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N

Nikolay Dimitrov

department of chemistry, binghamton university, binghamton, new york 13902, united states of america

33H指数
210论文数
6.9K被引数
收录论文 63
发表时间
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Facile and Scalable Electrochemical Synthesis of Nanoporous Copper Films via Reduction of Copper(I) Bromide通过还原溴化亚铜实现简易且可扩展的纳米多孔铜薄膜电化学合成
errJournal of The Electrochemical Society
IF3.3
err2025-12-03
err0
errOAAI
errA. F. Pasha; K. Mull; A. T. Pacileo; N. Dimitrov
err分享
err收藏
Influence of pH on Indium Deposition Rates: A Comprehensive Electrochemical Analysis
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2025-01-24
err0
errOAAI
errPasha, A. F.; Larson, Z. I.; Borgesen, P.; Dimitrov, N.
err分享
err收藏
New Electrochemical Approach for Synthesis of Nanoporous Silver
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2024-09-11
err0
errOAAI
errLei, Zhen; Mull, Ksenya; Dimitrov, Nikolay
err分享
err收藏
All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2024-08-01
err3
PREAI
errNjuki, Michael; Pasha, Abdullah Faisal; Das, Ronit; Borgesen, Peter; Dimitrov, Nikolay
err分享
err收藏
Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-01-05
err1
PREAI
errLei, Zhen; Borgesen, Peter; Dimitrov, Nikolay
err分享
err收藏
Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics
errACCOUNTS OF CHEMICAL RESEARCH
IF17.7
err2023-06-08
err5
PREAI
errCastillo, Ezer; Njuki, Michael; Pasha, Abdullah Faisal; Dimitrov, Nikolay
err分享
err收藏
All-electrochemical synthesis of tunable fine-structured nanoporous copper films
errMRS BULLETIN
IF4.9
err2022-08-02
err7
PREAI
errCastillo, Ezer; Zhang, Jackson; Dimitrov, Nikolay
err分享
err收藏
Enhanced voiding in Cu-Sn micro jointsCu-sn微接头的增强空隙
errMATERIALS RESEARCH BULLETIN
IF5.7
err2022-06-01
err11
PREAI
errNjuki, M.; Thekkut, S.; Sivasubramony, R.; Greene, C. M.; Shahane, N.; Thompson, P.; Mirpuri, K.; Borgesen, P.; Dimitrov, N.
err分享
err收藏
Nanoporous Pd-Cu thin films as highly active and durable catalysts for oxygen reduction in alkaline media
errELECTROCHIMICA ACTA
IF5.6
err2021-07-01
err21
errOAAI
errXie, Yunxiang; Li, Can; Castillo, Ezer; Fang, Jiye; Dimitrov, Nikolay
err分享
err收藏
Electrodeposition of Zn-rich CuxZn(1-x) Films with Controlled Composition and Morphology
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-06-24
err5
PREAI
errCastillo, Ezer; Dimitrov, Nikolay
err分享
err收藏
Filling in nanoporous gold with silver via bulk deposition and surface-limite d re dox replacement approaches
errELECTROCHIMICA ACTA
IF5.6
err2021-06-01
err6
PREAI
errCastillo, Ezer; Xie, Yunxiang; Dimitrov, Nikolay
err分享
err收藏
Enhanced ORR Kinetics on Au-Doped Pt-Cu Porous Films in Alkaline Media碱性介质中金掺杂pt-cu多孔膜的增强ORR动力学
errACS CATALYSIS
IF13.1
err2020-08-07
err71
PREAI
errXie, Yunxiang; Yang, Yao; Muller, David A.; Abruna, Hector D.; Dimitrov, Nikolay; Fang, Jiye
err分享
err收藏
Ultralow Pt loading nanoporous Au-Cu-Pt thin film as highly active and durable catalyst for formic acid oxidation超低Pt负载纳米多孔au-cu-pt薄膜作为甲酸氧化的高活性和耐久性催化剂
errAPPLIED CATALYSIS B-ENVIRONMENT AND ENERGY
IF21.1
err2020-04-01
err55
PREAI
errXie, Yunxiang; Dimitrov, Nikolay
err分享
err收藏
Synthesis of Nanoporous Au-Cu-Pt Alloy as a Superior Catalyst for the Methanol Oxidation Reaction
errCHEMELECTROCHEM
IF3.5
err2020-02-10
err18
PREAI
errXie, Yunxiang; Li, Can; Razek, Sara A.; Fang, Jiye; Dimitrov, Nikolay
err分享
err收藏
Copper redistribution during corrosion of aluminum alloys
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err126
PREAI
errDimitrov, N; Mann, JA; Sieradzki, K
err分享
err收藏
Dealloying below the critical potential
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-12-06
err95
PREAI
errWagner, K; Brankovic, SR; Dimitrov, N; Sieradzki, K
err分享
err收藏
Highly Active and Durable CuxAu(1-x) Ultrathin-Film Catalysts for Nitrate Electroreduction Synthesized by Surface-Limited Redox Replacement
errACS OMEGA
IF4.3
err2018-12-18
err16
errOAAI
errXie, Yunxiang; Dimitrov, Nikolay
err分享
err收藏
NTBC and MTT Reduction Electrochemistry: Impact on Cu Superconformal Plating for Fabrication of Glass Interposers
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2018-11-10
err0
PREAI
errLi, Jiaxin; Dimitrov, Nikolay
err分享
err收藏
Electrochemical Atomic Layer Deposition by Surface Limited Redox Replacement of Pd Thin Films in One-Cell Configuration Using Cu UPD Layers: Interrupting Mass-Transport Limited Growth
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2018-09-14
err6
errOAAI
errAchari, Innocent; Ambrozik, Stephen; Dimitrov, Nikolay
err分享
err收藏
Anion effects on the interfacial alloying in successively electrodeposited Cu and Au ultrathin films
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2018-09-01
err8
errOAAI
errAmbrozik, Stephen; Dimitrov, Nikolay
err分享
err收藏

研究方向

暂无研究方向
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