Y.C. Chan - Publications, H-index & Citations

Y.C. Chan

National Chung Hsing University

32H指数

142论文数

2.9K被引数

收录论文 12

发表时间

Enhanced Light Extraction and Electrical Properties in Ultraviolet-C AlGaN Light-Emitting Diodes with Porous Hole-Array Patterns

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2024-12-23

PREAI

Yu, Shum-Ming; Chan, Yu-Jui; Cheng, Yi-Sin; Chen, Yen Da; Kao, Yu-Cheng; Chen, Kuei-Ting; Chen, Hsiang; Lin, Yung-Sen; Han, Jung; Lin, Chia-Feng

Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2016-11-01

OAAI

Chen, Guang; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y. C.; Liu, Changqing; Wu, Fengshun

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2016-07-01

PREAI

Li, Yi; Luo, Kaiming; Lim, Adeline B. Y.; Chen, Zhong; Wu, Fengshun; Chan, Y. C.

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2015-10-01

108

PREAI

Li, Yi; Chan, Y. C.

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2014-05-01

121

PREAI

Xu, Sha; Chan, Yan Cheong; Zhang, Kaili; Yung, K. C.

Synthesis and characterization of multicomponent Cu2(FexZn1-x)SnS4 nanocrystals with tunable band gap and structure

JOURNAL OF MATERIALS CHEMISTRY A

IF9.5

2013-01-01

PREAI

Huang, Chun; Chan, Yan; Liu, Fangyang; Tang, Ding; Yang, Jia; Lai, Yanqing; Li, Jie; Liu, Yexiang

Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2011-02-01

PREAI

Gain, Asit Kumar; Fouzder, Tama; Chan, Y. C.; Yung, Winco K. C.

The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature

JOURNAL OF MATERIALS SCIENCE

IF3.9

2007-08-01

PREAI

Ma, Y.; Chan, Y. C.

Electric current effect on microstructure of ball grid array solder joint

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2005-04-01

PREAI

Wu, BY; Chan, YC

Effect of 0.5 wt% Cu in Sn-3.5%Ag solder balls on the solid state interfacial reaction with Au/Ni/Cu bond pads for ball grid array (BGA) applications

CHEMISTRY OF MATERIALS

IF7

2005-03-29

PREAI

Alam, M; Chan, YC; Tu, KN; Kivilahti, JK

Electronic structures of polycrystalline ZnO thin films probed by electron energy loss spectroscopy

APPLIED PHYSICS LETTERS

IF3.6

2000-09-04

PREAI

Ong, HC; Dai, JY; Hung, KC; Chan, YC; Chang, RPH; Ho, ST

A new protective AlN film for organic photoconductors

APPLIED PHYSICS LETTERS

IF3.6

1997-07-14

PREAI

Miao, XS; Chan, YC; Pun, EYB

研究方向