科言猫
学术研究的AI总结
首页
文献互助
订阅
我的收藏
科研工具
选题分析
论文总结
专利管理
未登录
返回
K
K. N. Subramanian
michigan state university
42
H指数
205
论文数
5.8K
被引数
0
相关解读
订阅
收录论文
5
发表时间
发表时间
IF
被引数
Thermo-mechanical behavior of three-phase shape memory polymers for a wide temperature change
三相形状记忆聚合物在宽温度变化范围内的热-机械行为
Mechanics of Materials
IF
4.1
2025-07-09
0
PRE
AI
Suyeong Jin; Gunho Kim; Seola Lee; Kamakshi Subramanian; Jung-Wuk Hong; Chiara Daraio
分享
收藏
Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
JOURNAL OF ALLOYS AND COMPOUNDS
IF
6.3
2016-02-01
21
PRE
AI
Ma, Limin; Zuo, Yong; Liu, Sihan; Guo, Fu; Lee, Andre; Subramanian, K. N.
分享
收藏
Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150 °C
APPLIED PHYSICS LETTERS
IF
3.6
2007-07-10
15
PRE
AI
Ho, C. E.; Lee, A.; Subramanian, K. N.; Liu, W.
分享
收藏
Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2003-06-01
83
PRE
AI
Guo, F; Choi, S; Subramanian, KN; Bieler, TR; Lucas, JP; Achari, A; Paruchuri, M
分享
收藏
Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2000-06-01
57
PRE
AI
McDougall, J; Choi, S; Bieler, TR; Subramanian, KN; Lucas, JP
分享
收藏
研究方向
暂时未获取到该数据
合作学者
合作期刊
C
Chiara Daraio
H 指数: 71 · 论文数: 412
T
Thomas R. Bieler
H 指数: 61 · 论文数: 343
C
Cheng–En Ho
H 指数: 31 · 论文数: 142
F
Fu Guo
H 指数: 28 · 论文数: 196
J
J. P. Lucas
H 指数: 27 · 论文数: 49
查看更多