Fengwen Mu - Publications, H-index & Citations

Fengwen Mu

wuhan university

26H指数

108论文数

2.2K被引数

收录论文 42

发表时间

Low-temperature-compatible interface engineering of SiC/diamond composite substrates with reduced thermal boundary resistance and microwave loss SiC/金刚石复合衬底低温兼容界面工程及其低热边界阻和微波损耗

Journal of Alloys and Compounds

IF6.3

2026-08-01

PREAI

Wu, Yaowen; Wang, Xinhua; Mu, Fengwen; Lei, Yipei; Yuan, Chao; Li, Yuan; Tian, Ye; Yang, Xu; Deng, Kexin; Cen, Lizhao; Jiang, Wenjing; Liu, Xinyu

Investigation on the High Temperature Stability and Potential Barrier of Si/Al2O3/Si bonded by Surface Activated Bonding Technology 基于表面激活键合技术制备的Si/Al₂O₃/Si结构的高温稳定性和势垒研究

Surfaces and Interfaces

IF6.3

2025-11-06

PREAI

Xiangjie Xing; Hongze Zhang; Xinhua Wang; Fengwen Mu; Xianghu Tan; Chao Guo; Tianqi Fang; Fuchao Liu; Sen Huang; Ke Wei; Xinyu Liu

Achieving over 90% transfer rate in lithium niobate thin films on diamond (LNOD) heterogeneous integration using surface-activated bonding 在金刚石（LNOD）异质集成中，通过表面激活键合实现超过90%的转移率。

Ceramics International

IF5.6

2025-07-19

PREAI

Tao You; Boqin Niu; Xiuhao Wu; Xiangjie Xing; Fengwen Mu; Shibin Zhang; Ke Wei; Xinyu Liu; Xinhua Wang; Weijun Luo

Enhancing and mapping thermal boundary conductance across bonded Si-SiC interface

APPLIED SURFACE SCIENCE

IF6.9

2025-02-01

OAAI

Guo, Rulei; Xu, Bin; Mu, Fengwen; Shiomi, Junichiro

Record-Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer 通过控制超薄异质非晶层在键合的GaN/金刚石界面处创纪录的低热边界电阻

ACTA MATERIALIA

IF9.3

2025-01-01

OAAI

Xu, Bin; Mu, Fengwen; Liu, Yingzhou; Guo, Rulei; Hu, Shiqian; Shiomi, Junichiro

Wafer-scale N-polar GaN heterogeneous structure fabricated by surface active bonding and laser lift-off

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2024-11-01

PREAI

Tian, Ye; Gao, Runhua; Wang, Xinhua; Mu, Fengwen; Xu, Peng; Ma, Guoliang; Yuan, Chao; Huang, Sen; Sun, Bing; Wei, Ke; Liu, Xinyu

Heterogeneous integration of thick GaN and polycrystalline diamond at room temperature through dynamic plasma polishing and surface-activated bonding

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2024-05-01

PREAI

Gao, Runhua; Wang, Xinhua; Mu, Fengwen; Li, Xiaojing; Wei, Chong; Zhou, Wu; Shi, Jin 'an; Tian, Ye; Xing, Xiangjie; Li, Hongyue; Huang, Sen; Jiang, Qimeng; Wei, Ke; Liu, Xinyu

Robust Thermal Transport across the Surface-Active Bonding SiC-on-SiC

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2024-04-10

PREAI

Ma, Guoliang; Xiao, Xinglin; Meng, Biwei; Ma, Yunliang; Xing, Xiangjie; Wang, Xinhua; Mu, Fengwen; Yuan, Chao

Thermal Transport Properties of β-Ga2O3 Thin Films on Si and SiC Substrates Fabricated by an Ion-Cutting Process

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2024-02-27

PREAI

Xu, Wenhui; Zhao, Tiancheng; Zhang, Lianghui; Liu, Kang; Sun, Huarui; Qu, Zhenyu; You, Tiangui; Yi, Ailun; Huang, Kai; Han, Genquan; Mu, Fengwen; Suga, Tadatomo; Ou, Xin; Hao, Yue

Rapid Growth of High-Purity 3C-SiC Crystals Using a SiC-Saturated Si-Pr-C Solution

