arrow
返回
G

G. S. Oehrlein

University System of Maryland

59H指数
369论文数
1.3W被引数
收录论文 43
发表时间
The 2022 Plasma Roadmap: low temperature plasma science and technology2022等离子体路线图: 低温等离子体科学与技术
err2022-07-05
err301
errOAAI
errAdamovich, I; Agarwal, S.; Ahedo, E.; Alves, L. L.; Baalrud, S.; Babaeva, N.; Bogaerts, A.; Bourdon, A.; Bruggeman, P. J.; Canal, C.; Choi, E. H.; Coulombe, S.; Donko, Z.; Graves, D. B.; Hamaguchi, S.; Hegemann, D.; Hori, M.; Kim, H-H; Kroesen, G. M. W.; Kushner, M. J.; Laricchiuta, A.; Li, X.; Magin, T. E.; Thagard, S. Mededovic; Miller, V; Murphy, A. B.; Oehrlein, G. S.; Puac, N.; Sankaran, R. M.; Samukawa, S.; Shiratani, M.; Simek, M.; Tarasenko, N.; Terashima, K.; Thomas, E., Jr.; Trieschmann, J.; Tsikata, S.; Turner, M. M.; van der Walt, I. J.; van de Sanden, M. C. M.; von Woedtke, T.
err分享
err收藏
err分享
err收藏
err分享
err收藏
Polishing parameter dependencies and surface oxidation of chemical mechanical polishing of Al thin films
err2019-12-06
err49
PREAI
errWrschka, P; Hernandez, J; Hsu, Y; Kuan, TS; Oehrlein, GS; Sun, HJ; Hansen, DA; King, J; Fury, MA
err分享
err收藏
Chemical mechanical polishing of Al and SiO2 thin films:: The role of consumables
err2019-12-06
err30
PREAI
errHernandez, J; Wrschka, P; Hsu, Y; Kuan, TS; Oehrlein, GS; Sun, HJ; Hansen, DA; King, J; Fury, MA
err分享
err收藏
err分享
err收藏
Editorial for achieving atomistic control in plasma-material interactions
err2017-11-15
err0
PREAI
errOehrlein, Gottlieb S.; Hamaguchi, Satoshi; Von Keudell, Achim
err分享
err收藏
The 2017 Plasma Roadmap: Low temperature plasma science and technology
err2017-07-14
err806
errOAAI
errAdamovich, I.; Baalrud, S. D.; Bogaerts, A.; Bruggeman, P. J.; Cappelli, M.; Colombo, V.; Czarnetzki, U.; Ebert, U.; Eden, J. G.; Favia, P.; Graves, D. B.; Hamaguchi, S.; Hieftje, G.; Hori, M.; Kaganovich, I. D.; Kortshagen, U.; Kushner, M. J.; Mason, N. J.; Mazouffre, S.; Thagard, S. Mededovic; Metelmann, H-R; Mizuno, A.; Moreau, E.; Murphy, A. B.; Niemira, B. A.; Oehrlein, G. S.; Petrovic, Z. Lj; Pitchford, L. C.; Pu, Y-K; Rauf, S.; Sakai, O.; Samukawa, S.; Starikovskaia, S.; Tennyson, J.; Terashima, K.; Turner, M. M.; van de Sanden, M. C. M.; Vardelle, A.
err分享
err收藏
Model polymer etching and surface modification by a time modulated RF plasma jet: role of atomic oxygen and water vapor
err2016-12-13
err38
PREAI
errLuan, P.; Knoll, A. J.; Wang, H.; Kondeti, V. S. S. K.; Bruggeman, P. J.; Oehrlein, G. S.
err分享
err收藏
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
err2016-09-08
err45
errOAAI
errMetzler, Dominik; Li, Chen; Engelmann, Sebastian; Bruce, Robert L.; Joseph, Eric A.; Oehrlein, Gottlieb S.
err分享
err收藏
err分享
err收藏