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Aleksandar Radisic

interuniversity microelectronics centre

24H指数
94论文数
2.1K被引数
收录论文 31
发表时间
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Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2019-05-06
err4
errOAAI
errHaesevoets, Karel P. S.; Radisic, Aleksandar; Vereecken, Philippe M.
err分享
err收藏
Differential Inhibition during Cu Electrodeposition on Ru: Combined Electrochemical and Real-Time TEM Studies
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2018-11-13
err12
PREAI
errVereecken, P. M.; Radisic, A.; Ross, F. M.
err分享
err收藏
Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2 for Thin-Film Energy Storage Devices
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2017-01-19
err6
PREAI
errDeheryan, Stella; Zargouni, Yafa; Sinha, Rochan; Put, Brecht; Radisic, Aleksandar; Heyns, Marc; Vereecken, Philippe M.
err分享
err收藏
The Effect of the Substrate Characteristics on the Electrochemical Nucleation and Growth of Copper
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2016-08-02
err9
PREAI
errNagar, Magi; Radisic, Aleksandar; Strubbe, Katrien; Vereecken, Philippe M.
err分享
err收藏
The Limitation and Optimization of Bottom-Up Growth Mode in Through Silicon Via Electroplating
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2015-10-07
err18
PREAI
errYang, Liu; Radisic, Aleksandar; Deconinck, Johan; Vereeeken, Philippe
err分享
err收藏
Electrodeposition and Characterization of Manganese Dioxide Thin Films on Silicon Pillar Arrays for 3D Thin-Film Lithium-Ion Batteries
errELECTRODEPOSITION FOR MICRO- AND NANO- BATTERY MATERIALS
IF0
err2014-08-26
err7
PREAI
errZargouni, Y.; Deheryan, S.; Radisic, A.; Cott, D. J.; Rochan, S.; Alouani, K.; Huyghebaert, C.; Vereecken, P. M.
err分享
err收藏
Electrochemical Deposition of Manganese Oxides on Carbon Nanosheets
errELECTRODEPOSITION FOR MICRO- AND NANO- BATTERY MATERIALS
IF0
err2014-08-26
err1
PREAI
errRadisic, A.; Cott, D. J.; Deheryan, S.; Etman, A. S.; Zargouni, Y.; Vereecken, P. M.
err分享
err收藏
Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below?
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2014-07-30
err4
PREAI
errArmini, S.; El-Mekki, Z.; Nagar, M.; Radisic, A.; Vereecken, P. M.
err分享
err收藏
The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating
errELECTROCHIMICA ACTA
IF5.6
err2014-05-01
err12
PREAI
errNagar, M.; Radisic, A.; Strubbe, K.; Vereecken, P. M.
err分享
err收藏
Effect of Film Morphology on the Li Ion Intercalation Kinetics in Anodic Porous Manganese Dioxide Thin Films
errJOURNAL OF PHYSICAL CHEMISTRY C
IF3.2
err2014-04-30
err19
PREAI
errEtman, Ahmed S.; Radisic, Aleksandar; Emara, Mahmoud M.; Huyghebaert, Cedric; Vereecken, Philippe M.
err分享
err收藏
Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2014-04-01
err36
PREAI
errYang, Liu; Radisic, Aleksandar; Deconinck, Johan; Vereecken, Philippe M.
err分享
err收藏
Wafer-scale Cu plating uniformity on thin Cu seed layers
errELECTROCHIMICA ACTA
IF5.6
err2013-08-01
err29
PREAI
errYang, Liu; Atanasova, Tanya; Radisic, Aleksandar; Deconinck, Johan; West, Alan C.; Vereecken, Philippe
err分享
err收藏
Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2013-06-25
err80
PREAI
errYang, Liu; Radisic, Aleksandar; Deconinck, Johan; Vereecken, Philippe M.
err分享
err收藏
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
errELECTROCHIMICA ACTA
IF5.6
err2013-06-01
err52
PREAI
errInoue, Fumihiro; Philipsen, Harold; Radisic, Aleksandar; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso
err分享
err收藏
The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
errELECTROCHIMICA ACTA
IF5.6
err2013-03-01
err26
PREAI
errNagar, M.; Radisic, A.; Strubbe, K.; Vereecken, P. M.
err分享
err收藏
Multi-scale modeling of direct copper plating on resistive non-copper substrates
errELECTROCHIMICA ACTA
IF5.6
err2012-09-01
err19
PREAI
errYang, Liu; Radisic, Aleksandar; Nagar, Magi; Deconinck, Johan; Vereecken, Philippe M.; West, Alan C.
err分享
err收藏
Island growth in electrodeposition电沉积中的岛生长
errJOURNAL OF PHYSICS D-APPLIED PHYSICS
IF3.2
err2011-10-21
err145
PREAI
errGuo, Lian; Oskam, Gerko; Radisic, Aleksandar; Hoffmann, Peter M.; Searson, Peter C.
err分享
err收藏
TSV Cu Plating and Implications for CMP
errelectronics
IF0
err2011-04-25
err1
PREAI
errRadisic, A.; Philipsen, H. G. G.; Honore, M.; Wang, Y. S.; Heylen, N.; El-Mekki, Z.; Armini, S.; Vandersmissen, K.; Rodet, S.; Van Ammel, A.; Bender, H.; Drijbooms, C.; Vanstreels, K.; Ruythooren, W.
err分享
err收藏
Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err41
PREAI
errArmini, S.; El-Mekki, Z.; Vandersmissen, K.; Philipsen, H.; Rodet, S.; Honore, M.; Radisic, A.; Civale, Y.; Beyne, E.; Leunissen, L.
err分享
err收藏
Structural characterization of through silicon vias
errJOURNAL OF MATERIALS SCIENCE
IF3.9
err2010-12-14
err5
PREAI
errBender, H.; Drijbooms, C.; Van Marcke, P.; Geypen, J.; Philipsen, H. G. G.; Radisic, A.
err分享
err收藏

研究方向

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合作学者
合作期刊
R
Richard D. Braatz
H 指数: 86 · 论文数: 865
P
Peter C. Searson
H 指数: 82 · 论文数: 497
C
Chris Van Hoof
H 指数: 68 · 论文数: 870
M
Marc Heyns
H 指数: 62 · 论文数: 1.0K
F
Frances M. Ross
H 指数: 57 · 论文数: 330
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