CRYSTAL GROWTH & DESIGN

IF3.4

2024-01-17

PREAI

Deng, Huan; Lei, Minpeng; Ma, Wenhui; Guo, Chao; Mu, Fengwen; Lei, Yun

Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology

SCIENCE CHINA-INFORMATION SCIENCES

IF7.6

2023-10-20

PREAI

Shi, Hangning; Yi, Ailun; Ding, Jiaxin; Liu, Xudong; Qin, Qingcheng; Yi, Juemin; Hu, Junjie; Wang, Miao; Cai, Demin; Wang, Jianfeng; Xu, Ke; Mu, Fengwen; Suga, Tadatomo; Heller, Rene; Wang, Mao; Zhou, Shengqiang; Xu, Wenhui; Huang, Kai; You, Tiangui; Ou, Xin

Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration 具有自组装单层的cu-cu热压键合作为3D/2.5D系统集成的氧化保护

MICROMACHINES

IF3

2023-06-30

OAAI

Lykova, Maria; Panchenko, Iuliana; Schneider-Ramelow, Martin; Suga, Tadatomo; Mu, Fengwen; Buschbeck, Roy

Promising Approach for Rapid Growth of High-Quality SiC Crystals Using Si-Nd-C Solutions

CRYSTAL GROWTH & DESIGN

IF3.4

2023-06-20

PREAI

Li, Peng; Lei, Minpeng; Ma, Wenhui; Guo, Chao; Mu, Fengwen; Lei, Yun

ReS2 on GaN Photodetector Using H+ Ion-Cut Technology

ACS OMEGA

IF4.3

2022-12-20

OAAI

Liu, Xinke; Zhou, Jie; Luo, Jiangliu; Shi, Hangning; You, Tiangui; Ou, Xin; Botcha, Venkatadivakar; Mu, Fengwen; Suga, Tadatomo; Wang, Xinzhong; Huang, Shuangwu

A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2022-06-01

OAAI

Mu, Fengwen; Xu, Bin; Wang, Xinhua; Gao, Runhua; Huang, Sen; Wei, Ke; Takeuchi, Kai; Chen, Xiaojuan; Yin, Haibo; Wang, Dahai; Yu, Jiahan; Suga, Tadatomo; Shiomi, Junichiro; Liu, Xinyu

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance (vol 13, pg 31843, 2021)

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2022-05-09

PREAI

Cheng, Zhe; Mu, Fengwen; Ji, Xiaoyang; You, Tiangui; Xu, Wenhui; Suga, Tadatomo; Ou, Xin; Cahill, David G.; Graham, Samuel

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

MATERIALS

IF3.2

2022-03-30

OAAI

Meng, Ying; Gao, Runhua; Wang, Xinhua; Huang, Sen; Wei, Ke; Wang, Dahai; Mu, Fengwen; Liu, Xinyu

Thermodynamics of Ion-Cutting of β-Ga2O3 and Wafer-Scale Heterogeneous Integration of a β-Ga2O3 Thin Film onto a Highly Thermal Conductive SiC Substrate

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2021-12-28

PREAI

Xu, Wenhui; You, Tiangui; Mu, Fengwen; Shen, Zhenghao; Lin, Jiajie; Huang, Kai; Zhou, Min; Yi, Ailun; Qu, Zhenyu; Suga, Tadatomo; Han, Genquan; Ou, Xin

Efficient thermal dissipation in wafer-scale heterogeneous integration of single-crystalline β-Ga2O3 thin film on SiC

FUNDAMENTAL RESEARCH

IF6.3

2021-11-01

OAAI

Xu, Wenhui; You, Tiangui; Wang, Yibo; Shen, Zhenghao; Liu, Kang; Zhang, Lianghui; Sun, Huarui; Qian, Ruijie; An, Zhenghua; Mu, Fengwen; Suga, Tadatomo; Han, Genquan; Ou, Xin; Hao, Yue; Wang, Xi

Development of a numerical model for simulating stress corrosion cracking in spent nuclear fuel canisters (vol 5, 53, 2021)

NPJ MATERIALS DEGRADATION

IF7.6

2021-10-05

OAAI

Wu, Xin; Mu, Fengwen; Gordon, Scott; Olson, David; Liu, Stephen; Shayer, Zeev; Yu, Zhenzhen

研究方向