P. Markondeya Raj - Publications, H-index & Citations

P. Markondeya Raj

university system of georgia

23H指数

233论文数

2.2K被引数

收录论文 8

发表时间

Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules 基于玻璃基无源器件的5G新空口毫米波模块的封装集成与系统性能分析

ELECTRONICS

IF2.6

2025-04-20

OAAI

Ali, Muhammad; Watanabe, Atom; Kakutani, Takenori; Raj, Pulugurtha M.; Tummala, Rao. R.; Swaminathan, Madhavan

Wireless Fully Passive Package-Embedded Seismocardiogram With RF Backscattering 无线全无源封装-具有RF反向散射的嵌入式地震心动图

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

IF3

2023-09-01

PREAI

Sayeed, Sk Yeahia Been; Navaz, Hooman Vatan; Volakis, John L.; Raj, Pulugurtha Markondeya

Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications 面向5g应用的宽带和小型化封装天线 (AiP) 设计

IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS

IF4.8

2020-11-01

PREAI

Lin, Tong-Hong; Kanno, Kimiyuki; Watanabe, Atom O.; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Swaminathan, Madhavan; Tentzeris, Manos M.

Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

IF3

2020-01-01

PREAI

Sun, Teng; Sharma, Himani; Raj, P. Markondeya; Yoshihiro, Furukawa; Hachiya, Satoshi; Takemura, Keiji; Tummala, Rao

System Scaling With Nanostructured Power and RF Components

PROCEEDINGS OF THE IEEE

IF25.9

2017-12-01

PREAI

Raj, P. Markondeya; Sharma, Himani; Sitaraman, Srikrishna; Mishra, Dibyajat; Tummala, Rao

XPS depth profiling and leakage properties of anodized titania dielectrics and their application in high-density capacitors

JOURNAL OF MATERIALS SCIENCE

IF3.9

2015-08-06

PREAI

Chakraborti, Parthasarathi; Sharma, Himani; Pulugurtha, Markondeya Raj; Tummala, Rao

Polymers for RF Apps

IEEE MICROWAVE MAGAZINE

IF2.6

2011-12-01

PREAI

Swaminathan, Madhavan; Sundaram, Venky; Papapolymerou, John; Raj, P. Markondeya

Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors

JOURNAL OF THE AMERICAN CERAMIC SOCIETY

IF3.8

2010-04-12

PREAI

Raj, Pulugurtha Markondeya; Lee, Baik-Woo; Balaraman, Devarajan; Kang, Nam-Kee; Lance, Michael J.; Meyer, Harry; Tummala, Rao R.

研究方向