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A
A. Yu. Belov
Paul Drude Institute for Solid State Electronics
14
H指数
50
论文数
596
被引数
0
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13
发表时间
发表时间
IF
被引数
Experimental Relaxation Volume of Al Impurity in Si(Al) Thermomigrated Structures
JOURNAL OF PHYSICAL CHEMISTRY C
IF
3.2
2025-03-01
0
PRE
AI
Lomov, Andrey A.; Belov, Alexander Yu.; Punegov, Vasily I.; Seredin, Boris M.; Simakin, Sergey G.
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Strain and x-ray diffraction from axial nanowire heterostructures
PHYSICAL REVIEW B
IF
3.7
2012-03-02
38
PRE
AI
Kaganer, V. M.; Belov, A. Yu.
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Simulation of microstructure evolution in polycrystalline ferroelectrics-ferroelastics
多晶铁电体-铁弹性体中微观结构演变的模拟
ACTA MATERIALIA
IF
9.3
2006-08-01
22
PRE
AI
Belov, A. Yu.; Kreher, W. S.
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Evolution of sp2 networks with substrate temperature in amorphous carbon films:: Experiment and theory -: art. no. 014120
PHYSICAL REVIEW B
IF
3.7
2005-07-20
68
PRE
AI
Gago, R; Vinnichenko, M; Jäger, HU; Belov, AY; Jiménez, I; Huang, N; Sun, H; Maitz, MF
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Viscoplastic models for ferroelectric ceramics
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
IF
6.2
2005-01-01
18
PRE
AI
Belov, AY; Kreher, WS
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ta-C deposition simulations:: Film properties and time-resolved dynamics of film formation -: art. no. 024201
PHYSICAL REVIEW B
IF
3.7
2003-07-09
60
PRE
AI
Jäger, HU; Belov, AY
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Atomic scale simulation of structural relaxation processes in tetrahedral amorphous carbon
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2003-03-01
15
PRE
AI
Belov, AY
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Atomistic study of ion-beam deposition conditions for hard amorphous carbon
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2003-03-01
4
PRE
AI
Belov, AY; Jäger, HU
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Calculation of intrinsic stresses in amorphous carbon films grown by molecular dynamics simulation:: from atomic to macroscopic scale
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2002-05-01
19
PRE
AI
Belov, AY; Jäger, HU
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Atomic processes at bonded Si-interfaces studied by molecular dynamics: tayloring densities and bandgaps?
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
2002-05-01
7
PRE
AI
Scheerschmidt, K; Conrad, D; Belov, A
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Elastic constants of tetrahedral amorphous carbon films:: the effect of intrinsic stresses
SURFACE & COATINGS TECHNOLOGY
IF
6.1
2002-03-01
9
PRE
AI
Belov, AY; Jäger, HU
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Enhanced semi-empirical potentials in molecular dynamics simulations of wafer bonding
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF
4.6
2000-03-01
4
PRE
AI
Scheerschmidt, K; Conrad, D; Belov, A; Timpel, D
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Molecular dynamics modelling of silicon wafer bonding
COMPUTATIONAL MATERIALS SCIENCE
IF
3.3
1997-12-01
6
PRE
AI
Scheerschmidt, K; Conrad, D; Belov, A; Gosele, U
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研究方向
暂时未获取到该数据
合作学者
合作期刊
U
U. Gösele
H 指数: 108 · 论文数: 906
N
Nan Huang
H 指数: 54 · 论文数: 504
M
Manfred F. Maitz
H 指数: 54 · 论文数: 212
I
I. Jiménez
H 指数: 39 · 论文数: 150
H
Hong Sun
H 指数: 37 · 论文数: 257
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