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J

John L. Evans

auburn university system

21H指数
150论文数
2.2K被引数
收录论文 5
发表时间
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Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish
errIEEE Transactions on Components Packaging and Manufacturing Technology
IF3
err2026-02-01
err1
PREAI
errAlakayleh, Abdallah; Hamasha, Sa'd; Daradkeh, Saddam; Tahat, Sufyan; Evans, John; Alahmer, Ali
err分享
err收藏
Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages
errJOURNAL OF INTELLIGENT MANUFACTURING
IF7.4
err2025-02-01
err0
errOAAI
errQasaimeh, Qais; Liu, Jia; Silva, Daniel F.; Qasaimeh, Awni; Evans, John L.; Hamasha, Sa'd
err分享
err收藏
The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys
errMATERIALS
IF3.2
err2022-09-29
err21
errOAAI
errAkkara, Francy John; Hamasha, Sa'd; Alahmer, Ali; Evans, John; Belhadi, Mohamed El Amine; Wei, Xin
err分享
err收藏
Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling
errMATERIALS
IF3.2
err2017-04-26
err23
errOAAI
errShen, Chaobo; Hai, Zhou; Zhao, Cong; Zhang, Jiawei; Evans, John L.; Bozack, Michael J.; Suhling, Jeffrey C.
err分享
err收藏
The private provision of urban infrastructure: Financial intermediation through long-term contracts
errURBAN STUDIES
IF4.1
err1998-02-01
err18
errOAAI
errClark, GL; Evans, J
err分享
err收藏

研究方向

暂无研究方向
合作学者
合作期刊
J
Jeffrey C. Suhling
H 指数: 43 · 论文数: 476
G
Gordon L. Clark
H 指数: 42 · 论文数: 396
M
Michael J. Bozack
H 指数: 39 · 论文数: 200
A
Ali Alahmer
H 指数: 37 · 论文数: 178
J
Jiawei Zhang
H 指数: 26 · 论文数: 86
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