Kari Schjølberg‐Henriksen

SINTEF

13H指数

66论文数

549被引数

收录论文 6

发表时间

Texture of Al films for wafer-level thermocompression bonding

SUPERLATTICES AND MICROSTRUCTURES

IF3.3

2017-06-01

OAAI

Malik, Nishant; Venkatachalapathy, Vishnukanthan; Dall, Wilhelm; Schjolberg-Henriksen, Kari; Poppe, Erik; Taklo, Maaike M. Visser; Finstad, Terje G.

Low-Temperature Aluminum-Aluminum Wafer Bonding

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14

IF0

2016-08-24

OAAI

Rebhan, B.; Hinterreiter, A.; Malik, N.; Schjolberg-Henriksen, K.; Dragoi, V.; Hingerl, K.

Al-Al thermocompression bonding for wafer-level MEMS sealing

SENSORS AND ACTUATORS A-PHYSICAL

IF4.9

2014-05-01

OAAI

Malik, N.; Schjolberg-Henriksen, K.; Poppe, E.; Taklo, M. M. Visser; Finstad, T. G.

Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing

IEEE SENSORS JOURNAL

IF4.5

2008-09-01

PREAI

Schjolberg-Henriksen, Kari; Schulz, Olaf; Ferber, Alain; Moe, Sigurd; Lloyd, Martin; Mueller, Gerhard; Suphan, Karl-Heinz; Wang, Dag T.; Bernstein, Ralph W.

High-resolution pressure sensor for photo acoustic gas detection 用于光声气体检测的高分辨率压力传感器

SENSORS AND ACTUATORS A-PHYSICAL

IF4.9

2006-11-01

PREAI

Schjolberg-Henriksen, K.; Wang, D. T.; Rogne, H.; Ferber, A.; Vogl, A.; Moe, S.; Bernstein, R.; Lapadatu, D.; Sandven, K.; Brida, S.

Capacitive differential pressure sensor for harsh environments

SENSORS AND ACTUATORS A-PHYSICAL

IF4.9

2000-05-01

PREAI

Moe, ST; Schjolberg-Henriksen, K; Wang, DT; Lund, E; Nysæther, J; Furuberg, L; Visser, M; Fallet, T; Bernstein, RW

研究方向