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Byunghoon Lee

university of california san diego

14H指数
77论文数
638被引数
收录论文 22
发表时间
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Insights on Covalent Attachment of a Re Bipyridyl Catalyst onto p-Si(111) Using an Alkyl Linker for Photoelectrochemical CO2 Reduction利用烷基连接剂将Re-联吡啶催化剂共价锚定在p-Si(111)上用于光电化学CO2还原的见解
errInorganic Chemistry
IF4.7
err2026-04-21
err0
PREAI
errByunghoon Lee; Christopher J. Miller; Jessica G. Freeze; Rajiv Ramanujam Prabhakar; Glenda Chen; Saya Okuno; Julianne S. Lampert; Victor S. Batista; Clifford P. Kubiak
err分享
err收藏
Investigation of the mechanical properties of Sn-Bi-In solders for intermediate low-temperature applications研究适用于中低温应用的Sn-Bi-In焊料的力学性能
errJournal of Alloys and Compounds
IF6.3
err2026-03-02
err0
PREAI
errHoon Choi; Ju-Hyeon Kim; Hyun-Dong Lee; Seok-Won Lee; Eun-Ho Lee; Byunghoon Lee; Bong-Min Song; Hoo-Jeong Lee
err分享
err收藏
A Reexamination of CO2 Reduction with Fe2S2 Hydrogenase Mimics: Lessons in Using a Hydrogen Evolution Reaction Catalyst for CO2 to Formate CatalysisCO2还原中Fe2S2氢化酶模拟物的重新评估：使用氢气析出反应催化剂进行CO2到甲酸盐催化反应的启示
errCHEMELECTROCHEM
IF3.5
err2025-05-12
err0
errOAAI
errMiller, Christopher J.; Lee, Byunghoon; Barrett, Jacob A.; Palasz, Joseph M.; Chan, Thomas; Shandilya, Anoushka; Kubiak, Clifford P.
err分享
err收藏
Effect of familiarity, brand loyalty and food neophobicity on food acceptance: A case study of instant noodles with consumers in Seoul, Beijing, and Shanghai熟悉度、品牌忠诚度和食物厌恶感对食物接受度的影响：首尔、北京和上海消费者对方便面的案例研究
errCURRENT RESEARCH IN FOOD SCIENCE
IF7
err2025-01-01
err0
errOAAI
errXiao, Kaixin; Chung, Seo-Jin; Wong, Runrou; Lee, Byunghoon; Kim, Haeun; Zhu, Baoqing
err分享
err收藏
Engineering of uniform anisotropic interconnection system with polyimide films for flexible electronics用于柔性电子的聚酰亚胺薄膜均匀各向异性互连系统的工程设计
errAIN SHAMS ENGINEERING JOURNAL
IF5.9
err2024-12-01
err0
errOAAI
errHa, Heebo; Lee, Byunghoon; Choi, Sooyong; Qaiser, Nadeem; Kwon, Sera; Choi, Zungsun; Chen, Chih-Ming; Hwang, Byungil
err分享
err收藏
Steric Effects on CO2 Reduction with Substituted Mn(bpy)(CO)3X-Type Catalysts on Multiwalled Carbon Nanotubes Reveal Critical Mechanistic Details取代的Mn(bpy)(CO) 3x型催化剂对多壁碳纳米管还原CO2的空间效应揭示了关键的机理细节
errACS CATALYSIS
IF13.1
err2024-01-24
err2
PREAI
errDeluca, Emile E.; Chan, Thomas; Taylor, James M.; Lee, Byunghoon; Prabhakar, Rajiv Ramanujam; Kubiak, Clifford P.
err分享
err收藏
Photo-oxidative Crack Propagation in Transition Metal Dichalcogenides
errACS NANO
IF16
err2024-01-16
err0
PREAI
errBen-Smith, Andrew; Choi, Soo Ho; Boandoh, Stephen; Lee, Byung Hoon; Vu, Duc Anh; Nguyen, Huong Thi Thanh; Adofo, Laud Anim; Jin, Jeong Won; Kim, Soo Min; Lee, Young Hee; Kim, Ki Kang
err分享
err收藏
OHiFormer: Object-Wise Hierarchical Dependency-Based Transformer for Screen Summarization
errIEEE ACCESS
IF3.6
err2024-01-01
err0
errOAAI
errJi Han, Ye; Lee, Soyeon; Kim, Jin Sob; Lee, Byung Hoon; Han, Sung Won
err分享
err收藏
Tailorable Electronic and Electric Properties of Graphene with Selective Decoration of Silver Nanoparticles by Laser-Assisted Photoreduction
errNANOMATERIALS
IF4.3
err2022-10-11
err3
errOAAI
errSong, Inseon; Kim, Yujeong; Lee, Byung Hoon; Chae, Minji; Kim, Sooyeon; Yoon, ChangKyu; Joo, Min-Kyu; Shin, Jeeyoung; Kim, Soo Min; Ko, Changhyun
