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科言猫学术研究的AI总结
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L

L.P. Lehman

state university of new york (suny) system

15H指数
36论文数
1.6K被引数
收录论文 3
发表时间
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Pb-free solder:: New materials considerations for microelectronics processing
errMRS BULLETIN
IF4.9
err2011-01-31
err52
PREAI
errBorgesen, Peter; Bieler, Thomas; Lehman, L. P.; Cotts, E. J.
err分享
err收藏
Cyclic twin nucleation in tin-based solder alloys
errACTA MATERIALIA
IF9.3
err2010-06-01
err196
PREAI
errLehman, L. P.; Xing, Y.; Bieler, T. R.; Cotts, E. J.
err分享
err收藏
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
errACTA MATERIALIA
IF9.3
err2007-05-01
err110
PREAI
errPark, Seungbae; Dhakal, Ramji; Lehman, Lawrence; Cotts, Eric
err分享
err收藏

研究方向

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合作学者
合作期刊
T
Thomas R. Bieler
H 指数: 61 · 论文数: 343
P
Peter Børgesen
H 指数: 32 · 论文数: 278
E
E. J. Cotts
H 指数: 30 · 论文数: 162
S
Seungbae Park
H 指数: 29 · 论文数: 193
Y
Yan Xing
H 指数: 25 · 论文数: 87
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