIALS SCIENCE

IF3.9

2009-03-01

600

PREAI

Ma, Hongtao; Suhling, Jeffrey C.

Characterization of the temperature dependence of the piezoresistive coefficients of silicon from-150°C to+125°C

IEEE SENSORS JOURNAL

IF4.5

2008-08-01

PREAI

Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C.

Characterization of the temperature dependence of the pressure coefficients of n- and p-type silicon using hydrostatic testing

IEEE SENSORS JOURNAL

IF4.5

2008-04-01

PREAI

Cho, Chun-Hyung; Jaeger, Richard C.; Suhling, Jeffrey C.; Kang, Yanling; Mian, Ahsan

The van der Pauw stress sensor

IEEE SENSORS JOURNAL

IF4.5

2006-04-01

PREAI

Mian, A; Suhling, JC; Jaeger, RC

Silicon Piezoresistive Stress Sensors and Their Application in Electronic Packaging 硅压阻式应力传感器及其在电子封装中的应用

IEEE SENSORS JOURNAL

IF4.5

2001-06-01

287

PREAI

Suhling, Jeffrey C.; Jaeger, Richard C.

研究方向