Tetsu Tanaka - Publications, H-index & Citations

Tetsu Tanaka

Tohoku University

37H指数

733论文数

7.0K被引数

收录论文 22

发表时间

Development of tentacle-shaped bone marrow neural probe enabling ultra-low invasive and high electrode density recording 触手状骨髓神经探针的开发，实现超低侵入和高电极密度记录

Japanese Journal of Applied Physics

IF1.8

2026-02-16

PREAI

Iwanuma, Naoki; Tsuji, Kazushi; Oba, Shutaro; Kitta, Keigo; Fukushima, Takafumi; Tanaka, Tetsu

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

japanese journal of radiology

IF1.8

2024-04-22

PREAI

Liu, Chang; Hoshi, Tadaaki; Shen, Jiayi; Shinoda, Atsushi; Kino, Hisashi; Tanaka, Tetsu; Fukushima, Takafumi

On-waferthermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization forthrough-siliconvia applications: Comparison toplasma-enhancedchemical vapor depositionSiO2

JOURNAL OF POLYMER SCIENCE

IF3.6

2020-07-08

OAAI

Fukushima, Takafumi; Murugesan, Mariappan; Bea, Ji-Cheol; Hashimoto, Hiroyuki; Kino, Hisashi; Tanaka, Tetsu; Koyanagi, Mitsumasa

Reduction of plasma glutathione in psychosis associated with schizophrenia and bipolar disorder in translational psychiatry

TRANSLATIONAL PSYCHIATRY

IF6.2

2017-08-22

OAAI

Nucifora, L. G.; Tanaka, T.; Hayes, L. N.; Kim, M.; Lee, B. J.; Matsuda, T.; Nucifora, F. C., Jr.; Sedlak, T.; Mojtabai, R.; Eaton, W.; Sawa, A.

Molecular signatures associated with cognitive deficits in schizophrenia: a study of biopsied olfactory neural epithelium

TRANSLATIONAL PSYCHIATRY

IF6.2

2016-10-11

OAAI

Horiuchi, Y.; Kondo, M. A.; Okada, K.; Takayanagi, Y.; Tanaka, T.; Ho, T.; Varvaris, M.; Tajinda, K.; Hiyama, H.; Ni, K.; Colantuoni, C.; Schretlen, D.; Cascella, N. G.; Pevsner, J.; Ishizuka, K.; Sawa, A.

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

MICROMACHINES

IF3

2016-10-10

OAAI

Fukushima, Takafumi; Hashiguchi, Hideto; Yonekura, Hiroshi; Kino, Hisashi; Murugesan, Mariappan; Bea, Ji-Chel; Lee, Kang-Wook; Tanaka, Tetsu; Koyanagi, Mitsumasa

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

PREAI

Fukushima, T.; Lee, K. W.; Tanaka, T.; Koyanagi, M.

Applications of three-dimensional LSI

MRS BULLETIN

IF4.9

2015-03-10

PREAI

Koyanagi, Mitsumasa; Fukushima, Takafumi; Lee, Kang-Wook; Tanaka, Tetsu

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2014-10-01

OAAI

Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen H.; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu

Nanocycles of Materials' Transport studied by in-situ Electron Microscopy and Diffraction

ELECTRON MICROSCOPY AND ANALYSIS GROUP CONFERENCE 2013 (EMAG2013)

IF0

2014-06-11

OAAI

Takayanagi, K.; Oshima, Y.; Lee, S.; Tanaka, T.; Tanishiro, Y.

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

MICROMACHINES

IF3

2011-02-18

OAAI

Fukushima, Takafumi; Konno, Takayuki; Iwata, Eiji; Kobayashi, Risato; Kojima, Toshiya; Murugesan, Mariappan; Bea, Ji-Chel; Lee, Kang-Wook; Tanaka, Tetsu; Koyanagi, Mitsumasa

Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2011-01-01

PREAI

Lee, K-W.; Bea, J-C.; Fukushima, T.; Tanaka, T.; Koyanagi, M.

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

APPLIED PHYSICS LETTERS

IF3.6

2010-04-15

PREAI

Fukushima, T.; Iwata, E.; Konno, T.; Bea, J. -C.; Lee, K. -W.; Tanaka, T.; Koyanagi, M.