Shuye Zhang - Publications, H-index & Citations

张

张墅野 (Shuye Zhang)

Harbin Institute of Technology

36H指数

228论文数

4.3K被引数

收录论文 102

发表时间

Atomic-scale mechanism of nickel-induced chemical heterogeneity and its role in intergranular cracking of Sn-based interconnects 镍诱导化学异质性的原子尺度机制及其在Sn基互连材料中晶间开裂中的作用

Composites Part B-Engineering

IF14.2

2026-08-19

PREAI

Jinhong Liu; Biao Zuo; Yaling Hua; Junfu Liu; Peng He; Shuye Zhang

Microwave-engineered, defect-regulated HEA-rGO heterointerfaces for broadband solar photothermal conversion 微波工程化、缺陷调控的高熵合金-还原氧化石墨烯异质界面用于宽光谱太阳能光热转换

Composites Part B-Engineering

IF14.2

2026-08-13

PREAI

Wenqiang Wan; Wenbo Duan; Kaiming Liang; Yifei Li; Xingyu Hu; Pengyu Zhu; Shuye Zhang

Unraveling degradation mechanisms, microstructure evolution, and thermal-mechanical behavior of TGV-Cu interconnects in advanced glass packaging under thermal cycling 揭示先进玻璃封装中TGV-Cu互连在热循环下的降解机制、微观结构演化和热-机械行为

Materials Science in Semiconductor Processing

IF4.6

2026-07-31

PREAI

Guoli Sun; Jinhong Liu; Ruiting Zhang; Yang Cheng; Jingyi Zhao; Jingjun Yuan; Jialin Zhang; Chengqian Wang; Shuye Zhang

Contact-localized plasmonic heating-driven non-equilibrium alloying of Cu@Ag core-shell nanoparticles: Interfacial diffusion, supersaturated solid solutions and defect arrest 接触定位的等离激元加热驱动下Cu@Ag核壳纳米粒子的非平衡合金化：界面扩散、过饱和固溶体和缺陷捕获

Journal of Materials Science & Technology

IF14.3

2026-07-28

PREAI

Zhenfeng Li; Yifan Zhao; Zixu Wang; Jinyang Li; Peng He; Shuye Zhang

Simultaneous Improvement of Bendability and Passive Daytime Radiative Cooling Performance in Multilayer Alumina Fiber Membranes 多层氧化铝纤维膜的弯曲性和被动日间辐射冷却性能的同时提升

Materials

IF3.2

2026-07-07

OAAI

Yating Zhuang; Chongyang Fu; Benxing Guo; Weihao Zhai; Xueting Ren; Depeng Fu; Xianchao Li; Guangzheng Wang; Qizheng Li; Yidan Xiao; Shuye Zhang; Hanbin Wang; Xiaoxiong Wang

Degradation mechanisms and microstructure evolution of TGV-Cu vertical interconnects in glass wafer under high-temperature aging 玻璃基板中TGV-Cu垂直互连结构的高温老化降解机制与微观结构演变

Materials Science in Semiconductor Processing

IF4.6

2026-05-11

PREAI

Guoli Sun; Jinhong Liu; Jingyi Zhao; Jialin Zhang; Zhaoyu Li; Shuye Zhang

Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging 聚氨酯改性丙烯酸树脂：高附着力与低介电焊料抗蚀剂用于先进封装

ACS Applied Polymer Materials

IF4.7

2026-05-08

PREAI

Jialin Zhang; Chuanyu Wu; Jie Liu; Shuye Zhang; Tao Wang; Xialei Lv; Jinhui Li; Guoping Zhang; Rong Sun

Synergistic Crystal Plasticity and Machine Learning Unraveling TSV-Cu Fatigue 协同晶体塑性力学与机器学习解析硅通孔-铜疲劳

International Journal of Mechanical Sciences

IF9.4

2026-04-29

PREAI

Xinyi Jing; Chenglong Zhou; Yew-Hoong Wong; Peng He; Shuye Zhang

High-Performance Soldering Achieved through an Energy-Efficient Magnetic Field-Assisted Microwave Hybrid Joining: A Multiscale Study via Molecular Dynamics and First-Principles Calculations 通过能量高效的磁场辅助微波复合连接实现的高性能焊接：基于分子动力学和第一性原理计算的多尺度研究

materials science and engineering: a

IF0

2026-02-12

PREAI

Shuai Zhang; Chen Zeng; Zhehao Gan; Jinhong Liu; Peng He; Tianran Ding; Weimin Long; Sujuan Zhong; Yew-Hoong Wong; Shuye Zhang

