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收藏Scalable Van Der Waals Integration of III-N Devices Over 2D Materials for CMOS-Compatible Architectures用于CMOS兼容架构的iii-n器件在2D材料上的可扩展范德华集成
Lee, G; Oh, Y; Hwang, J; Hong, SW; Song, SH; Shin, KW; Lee, J; Yoon, S; Kim, DK; Kim-Lee, HJ; Kim, D; Kim, J; Shin, DC; Yu, MC; Lee, J; Park, JY; Lee, HM; Kim, SW; Na, B; Yun, S; Kim, Y; Jeong, J; Park, C; Hwang, K; Yoo, G
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收藏1.6-Inch Transparent Micro-Display with Pixel Circuit Integrated microLED Chip Array by Misalignment-Free Transfer1.6英寸透明微显示器,带像素电路集成微发光二极管芯片阵列,无错位转移
Hwang, K; Hwang, J; Kim, Y; Song, S; Kong, K; Oh, Y; Chung, D; Yu, MC; Kim, D; Park, JY; Moon, J; Kim, S; Kim, TG; Lee, G; Yeom, MJ; Kim, J; Shin, DC; Kim, DK; Hong, SW; Kim-Lee, HJ; Jeong, J; Lee, H; Yoo, G
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收藏Wafer-scale alignment and integration of micro-light-emitting diodes using engineered van der Waals forces使用工程范德华力对微发光二极管进行晶圆级对准和集成
Hwang, Junsik; Kim-Lee, Hyun-Joon; Hong, Seog Woo; Park, Joon-Yong; Kim, Dong Kyun; Kim, Dongho; Song, Sanghoon; Jeong, Jonghyun; Kim, Yongchan; Yeom, Min Jae; Yu, Min-chul; Kim, Joosung; Park, Younghwan; Shin, Dong-Chul; Kang, Sungjin; Shin, Jai-Kwang; Kim, Yongsung; Yoon, Euijoon; Lee, Hojin; Yoo, Geonwook; Jeong, Jaewook; Hwang, Kyungwook
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