err分享
err收藏
Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics
errINTERMETALLICS
IF4.8
err2022-05-01
err6
PREAI
errHa, Hee-Bo; Lee, Byung Hoon; Qaiser, Nadeem; Seo, Youngjae; Kim, Jinyong; Koo, Ja Myeong; Hwang, Byungil
err分享
err收藏
Multiscale simulations for exploring photo-chemical processes to mitigate the critical dimension variability of contact holes in EUV lithography
errJOURNAL OF MATERIALS CHEMISTRY C
IF5.1
err2021-01-01
err4
PREAI
errPark, Sungwoo; Lee, Hyungwoo; Kim, Muyoung; Kim, Taegyeom; Lee, Byunghoon; Cho, Maenghyo
err分享
err收藏
Multiscale simulation of extreme ultraviolet nanolithography: impact of acid-base reaction on pattern roughness
errJOURNAL OF MATERIALS CHEMISTRY C
IF5.1
err2021-01-01
err16
PREAI
errLee, Hyungwoo; Park, Sungwoo; Kim, Muyoung; Moon, Junghwan; Lee, Byunghoon; Cho, Maenghyo
err分享
err收藏
A Post-Treatment Method to Enhance the Property of Aerosol Jet Printed Electric Circuit on 3D Printed Substrate
errMATERIALS
IF3.2
err2020-12-08
err5
errOAAI
errWang, Bing; Zhang, Haining; Choi, Joon Phil; Moon, Seung Ki; Lee, Byunghoon; Koo, Jamyeong
err分享
err收藏
Nanoscale-Dewetting-Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing基于纳米级去湿的微电子直接互连，用于转移印刷的确定性组装
errADVANCED MATERIALS
IF26.8
err2020-04-16
err26
PREAI
errLee, Ju Seung; Kang, Seung Ji; Shin, Joo Hwan; Shin, Yiel Jae; Lee, Byunghoon; Koo, Ja-Myeong; Kim, Tae-il
err分享
err收藏
Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages
errAPPLIED SURFACE SCIENCE
IF6.9
err2019-11-01
err27
PREAI
errJung, Kwang-Ho; Min, Kyung Deuk; Lee, Choong-Jae; Park, Bum-Geun; Jeong, Haksan; Koo, Ja-Myeong; Lee, Byunghoon; Jung, Seung-Boo
err分享
err收藏
Laser-Induced Graphene on Additive Manufacturing Parts激光诱导石墨烯在增材制造零件上的应用
errNANOMATERIALS
IF4.3
err2019-01-11
err31
errOAAI
errJiao, Lishi; Chua, Zhong Yang; Moon, Seung Ki; Song, Jie; Bi, Guijun; Zheng, Hongyu; Lee, Byunghoon; Koo, Jamyeong
err分享
err收藏
Multiscale Simulation Approach on Sub-10 nm Extreme Ultraviolet Photoresist Patterning: Insights from Nanoscale Heterogeneity of Polymer
errMACROMOLECULES
IF5.2
err2018-08-29
err29
PREAI
errKim, Muyoung; Moon, Junghwan; Choi, Joonmyung; Park, Sungwoo; Lee, Byunghoon; Cho, Maenghyo
err分享
err收藏
Monitoring defects on monolayer graphene using nematic liquid crystals
errOPTICS EXPRESS
IF3.3
err2015-05-20
err18
errOAAI
errLim, Young Jin; Lee, Byung Hoon; Kwon, You Ri; Choi, Young Eun; Murali, G.; Lee, Joong Hee; Van Luan Nguyen; Lee, Young Hee; Lee, Seung Hee
err分享
err收藏
C-Lock: Energy Efficient Synchronization for Embedded Multicore SystemsC-lock: 嵌入式多核系统的节能同步
errIEEE TRANSACTIONS ON COMPUTERS
IF3.8
err2014-08-01
err7
PREAI
errKim, Seung Hun; Lee, Sang Hyong; Jun, Minje; Lee, Byunghoon; Ro, Won Woo; Chung, Eui-Young; Gaudiot, Jean-Luc
err分享
err收藏
Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects
errACTA MATERIALIA
IF9.3
err2013-10-01
err30
PREAI
errLee, Byunghoon; Jeon, Haseok; Kwon, Kee-Won; Lee, Hoo-Jeong
err分享
err收藏

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Young Hee Lee 封面图
Young Hee Lee (Young Hee Lee)
H 指数: 124 · 论文数: 935
J
Joong Hee Lee
H 指数: 109 · 论文数: 678
V
Víctor S. Batista
H 指数: 79 · 论文数: 631
C
Clifford P. Kubiak
H 指数: 69 · 论文数: 563
T
Tae‐il Kim
H 指数: 65 · 论文数: 300
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