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C

Christophe Morales

CEA

16H指数
111论文数
1.0K被引数
收录论文 6
发表时间
Adhesion energy and bonding wave velocity measurements
err2016-08-24
err10
PREAI
errLarrey, V.; Mauguen, G.; Fournel, F.; Radisson, D.; Rieutord, F.; Morales, C.; Bridoux, C.; Moriceau, H.
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Thin layer transfer using room temperature wafer-level bonding process
err2016-08-24
err0
PREAI
errAbadie, Karine; Fournel, Frank; Morales, Christophe; Moriceau, Hubert; Wimplinger, Markus
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Impact Of Water Edge Absorption On Silicon Oxide Direct Bonding Energy
err2016-08-24
err1
PREAI
errFournel, F.; Tedjini, M.; Larrey, V.; Rieutord, F.; Morales, C.; Bridoux, C.; Moriceau, H.
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Fabrication of Buckling Free Ultrathin Silicon Membranes by Direct Bonding with Thermal Difference
err2015-03-25
err7
PREAI
errDelachat, Florian; Constancias, Christophe; Fournel, Frank; Morales, Christophe; Le Drogoff, Boris; Chaker, Mohamed; Margot, Joelle
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H2O Diffusion Barriers at Si-Si Direct Bonding Interfaces for Low Temperature Anneals
err2011-01-01
err6
PREAI
errMoriceau, H.; Rieutord, F.; Libralesso, L.; Ventosa, C.; Fournel, F.; Morales, C.; Mc Cormick, T.; Chevolleau, T.; Radu, I.
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Prebonding Thermal Treatment in Direct Si-Si Hydrophilic Wafer Bonding
err2009-01-01
err15
PREAI
errVentosa, C.; Rieutord, F.; Libralesso, L.; Fournel, F.; Morales, C.; Moriceau, H.
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