Suresh K. Sitaraman - Publications, H-index & Citations

Suresh K. Sitaraman

university system of georgia

28H指数

314论文数

3.7K被引数

收录论文 17

发表时间

Board-Level Reliability of 100 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications 100×100 mm大尺寸玻璃封装的板级可靠性：面向AI/HPC应用的翘曲与热机械可靠性

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-02-01

PREAI

Lee, Yongwon; Godbole, Kaushik; Park, Hyunggyu; Moon, Kyoung-Sik; Bakir, Muhannad; Sitaraman, Suresh K.

Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications

SCIENTIFIC REPORTS

IF3.9

2023-08-02

OAAI

Hu, Kexin; Zhou, Yi; Sitaraman, Suresh K.; Tentzeris, Manos M.

Biaxial Inflation Stretch Test for Flexible Electronics

ADVANCED ENGINEERING MATERIALS

IF3.3

2021-03-05

PREAI

Stewart, Benjamin G.; Sitaraman, Suresh K.

Fatigue crack propagation in a copper/epoxy molding compound interface as impacted by mode-mixity

INTERNATIONAL JOURNAL OF FATIGUE

IF6.8

2019-08-01

PREAI

Samet, David; Taylor, Christine; Rambhatla, V. N. N. Trilochan; Sitaraman, Suresh K.

Multigated Carbon Nanotube Field Effect Transistors-Based Physically Unclonable Functions As Security Keys 基于多栅碳纳米管场效应晶体管的物理不可克隆功能作为安全密钥

IEEE INTERNET OF THINGS JOURNAL

IF8.9

2019-02-01

PREAI

Kumar, Nitish; Chen, Jialuo; Kar, Monodeep; Sitaraman, Suresh K.; Mukhopadhyay, Saibal; Kumar, Satish

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints Ag3Sn化合物在微接头中的粗化行为

MATERIALS

IF3.2

2018-12-10

OAAI

Tian, Ye; Ren, Ning; Zhao, Zhihua; Wu, Fengshun; Sitaraman, Suresh K.

Scaling effect on Ag3 Sn growth behaviours in micro-joints for flip chip assemblies

SCIENCE AND TECHNOLOGY OF WELDING AND JOINING

IF3.7

2018-10-01

PREAI

Tian, Ye; Ren, Ning; Jian, Xiaoxia; Shang, Shuanjun; Sitaraman, Suresh K.

A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices

SCIENTIFIC REPORTS

IF3.9

2016-12-23

OAAI

Fang, Yunnan; Hester, Jimmy G. D.; Su, Wenjing; Chow, Justin H.; Sitaraman, Suresh K.; Tentzeris, Manos M.

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

APPLIED PHYSICS LETTERS

IF3.6

2014-09-19

PREAI

Liu, Xi; Thadesar, Paragkumar A.; Taylor, Christine L.; Oh, Hanju; Kunz, Martin; Tamura, Nobumichi; Bakir, Muhannad S.; Sitaraman, Suresh K.

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation 聚合物基体中六方氮化硼血小板的磁性排列: 用于电子封装的高性能各向异性聚合物复合材料

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2013-07-15

437

PREAI

Lin, Ziyin; Liu, Yan; Raghavan, Sathyanarayanan; Moon, Kyoung-sik; Sitaraman, Suresh K.; Wong, Ching-ping

Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias

APPLIED PHYSICS LETTERS

IF3.6

2013-07-10

OAAI

Liu, X.; Thadesar, P. A.; Taylor, C. L.; Kunz, M.; Tamura, N.; Bakir, M. S.; Sitaraman, S. K.

ROM: a reliability knowledge representation for collaborative system design

ENGINEERING WITH COMPUTERS

IF4.9

2009-08-07

PREAI

Kim, Injoong; Peak, Russell S.; Sitaraman, Suresh K.

ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems

ENGINEERING WITH COMPUTERS

IF4.9

2008-01-08

PREAI

Zeng, Sai; Peak, Russell S.; Xiao, Angran; Sitaraman, Suresh

Stress-induced birefringence in siloxane polymer waveguides

APPLIED PHYSICS LETTERS

IF3.6

2007-08-22

PREAI

Hegde, Shashikant G.; Sitaraman, Suresh K.

Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures

INTERNATIONAL JOURNAL OF FATIGUE

IF6.8

2004-09-01

PREAI

Pucha, RV; Ramakrishna, G; Mahalingam, S; Sitaraman, SK

Damage metric-based mapping approaches for developing accelerated thermal cycling guidelines for electronic packages

INTERNATIONAL JOURNAL OF DAMAGE MECHANICS

IF3.9

2001-07-01

PREAI

Pucha, RV; Pyland, J; Sitaraman, SK

Optimizing Thermal Performance in 2.5D Systems Using Embedded Isolators 使用嵌入式隔离器优化2.5D系统的热性能

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

IF3.8

PREAI

George Karfakis; Myriam Bouzidi; Yunhyeok Im; Alexander Graening; Suresh K. Sitaraman; Puneet Gupta

研究方向