Tao‐Chih Chang - Publications, H-index & Citations

Tao‐Chih Chang

industrial technology research institute - taiwan

23H指数

147论文数

1.7K被引数

收录论文 25

发表时间

Dynamic Performance Evaluation of Bidirectional Bridgeless Interleaved Totem-Pole Power Factor Correction Boost Converter

MICROMACHINES

IF3

2025-02-16

OAAI

Cheng, Hsien-Chie; Jhu, Wen-You; Liu, Yu-Cheng; Zheng, Da-Wei; Liu, Yan-Cheng; Chang, Tao-Chih

Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications

MICROMACHINES

IF3

2023-06-30

OAAI

Cheng, Hsien-Chie; Liu, Yan-Cheng; Lin, Hsin-Han; Chiou, Shian-Chiau; Tzeng, Chih-Ming; Chang, Tao-Chih

Low temperature Ag-Ag direct bonding under air atmosphere

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2021-05-01

PREAI

Chang, Leh-Ping; Huang, Shin-Yi; Chang, Tao-Chih; Ouyang, Fan-Yi

Development of Cu-Ag pastes for high temperature sustainable bonding

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2017-01-01

PREAI

Hsiao, Ching-Huan; Kung, Wan-Ting; Song, Jenn-Ming; Chang, Jing-Yao; Chang, Tao-Chih

Single-Crystal Y2O3 Epitaxially on GaAs(001) and (111) Using Atomic Layer Deposition 使用原子层沉积在GaAs(001) 和 (111) 上外延单晶Y2O3

MATERIALS

IF3.2

2015-10-19

OAAI

Lin, Y. H.; Cheng, C. K.; Chen, K. H.; Fu, C. H.; Chang, T. W.; Hsu, C. H.; Kwo, J.; Hong, M.

Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material

VACUUM

IF3.9

2015-08-01

PREAI

Lee, Chang-Chun; Lin, Yu-Min; Guo, Yu-Huan; Zhan, Chau-Jie; Chang, Tao-Chih; Dzeng, Yu-Hua

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2013-12-01

PREAI

Ouyang, Fan-Yi; Jhu, Wei-Cheng; Chang, Tao-Chih

Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2008-07-01

PREAI

Lin, Ching-Tsung; Hsi, Chi-Shiung; Wang, Moo-Chin; Chang, Tao-Chih; Liang, Ming-Kann

Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging 时效过程中在Sn-9Zn-3.5Ag/Cu界面形成的金属间化合物的相变和形态

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2008-06-01

PREAI

Hon, Min-Hsiung; Chang, Tao-Chih; Wang, Moo-Chin

Microstructural evolution during the δ/σ/γ phase transformation of the SUS 309LSi stainless steel after aging under various nitrogen atmospheric ratios

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2008-02-01

PREAI

Hsieh, Chih-Chun; Lin, Dong-Yih; Chang, Tao-Chih

Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2006-09-01

PREAI

Chang, Tao-Chih; Wang, Jian-Wen; Wang, Moo-Chin; Hon, Min-Hsiung

Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2006-08-01

PREAI

Chang, Tao-Chih; Chou, Shih-Min; Hon, Min-Hsiung; Wang, Moo-Chin

Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2005-10-01

PREAI

Chang, TC; Wang, MC; Hon, MH

Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2005-03-01

PREAI

Wang, MC; Yu, SP; Chang, TC; Hon, MH

Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2004-11-01

PREAI

Wang, MC; Yu, SP; Chang, TC; Hon, MH

Microstructure development in 24Cr-14Ni-2Mn stainless steel after aging under various nitrogen/air ratios

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2004-09-01

PREAI

Lin, DY; Liu, GL; Chang, TC; Hsieh, HC

Synthesis of nanosized chitosan-poly(acrylic acid) particles by a dropping method 滴加法合成壳聚糖-聚丙烯酸纳米粒子

MACROMOLECULAR BIOSCIENCE

IF4.1

2004-04-13

PREAI

Chang, TC; Wang, JW; Hon, MH

Electrochemical behaviors of the Sn-9Zn-xAg lead-free solders in a 3.5 wt % NaCl solution

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2004-01-01

OAAI

Chang, TC; Hon, MH; Wang, MC; Lin, DY

Effect of Si contents on the growth-behavior of σ phase in SUS 309L stainless steels

SCRIPTA MATERIALIA

IF5.6

2003-11-01

PREAI

Lin, DY; Chang, TC; Liu, GL

Enhancement of the wettability and solder joint reliability at the Sn-9Zn0.5Ag lead-free solder alloy-Cu interface by Ag precoating

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2003-10-01

PREAI

Chang, TC; Hsu, YT; Hon, MH; Wang, MC

研究方向