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P

Peter Børgesen

Binghamton University

32H指数
278论文数
3.8K被引数
收录论文 15
发表时间
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Deformation and damage properties of low temperature SnAgCu-Bi-Sb solder joints低温SnAgCu-Bi-Sb焊点的变形与损伤特性
errInternational Journal of Mechanical Sciences
IF9.4
err2026-01-13
err0
PREAI
errRonit Das; Atif Mahmood; Sai Kiran Reddy Munnangi; Anola Semndili; Sanoop Thekkut; Jones Assiedu; Shantanu Joshi; Gaurav Sharma; Peter Borgesen
err分享
err收藏
Mechanistic understanding of microstructure evolution in extrusion-based additive manufacturing of stainless steel using modeling, simulation, and experimental analysis使用建模，模拟和实验分析对基于挤压的不锈钢增材制造中微观结构演变的机理理解
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2025-03-01
err0
PREAI
errJiang, Dayue; Zhou, Yue; Poliks, Mark D.; Borgesen, Peter; Ning, Fuda
err分享
err收藏
Post-annealing of hybrid SAC305-SnBi solder joints formed with a 150 °C reflow to improve fatigue resistance采用150 °C再流焊形成的混合SAC305-SnBi焊点的后热处理以提高疲劳抗力
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-02-14
err0
PREAI
errDas, Ronit; Mahmood, Atif; Thekkut, Sanoop; Munnangi, Sai Kiran Reddy; Semndili, Anola; Sivasubramony, Rajesh Sharma; Yadav, Manu; Assiedu, Jones; Gharaibeh, Mohammad A.; Arroyo, Carlos; Sharma, Gaurav; Borgesen, Peter
err分享
err收藏
Influence of pH on Indium Deposition Rates: A Comprehensive Electrochemical Analysis
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2025-01-24
err0
errOAAI
errPasha, A. F.; Larson, Z. I.; Borgesen, P.; Dimitrov, N.
err分享
err收藏
All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2024-08-01
err3
PREAI
errNjuki, Michael; Pasha, Abdullah Faisal; Das, Ronit; Borgesen, Peter; Dimitrov, Nikolay
err分享
err收藏
High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2024-06-01
err1
PREAI
errAlshatnawi, Firas; Enakerakpo, Emuobosan; Alhendi, Mohammed; Abdelatty, Mohamed; Umar, Ashraf; Al-Haidari, Riadh; Shaddock, David; Hoel, Cathleen; Boyd, Linda; Poliks, Mark; Borgesen, Peter
err分享
err收藏
Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-01-05
err1
PREAI
errLei, Zhen; Borgesen, Peter; Dimitrov, Nikolay
err分享
err收藏
Electrical and Mechanical Behavior of Aerosol Jet-Printed Gold on Alumina Substrate for High-Temperature Applications用于高温应用的气溶胶喷射印刷在氧化铝基材上的金的电气和机械性能
errADVANCED ENGINEERING MATERIALS
IF3.3
err2023-07-28
err5
errOAAI
errAlshatnawi, Firas; Alhendi, Mohammed; Abbara, El Mehdi; Sivasubramony, Rajesh; Garakani, Behnam; Enakerakpo, Emuobosan; Shaddock, David; Stoffel, Nancy; Hoel, Cathleen; Poliks, Mark D.; Borgesen, Peter
err分享
err收藏
Enhanced voiding in Cu-Sn micro jointsCu-sn微接头的增强空隙
errMATERIALS RESEARCH BULLETIN
IF5.7
err2022-06-01
err11
PREAI
errNjuki, M.; Thekkut, S.; Sivasubramony, R.; Greene, C. M.; Shahane, N.; Thompson, P.; Mirpuri, K.; Borgesen, P.; Dimitrov, N.
err分享
err收藏
Assessing Current-Carrying Capacity of Aerosol Jet Printed Conductors
errADVANCED ENGINEERING MATERIALS
IF3.3
err2020-07-08
err27
PREAI
errAlhendi, Mohammed; Sivasubramony, Rajesh S.; Weerawarne, Darshana L.; Iannotti, Joseph; Borgesen, Peter; Poliks, Mark D.
err分享
err收藏
Multiscale modeling of Thermoelectric Generators for conversion performance enhancement
errINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF5.8
err2015-02-01
err14
PREAI
errZhou, Siyi; Sammakia, Bahgat G.; White, Bruce; Borgesen, Peter; Chen, Cheng
err分享
err收藏
Hybrid Method for Metallization of Glass Interposers
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2013-11-23
err22
PREAI
errOgutu, P.; Fey, E.; Borgesen, P.; Dimitrov, N.
err分享
err收藏
Multiscale modeling of thermoelectric generators for the optimized conversion performance热电发电机的多尺度建模，以优化转换性能
errINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF5.8
err2013-07-01
err36
PREAI
errZhou, Siyi; Sammakia, Bahgat G.; White, Bruce; Borgesen, Peter
err分享
err收藏
Pb-free solder:: New materials considerations for microelectronics processing
errMRS BULLETIN
IF4.9
err2011-01-31
err52
PREAI
errBorgesen, Peter; Bieler, Thomas; Lehman, L. P.; Cotts, E. J.
err分享
err收藏
Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2010-01-01
err34
PREAI
errWafula, F.; Liu, Y.; Yin, L.; Bliznakov, S.; Borgesen, P.; Cotts, E. J.; Dimitrov, N.
err分享
err收藏

研究方向

暂无研究方向
合作学者
合作期刊
T
Thomas R. Bieler
H 指数: 61 · 论文数: 343
F
Fuda Ning
H 指数: 38 · 论文数: 107
B
Bahgat Sammakia
H 指数: 36 · 论文数: 451
L
Liang Yin
H 指数: 34 · 论文数: 213
N
Nikolay Dimitrov
H 指数: 33 · 论文数: 210
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