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Yi-Da Tsai

National Tsing Hua University

9H指数
29论文数
222被引数
收录论文 12
发表时间
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Flexible Low-Loss Thin Flimsy Stripline for High-Speed Connections
errMICROMACHINES
IF3
err2022-12-14
err1
errOAAI
errLin, Jau-, Jr.; Tsai, Yi-Da
err分享
err收藏
Inhibition of Human Bladder Cancer Growth by a Suicide Gene Delivered by JC Polyomavirus Virus-like Particles in a Mouse Model
errJOURNAL OF UROLOGY
IF6.8
err2015-06-01
err14
PREAI
errFang, Chiung-Yao; Tsai, Yi-Da; Lin, Mien-Chun; Wang, Meilin; Chen, Pei-Lain; Chao, Chun-Nun; Huang, Yih-Leh; Chang, Deching; Shen, Cheng-Huang
err分享
err收藏
A study on the key factors affecting the sensibility of bismuth deposits toward Sn2+: Effects of bismuth microstructures on the Sn2+ pre-deposition
errELECTROCHIMICA ACTA
IF5.6
err2013-08-01
err8
PREAI
errLien, Chien-Hung; Hu, Chi-Chang; Chang, Kuo-Hsin; Tsai, Yi-Da; Wang, David Shan-Hill
err分享
err收藏
Angiogenesis
errJOURNAL OF NEUROSURGERY
IF3.6
err2013-04-01
err0
PREAI
errTsai, Yi-Da; Chiu, Sung-Hua; Lo, Yuan-Hung; Yeh, Po-Kuang; Lai, Yuan-Wei; Tsai, Yi-Ling; Hueng, Dueng-Yuan
err分享
err收藏
Preferred Orientation Control of Bi Deposits Using Experimental Strategies
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2012-01-01
err12
PREAI
errLien, Chien-Hung; Hu, Chi-Chang; Tsai, Yi-Da; Wang, David Shan-Hill
err分享
err收藏
Effects of polyethylene glycol and gelatin on the crystal size, morphology, and Sn2+-sensing ability of bismuth deposits
errELECTROCHIMICA ACTA
IF5.6
err2011-09-01
err32
PREAI
errTsai, Yi-Da; Lien, Chein-Hung; Hu, Chi-Chang
err分享
err收藏
Composition and Microstructure Control of Tin-Bismuth Alloys in the Pulse Plating Process
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-06-02
err18
PREAI
errTsai, Yi-Da; Hu, Chi-Chang
err分享
err收藏
Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err7
PREAI
errTsai, Yi-Da; Yu, Chi-Yang; Hu, Chi-Chang; Duh, Jenq-Gong
err分享
err收藏
Composition Control of the Eutectic Sn-Based Alloys: Sn-Ag, Sn-Cu, Sn-Ag-Cu, From Simple Plating Baths
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2011-01-01
err6
errOAAI
errTsai, Yi-Da; Hu, Chi-Chang
err分享
err收藏
Composition Control of Lead-Free Sn-Bi Deposits Using Experimental Strategies
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err22
PREAI
errTsai, Yi-Da; Hu, Chi-Chang
err分享
err收藏
Composition Control of Sn-Bi Deposits: Interactive Effects of Citric Acid, Ethylenediaminetetraacetic Acid, and Poly(ethylene glycol)
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2009-01-01
err32
errOAAI
errTsai, Yi-Da; Hu, Chi-Chang
err分享
err收藏
Electrodeposition of Sn-Bi lead-free solders: Effects of complex agents on the composition, adhesion, and dendrite formation
errELECTROCHIMICA ACTA
IF5.6
err2007-12-01
err63
PREAI
errTsai, Yi-Da; Hu, Chi-Chang; Lin, Chi-Cheng
err分享
err收藏

研究方向

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合作学者
合作期刊
C
Chi‐Chang Hu
H 指数: 78 · 论文数: 481
J
Jenq‐Gong Duh
H 指数: 52 · 论文数: 473
K
Kuo‐Hsin Chang
H 指数: 41 · 论文数: 133
D
Dueng‐Yuan Hueng
H 指数: 31 · 论文数: 222
M
Meilin Wang
H 指数: 27 · 论文数: 94
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