Ravi Mahajan - Publications, H-index & Citations

Ravi Mahajan

Intel Corporation

25H指数

164论文数

3.8K被引数

收录论文 11

发表时间

Scaling EMIB—A Comprehensive Architecture Portfolio for Localized Interconnects EMIB扩展——一套用于局部互连的全面架构组合

IEEE Transactions on Electron Devices

IF3.2

2025-07-01

PREAI

Ravi Mahajan; Rahul Manepalli; Kemal Aygün; Kaladhar Radhakrishnan; Sujit Sharan

Advanced packaging of chiplets for future computing needs

NATURE ELECTRONICS

IF40.9

2024-06-27

PREAI

Das Sharma, Debendra; Mahajan, Ravi V.

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

JOURNAL OF LIGHTWAVE TECHNOLOGY

IF4.8

2022-01-15

PREAI

Mahajan, Ravi; Li, Xiaoqian; Fryman, Joshua; Zhang, Zhichao; Nekkanty, Srikant; Tadayon, Pooya; Jaussi, James; Shumarayev, Sergey; Agrawal, Ankur; Jadhav, Susheel; Singh, Kumar Abhishek; Alduino, Andrew; Gujjula, Sushrutha; Chiu, Chia-Pin; Nordstog, Thomas; Hosseini, Kaveh J.; Sane, Sandeep; Deshpande, Nitin; Aygun, Kemal; Sarkar, Arnab; Dobriyal, Priyanka; Pothukuchi, Suresh; Pogue, Vanessa A.; Hui, David

Interfacial fracture strength and toughness of copper/epoxy-resin interfaces

ACTA MATERIALIA

IF9.3

2016-01-01

PREAI

Badwe, Nilesh; Mahajan, Ravi; Sieradzki, Karl

Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications

JOURNAL OF MATERIALS SCIENCE

IF3.9

2014-08-06

PREAI

Liu, J.; Sahaym, U.; Dutta, I.; Raj, R.; Renavikar, M.; Sidhu, R. S.; Mahajan, R.

Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications

JOURNAL OF MATERIALS SCIENCE

IF3.9

2011-11-01

PREAI

Liu, J.; Kumar, P.; Dutta, I.; Raj, R.; Sidhu, R.; Renavikar, M.; Mahajan, R.

On-chip cooling by superlattice-based thin-film thermoelectrics

NATURE NANOTECHNOLOGY

IF34.9

2009-01-25

793

PREAI

Chowdhury, Ihtesham; Prasher, Ravi; Lofgreen, Kelly; Chrysler, Gregory; Narasimhan, Sridhar; Mahajan, Ravi; Koester, David; Alley, Randall; Venkatasubramanian, Rama

A comparison of impression and compression creep behavior of polycrystalline Sn

JOURNAL OF MATERIALS SCIENCE

IF3.9

2007-02-23

PREAI

Park, C.; Long, X.; Haberman, S.; Ma, S.; Dutta, I.; Mahajan, R.; Jadhav, S. G.

Cooling a microprocessor chip

PROCEEDINGS OF THE IEEE

IF25.9

2006-08-01

359

PREAI