Wouter Ruythooren - Publications, H-index & Citations

Wouter Ruythooren

interuniversity microelectronics centre

26H指数

117论文数

2.5K被引数

收录论文 5

发表时间

TSV Cu Plating and Implications for CMP

electronics

IF0

2011-04-25

PREAI

Radisic, A.; Philipsen, H. G. G.; Honore, M.; Wang, Y. S.; Heylen, N.; El-Mekki, Z.; Armini, S.; Vandersmissen, K.; Rodet, S.; Van Ammel, A.; Bender, H.; Drijbooms, C.; Vanstreels, K.; Ruythooren, W.

Monitoring the Superfilling of Blind Holes with Electrodeposited Copper 用电沉积铜监测盲孔的超填充

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2010-01-01

PREAI

Luhn, O.; Radisic, A.; Van Hoof, C.; Ruythooren, W.; Celis, J. -P.

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

ELECTROCHIMICA ACTA

IF5.6

2009-03-01

104

PREAI

Luehn, O.; Van Hoof, C.; Ruythooren, W.; Celis, J. -P.

The role of Al on Ohmic contact formation on n-type GaN and AlGaN/GaN -: art. no. 061908

APPLIED PHYSICS LETTERS

IF3.6

2005-08-02

103

PREAI

Van Daele, B; Van Tendeloo, G; Ruythooren, W; Derluyn, J; Leys, MR; Germain, M

Microstructural investigation of Co-P by TEM

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2004-01-01

PREAI

Ruythooren, W; De Boeck, J; Celis, JP

研究方向