Balancing mechanical and thermal properties in epoxy-based solder resists through polyurethane-polyimide hybrids 通过聚氨酯-聚酰亚胺杂化材料平衡环氧基焊料抗剂的机械和热性能

Progress in Organic Coatings

IF7.3

2025-12-04

PREAI

Jialin Zhang; Wentao Hu; Tao Wang; Xialei Lv; Jinhui Li; Shuye Zhang; Guoping Zhang; Rong Sun

Machine learning-driven design and optimization of electronic packaging: applications and future developments 机器学习驱动的电子封装设计与优化：应用与未来发展趋势

JOURNAL OF MATERIALS INFORMATICS

IF5.6

2025-12-01

PREAI

Chen, Xiangyu; He, Sirui; Paik, Kyung-Wook; Wong, Yew-Hoong; Zhang, Shuye

Flat and Fabulous: Squeezing Elemental Metals into the 2D Realm 扁平而迷人：将元素金属压入二维领域

Chinese Journal of Structural Chemistry

IF10.3

2025-11-05

PREAI

Jinbo Pang; Shuye Zhang; Mark H. Rummeli; Hong Liu; Yufeng Hao; Weijia Zhou; Rafael G. Mendes

Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation SAC305-Ni@Sn复合焊料的微波混合连接：加热机制、机械可靠性与第一性原理计算

Materials Science and Engineering: A

IF0

2025-10-28

PREAI

Shuai Zhang; Jinhong Liu; Zhehao Gan; Te Li; Peng He; Tianran Ding; Weimin Long; Sujuan Zhong; Yew-Hoong Wong; Shuye Zhang

Effect of indium (In) on the microstructure evolution, grain orientation and mechanical behaviors of Sn58Bi/Cu solder joints under thermal cycling 铟（In）对Sn58Bi/Cu焊点在热循环下的微观结构演变、晶粒取向及力学行为的影响

Materials Characterization

IF5.5

2025-10-02

PREAI

Wenhao Wang; Lei Sun; Peng He; Liang Zhang; Jing Li; Shuye Zhang

Advances in micro/nanoparticle-enhanced Sn-based composite solders 微/纳米颗粒增强的Sn基复合焊料研究进展

International Journal of Minerals, Metallurgy and Materials

IF0

2025-09-10

PREAI

Kaiming Liang; Wenqiang Wan; Yifei Li; Xin Zhang; Xiangdong Ding; Peng He; Shuye Zhang

Electrical performance of Sm2O3/ZrO2 gate stacks on 4H-SiC via various O2/N2O gas concentrations 4H-SiC上Sm2O3/ZrO2栅堆叠通过不同O2/N2O气体浓度的电学性能

materials science materials in electronics

IF0

2025-09-05

PREAI

Ahmad Hafiz Jafarul Tarek; Tahsin Ahmed Mozaffor Onik; Chia Ching Kee; Chin Wei Lai; Bushroa Abd Razak; Prastika Krisma Jiwanti; Nurliyana Abu Hasan Sazalli; Shuye Zhang; Yew Hoong Wong

Novel technique for aluminum thin film thickness measurement using top view SEM-EDX in conjunction with electron beam simulation and machine learning 使用SEM-EDX与电子束模拟和机器学习相结合的新型铝薄膜厚度测量技术

ULTRAMICROSCOPY

IF2

2025-09-01

PREAI

Huq, Tahsinul; Wong, Yew Hoong; Chuah, Joon Huang; Tan, Chee-Keong; Zhang, Shuye

Two-Dimensional Metals Over; Inside; or Beneath Templates 模板上的、内部的或下方的二维金属

Research

IF10.7

2025-08-05

OAAI

Jinbo Pang; Shuye Zhang; Yufeng Hao; Hong Liu; Mark H. Rummeli; Weijia Zhou; Rafael G. Mendes