John Ryan C. Dizon - Publications, H-index & Citations

John Ryan C. Dizon

vit vellore

24H指数

86论文数

4.2K被引数

收录论文 10

发表时间

Flexible, Interdigitated Shape Memory Supercapacitor Based on Reduced Graphene Oxide/Nanocellulose Aqueous Ink 基于还原氧化石墨烯/纳米纤维素水性油墨的柔性叉指型形状记忆超级电容器

ACS APPLIED NANO MATERIALS

IF5.5

2025-04-03

PREAI

Nargatti, KI; Ahankari, SS; Dizon, JRC; Subramaniam, RT

Potential of 3D printing in revolutionizing solar-driven interfacial evaporation for clean water supply - A review 3D打印在变革太阳能驱动界面蒸发以提供清洁水源方面的潜力——综述

APPLIED MATERIALS TODAY

IF6.9

2025-04-01

PREAI

Torres, Andrea Shane M.; Gache, Ciara Catherine L.; Tuazon, Brian J.; Martinez, Dan William C.; Kim, Hyeon Tae; Tijing, Leonard D.; Dizon, John Ryan C.

Environmentally Friendly Water-Based Reduced Graphene Oxide/Cellulose Nanofiber Ink for Supercapacitor Electrode Applications

ACS OMEGA

IF4.3

2024-02-27

OAAI

Nargatti, Kiran I.; Ahankari, Sandeep S.; Dizon, John Ryan C.; Subramaniam, Ramesh T.

Graphene-Based Inks for Flexible Supercapacitor Electrodes: A Review 用于柔性超级电容器电极的石墨烯基油墨: 综述

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2023-12-18

PREAI

Nargatti, Kiran I.; Pathak, Tanaya S.; Ahankari, Sandeep S.; Dizon, John Ryan C.; Subramaniam, Ramesh T.

Quality prediction and classification of resistance spot weld using artificial neural network with open-sourced, self-executable and GUI-based application tool Q-Check

SCIENTIFIC REPORTS

IF3.9

2023-02-21

OAAI

Abd Halim, Suhaila; Manurung, Yupiter H. P.; Raziq, Muhamad Aiman; Low, Cheng Yee; Rohmad, Muhammad Saufy; Dizon, John R. C.; Kachinskyi, Vladimir S.

3D printing for membrane separation, desalination and water treatment 用于膜分离、脱盐和水处理的3D打印

APPLIED MATERIALS TODAY

IF6.9

2020-03-01

174

OAAI

Tijing, Leonard D.; Dizon, John Ryan C.; Ibrahim, Idris; Nisay, Arman Ray N.; Shon, Ho Kyong; Advincula, Rigoberto C.

Advances in 3D printing of thermoplastic polymer composites and nanocomposites 热塑性聚合物复合材料和纳米复合材料的3D打印研究进展

PROGRESS IN POLYMER SCIENCE

IF26.1

2019-11-01

357

PREAI

Valino, Arnaldo D.; Dizon, John Ryan C.; Espera, Alejandro H., Jr.; Chen, Qiyi; Messman, Jamie; Advincula, Rigoberto C.

3D-printing and advanced manufacturing for electronics 3d打印和电子先进制造

PROGRESS IN ADDITIVE MANUFACTURING

IF5.4

2019-02-04

196

PREAI

Espera, Alejandro H.; Dizon, John Ryan C.; Chen, Qiyi; Advincula, Rigoberto C.

Numerical analysis of stress distribution in Cu-stabilized GdBCO CC tapes during anvil tests for the evaluation of transverse delamination strength

SUPERCONDUCTOR SCIENCE & TECHNOLOGY

IF4.2

2014-03-27

PREAI

Dizon, John Ryan C.; Gorospe, Alking B.; Shin, Hyung-Seop

The strain effect on critical current in YBCO coated conductors with different stabilizing layers

SUPERCONDUCTOR SCIENCE & TECHNOLOGY

IF4.2

2005-11-07

103

PREAI

Shin, HS; Kim, KH; Dizon, JRC; Kim, TY; Ko, RK; Oh, SS

研究方向