Zhi‐Quan Liu - Publications, H-index & Citations

Zhi‐Quan Liu

Shenzhen Institutes of Advanced Technology

38H指数

345论文数

8.3K被引数

收录论文 82

发表时间

Revealing crystal defects induced Kirkendall voiding in Cu/Sn solder joints 揭示由晶体缺陷诱发的Cu/Sn焊点中的Kirkendall空洞

Rare Metals

IF11

2025-07-16

PREAI

Qi Zhang; Zhiqiang Zhang; Fangyuan Zeng; Wenjie Li; Jinhao Liu; Shubo Ai; Yun Zheng; Zhe Li; Huaiyu Shao; Zhi-Quan Liu

Revealing the Mechanical Properties and Fracture Mechanism of Ag Paste Sintered Solder by Two Different Preparation Methods 揭示两种不同制备方法下Ag浆料烧结焊料的力学性能和断裂机理

MATERIALS

IF3.2

2025-03-24

OAAI

Liang, Jialong; Yang, Hao-Kun; Huang, Xingming; Gao, Li-Yin; Liu, Zhi-Quan

Ferroelectric Tunable Nonvolatile Polarization Detection Based on 2H α-In2Se3 基于2H α-In2Se3的铁电可调非易失性极化检测

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2025-03-06

PREAI

Liu, TZ; Huang, X; Han, ZX; Bai, QH; Guo, Y; Chen, H; Wang, L; Luo, C; Quan, BG; Yang, HF; Zheng, WY; Liu, ZQ; Liu, BL; Liao, WG; Gu, CZ

Study on the Cu Microstructure and Sn Supply Affecting the Interfacial Reaction of Cu/Sn Nanowires for Advanced Electronic Packaging 影响先进电子封装用Cu/Sn纳米线界面反应的Cu微结构及Sn供给研究

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2025-02-05

PREAI

Chen, Ke-Xin; Li, Rui-Chong; Gao, Li-Yin; Meng, Zhi-Chao; Liu, Chang; Liu, Zhi-Quan

Polymorphic phases in 2D In2Se3: fundamental properties, phase transition modulation methodologies and advanced applications 二维In2Se3中的多形相：基本性质、相变调制方法与先进应用

NANOSCALE HORIZONS

IF6.6

2025-01-01

PREAI

Zheng, Weiying; Liu, Zhiquan; Xi, Guoqiang; Liu, Tengzhang; Wang, Dingguan; Wang, Lin

Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding 使用合成聚季铵盐整平剂进行铜柱电镀及其对SAC305/Cu焊点空隙的耦合作用

MATERIALS

IF3.2

2024-11-05

OAAI

Li, Wenjie; Li, Zhe; Zeng, Fang-Yuan; Zhang, Qi; Guo, Liwei; Li, Dan; Ma, Yong-Hui; Liu, Zhi-Quan

Resistive switching behaviors and conduction mechanisms of IGZO/ZnO bilayer heterostructure memristors

APL MATERIALS

IF4.5

2024-11-01

OAAI

Wang, Xiongfeng; Guo, Zhenyi; Zheng, Weiying; Liu, Zhiquan; Liu, Tengzhang; Chen, Xiaopei; Cai, Peimian; Zhang, Qiyan; Liao, Wugang

Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air 在环境空气中 (111) 取向的纳米孪晶Cu基板上无压Ag烧结的键合行为和质量

MATERIALS

IF3.2

2024-09-09

OAAI

Huang, Xingming; He, Wei; Liang, Jialong; Yang, Hao-Kun; Zhou, Chunliang; Liu, Zhi-Quan

Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour

CHEMICAL ENGINEERING JOURNAL

IF13.2

2024-09-01

PREAI

Chen, Ke-Xin; Gao, Li-Yin; Meng, Zhi-Chao; Liu, Zhi-Quan

Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

MATERIALS CHARACTERIZATION

IF5.5

2024-08-01

PREAI

Zhang, Minghui; Gao, Li-Yin; Zhang, Qi; Wang, Dawei; Dong, Wei; Zhao, Ning; Liu, Zhi-Quan

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

MATERIALS

IF3.2

2024-06-11

OAAI

Li, Wenjie; Guo, Liwei; Li, Dan; Liu, Zhi-Quan

Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

ADVANCED ENGINEERING MATERIALS

IF3.3

2024-04-09

PREAI

Liu, Jin-Hao; Wan, Yong-Qiang; Gao, Li-Yin; Cui, Xian-Wei; Liu, Zhi-Quan

Boosting Li ion kinetics in H-Co3O4@CNT electrode by synergic design of CNT coating and hollow structure

JOURNAL OF POWER SOURCES

IF7.9

2024-04-01

PREAI

Zhang, Qi; Liu, Yinan; Zheng, Yun; Guo, Yan; Huang, Yike; He, Liqing; Zhao, Huajun; Li, Zhe; Shen, Jingjun; Xu, Jincheng; Shen, Yingying; Zhang, Hebin; Guo, Junpo; Liu, Zhi- Quan; Shao, Huaiyu

Mechanical behavior of high entropy ceramic (TiZrHfVNb)C5 under extreme conditions: A functional

CERAMICS INTERNATIONAL

IF5.6

2024-03-01

PREAI

Wang, Zesong; Liu, Guotan; Gao, Weihong; Yang, Yuxi; Zheng, Ting; Liu, Zhi-Quan; Li, Peifeng; Yan, Mufu; Fu, Yu-dong

Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding

APPLIED SURFACE SCIENCE

IF6.9

2024-03-01

PREAI

Zhang, Minghui; Gao, Li-Yin; Wang, Yu-Xi; Dong, Wei; Zhao, Ning; Liu, Zhi-Quan

The mechanical property and microstructural thermal stability of gradient-microstructured nanotwinned copper films electrodeposited on the highly (111)-orientated substrates

MATERIALS TODAY COMMUNICATIONS

IF4.5

2024-03-01

PREAI

Zhang, Yu-Bo; Gao, Li-Yin; Tao, Jun-Lei; Wang, Yu-Xi; Liu, Zhi-Quan; Sun, Rong

Improving Electromigration Resistance of Fine-Pitch Redistributed Layer Using Graphene-Doped Twinned Copper Composites

ADVANCED ENGINEERING MATERIALS

IF3.3

2024-02-27

PREAI

Shi, Zixiang; Wang, Zesong; Gao, Li-Yin; Zhong, Cheng; Li, Peifeng; Liu, Zhi-Quan; Sun, Rong

Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering

MATERIALS CHARACTERIZATION

IF5.5

2024-02-01

PREAI

Lu, Xiao; Zhang, Liang; Liu, Zhi-Quan; Gao, Li -Yin; Chen, Chen; Wu, Chuan-Jiang; Huang, Xi; Deng, Kai

Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium (Jun, 10.1007/s12540-023-01489-5, 2023)

METALS AND MATERIALS INTERNATIONAL

IF4

2023-07-20

OAAI

Liu, Xing-Quan; Li, Zhe; Peng, Zhen-Jia; Wang, Rui-Xun; Liu, Zhi-Quan

Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2023-07-01

OAAI

Lu, Xiao; Zhang, Liang; Guo, Yong-huan; Gao, Li-Yin; Wang, Xi; Chen, Chen; Liu, Zhi-Quan

研究方向