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Seong Su Kim

Korea Advanced Institute of Science and Technology

34H指数
222论文数
4.0K被引数
收录论文 81
发表时间
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Longevity of immune-response provided by at least one dose of vi-DT vaccine 5 years after vaccination among healthy Filipino adults and children接种至少一剂vi-DT疫苗后5年,健康菲律宾成人和儿童中由该疫苗提供的免疫应答持久性
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IF3.5
err2025-09-16
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errOAAI
errRejwana Haque Pial; Maria Rosario Capeding; Birkneh Tilahun Tadesse; Jean-Louis Excler; Katerina Rok Song; Eun Lyeong Park; Il-Yeon Park; Jae Seung Yang; Seongsu Kim; Eun Young Lee; Jagadeesh Reddy Eluru; Soo-Young Kwon; Sue Kyoung Jo; Ji Hwa Ryu; Ho Keun Park; Jong Hoon Shin; Seon-Young Yang; Deok Ryun Kim; Manki Song; T. Anh Wartel; Hee Soo Kim; Tarun Saluja; Sushant Sahastrabuddhe
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Aligned Carbon Nanotube Polymer Nanocomposite Bipolar Plates Technology for Vanadium Redox Flow Batteries对齐碳纳米管聚合物纳米复合材料双极板技术用于钒红ox液流电池
err2025-05-19
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errJae-Moon Jeong; Jingyao Dai; Luiz Acauan; Kwang Il Jeong; Jeonyoon Lee; Carina Xiaochen Li; Hyunsoo Hong; Brian L. Wardle; Seong Su Kim
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Enhancing Vanadium redox flow batteries performance through local compression ratio adjustment using stiffness gradient carbon felt electrodes
err2023-12-01
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PREAI
errJeong, Kwang Il; Lim, Su Hyun; Hong, Hyunsoo; Jeong, Jae-Moon; Kim, Won Vin; Kim, Seong Su
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Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements
err2023-08-03
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errOAAI
errPark, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su
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Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles
err2023-01-25
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errOAAI
errPark, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su
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