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Liqiang Cao

Chinese Academy of Sciences

25H指数
257论文数
2.6K被引数
收录论文 38
发表时间
Review of Die-Attach Materials for SiC High-Temperature PackagingSiC高温封装芯片连接材料综述
err2024-10-01
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PREAI
errHou, Fengze; Sun, Zhanxing; Su, Meiying; Fan, Jiajie; You, Xiangan; Li, Jun; Wang, Qidong; Cao, Liqiang; Zhang, Guoqi
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A Broadband Antenna Array With HDI Technology-Loaded Multilayer Parasitic Patches in W-BandW波段HDI技术加载多层寄生贴片的宽带天线阵
err2024-08-01
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PREAI
errGan, Hanchen; Zhou, Yunyan; Lan, Siqi; Gan, Pei; Zhang, Wenwen; Yang, Chenlin; Song, Gang; Lei, Bo; Cao, Liqiang
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Heat transfer performance study of fluid rotating microchannel heat sink
err2024-06-01
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errOAAI
errFan, Yu; Chen, Chuan; Fu, Rong; Wang, Qidong; Cao, Liqiang; Chen, Xinhua; Su, Meiying; Zhou, Yikang; Bu, Weihai; Zheng, Kai; Kang, Jin
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Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors
err2023-12-23
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errOAAI
errSong, Yunqian; Chen, Chuan; Wang, Qidong; Feng, Jianyu; Fu, Rong; Zhang, Xiaobin; Cao, Liqiang
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Facile Preparation of Monodisperse Cu@Ag Core-Shell Nanoparticles for Conductive Ink in Printing Electronics
err2023-06-27
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errOAAI
errLi, Gang; Yu, Xuecheng; Zhang, Ruoyu; Ouyang, Qionglin; Sun, Rong; Cao, Liqiang; Zhu, Pengli
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Performance of novel VUV-sensitive Silicon Photo-Multipliers for nEXO
err2022-12-13
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errOAAI
errGallina, G.; Guan, Y.; Retiere, F.; Cao, G.; Bolotnikov, A.; Kotov, I.; Rescia, S.; Soma, A. K.; Tsang, T.; Darroch, L.; Brunner, T.; Bolster, J.; Cohen, J. R.; Franco, T. Pinto; Gillis, W. C.; Smalley, H. Peltz; Thibado, S.; Pocar, A.; Bhat, A.; Jamil, A.; Moore, D. C.; Adhikari, G.; Kharusi, S. Al; Angelico, E.; Arnquist, I. J.; Arsenault, P.; Badhrees, I.; Bane, J.; Belov, V.; Bernard, E. P.; Bhatta, T.; Breur, P. A.; Brodsky, J. P.; Brown, E.; Caden, E.; Cao, L.; Chambers, C.; Chana, B.; Charlebois, S. A.; Chernyak, D.; Chiu, M.; Cleveland, B.; Collister, R.; Cvitan, M.; Dalmasson, J.; Daniels, T.; Deslandes, K.; DeVoe, R.; di Vacri, M. L.; Ding, Y.; Dolinski, M. J.; Dragone, A.; Echevers, J.; Eckert, B.; Elbeltagi, M.; Fabris, L.; Fairbank, W.; Farine, J.; Fu, Y. S.; Gallacher, D.; Gautam, P.; Giacomini, G.; Gingras, C.; Goeldi, D.; Gornea, R.; Gratta, G.; Hardy, C. A.; Hedges, S.; Heffner, M.; Hein, E.; Holt, J.; Hoppe, E. W.; Hoessl, J.; House, A.; Hunt, W.; Iverson, A.; Jiang, X. S.; Karelin, A.; Kaufman, L. J.; Kruecken, R.; Kuchenkov, A.; Kumar, K. S.; Larson, A.; Leach, K. G.; Lenardo, B. G.; Leonard, D. S.; Lessard, G.; Li, G.; Li, S.; Li, Z.; Licciardi, C.; Lindsay, R.; MacLellan, R.; Mahtab, M.; Majidi, S.; Malbrunot, C.; Margetak, P.; Martel-Dion, P.; Martin, L.; Masbou, J.; Massacret, N.; McMichael, K.; Mong, B.; Murray, K.; Nattress, J.; Natzke, C. R.; Ngwadla, X. E.; Ondze, J. C. Nzobadila; Odian, A.; Orrell, J. L.; Ortega, G. S.; Overman, C. T.; Parent, S.; Perna, A.; Piepke, A.; Pletskova, N.; Pratte, J. F.; Radeka, V.; Raguzin, E.; Ramonnye, G. J.; Rao, T.; Rasiwala, H.; Raymond, K.; Rebeiro, B. M.; Richardson, G.; Ringuette, J.; Riot, V.; Rossignol, T.; Rowson, P. C.; Rudolph, L.; Saldanha, R.; Sangiorgio, S.; Shang, X.; Spadoni, F.; Stekhanov, V.; Sun, X. L.; Tidball, A.; Totev, T.; Triambak, S.; Tsang, R. H. M.; Tyuka, O. A.; Vachon, F.; Vidal, M.; Viel, S.; Visser, G.; Wagenpfeil, M.; Walent, M.; Wamba, K.; Wang, Q.; Wang, W.; Wang, Y.; Watts, M.; Wei, W.; Wen, L. J.; Wichoski, U.; Wilde, S.; Worcester, M.; Wu, W. H.; Wu, X.; Xie, L.; Yan, W.; Yang, H.; Yang, L.; Zeldovich, O.; Zhao, J.; Ziegler, T.
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Research on 3D optical Module Integrating Edge Coupler and TSV
err2022-09-15
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PREAI
errZheng, Qi; Yang, Peng; Xue, Haiyun; He, Huimin; Cao, Rui; Dai, Fengwei; Sun, Siwei; Liu, Fengman; Wang, Qidong; Cao, Liqiang; Chen, Lijun; Sun, Xuyan; Sun, Peng
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Case-embedded cooling for high heat flux microwave multi-chip array高热流微波多芯片阵列的嵌入式外壳冷却
err2022-09-01
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PREAI
errSong, Yunqian; Fu, Rong; Chen, Chuan; Wang, Qidong; Su, Meiying; Hou, Fengze; Zhang, Xiaobin; Li, Jun; Cao, Liqiang
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Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process多管芯扇出晶圆级封装工艺翘曲研究
err2022-02-23
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errOAAI
errChen, Chuan; Su, Meiying; Ma, Rui; Zhou, Yunyan; Li, Jun; Cao, Liqiang
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Energy recovery linac based fully coherent light source
err2021-12-13
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errOAAI
errZhao, Z. T.; Wang, Z.; Feng, C.; Chen, S.; Cao, L.
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